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The TEC1-04905 is a high-performance, miniature semiconductor cooling module with high cooling power density. Measuring just 20 × 20 mm, it offers three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Generation Product Drawing
🔷Thermoelectric Generator Modules Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-04905 | K10 | 60 | 0.9 | 5.8 | 5.0 | 29 | 20×20×3.4 |
| TEC1-04905 | K12 | 65 | 0.9 | 5.8 | 5.0 | 29 | 20×20×3.6 |
| TEC1-04905 | K14 | 70 | 0.9 | 5.8 | 5.0 | 29 | 20×20×3.8 |
🔷Thermo Cooler Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 22 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Heater Performance Curve
🔷TEC Peltier Product Overview
The TEC1-04905 is a high-performance, miniature semiconductor cooling module with high cooling power density. Measuring just 20 × 20 mm, it offers three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). This product has a maximum voltage of 5.8 V, a maximum current of 5.0 A, a maximum cooling power of 29 W, and an internal resistance of only 0.9 Ω. Its low voltage, high current, and high power density make it an ideal choice for applications with extremely limited space but high cooling demands. Compared to the similarly sized TEC1-07103 (3.0A/25W) and TEC1-07102 (2.2A/18W), the TEC1-04905 achieves a cooling power of up to 29W within a 20×20mm area, demonstrating a significant advantage in power density.
🔷TEC Module Product Features
1. High Current and High Power for Powerful Cooling
With a maximum current of 5.0A and a maximum power of 29W, this product achieves extremely high cooling capacity per unit area despite its compact 20×20mm size, making it ideal for compact devices with high thermal loads. The maximum temperature difference reaches up to 70°C, offering superior cooling performance compared to most similar products.
2. Flexible Selection of Multiple Chip Types
Three chip types are available—K10, K12, and K14—allowing users to choose flexibly based on target temperature difference and cost requirements: K10 is suitable for general cooling (60°C), K14 for deep cooling (70°C), and K12 for intermediate cooling (65°C), covering application needs ranging from standard to high-end.
3. Low Internal Resistance, High Energy Efficiency
With an internal resistance of just 0.9 Ω—significantly lower than comparable products (e.g., the TEC1-07103 at 2.18 Ω)—it generates less Joule heating at the same current. More electrical energy is converted into effective cooling capacity, resulting in a higher coefficient of performance (COP).
4. Ultra-Compact, Space-Saving Design
With a 20×20 mm package size and a thickness as slim as 3.4 mm, it can be easily integrated into microdevices, compact optical engines, or portable instruments, meeting the demand for miniaturized integration.
5. High-Quality Substrate and Heat Dissipation Structure
The substrate is manufactured using a sintering process that combines 96% aluminum oxide ceramic (0.76 mm) and oxygen-free copper (0.4 mm), offering high thermal conductivity, high electrical insulation, and excellent mechanical strength, ensuring efficient heat transfer between the chip and the heat sink surface.
6. Thick-Gauge Leads for High Current Carrying Capacity
Standard 22 AWG silicone-coated leads (100 mm in length) feature a thick gauge and high current-carrying capacity, safely handling a 5.0 A operating current while remaining flexible for easy routing.
7. Reliable Sealing and Eco-Friendly Manufacturing
A 704 silicone rubber perimeter seal provides effective protection against water and moisture; Internal solder joints use environmentally friendly bismuth-tin solder (melting point 138°C), which complies with RoHS environmental standards and ensures reliable, high-temperature-resistant soldering.
8. Low-Voltage Operation, Safe and Easy to Use
With a maximum voltage of only 5.8V, it can be powered directly by a 5V or 6V low-voltage power supply, simplifying power supply design and making it suitable for battery-powered portable devices.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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