English
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Generator Modules Product Drawing
🔷Thermo Cooler Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03108 | K10 | 60 | 0.36 | 3.7 | 8.0 | 30 | 20×20×3.4 |
| TEC1-03108 | K12 | 65 | 0.36 | 3.7 | 8.0 | 30 | 20×20×3.6 |
| TEC1-03108 | K14 | 70 | 0.36 | 3.7 | 8.0 | 30 | 20×20×3.8 |
🔷Peltier Heater Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Tin-lead eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷TEC Peltier Performance Curve
🔷TEC Module Product Overview
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). This product operates at a maximum voltage of just 3.7V, with a maximum current of 8A, a maximum cooling power of 30W, and an internal resistance of only 0.36Ω.
Compared to other models in the same series, the TEC1-03108 achieves high-power cooling of 30W with an ultra-low drive voltage of 3.7V and an internal resistance of just 0.36Ω, making it a high-performance model that combines high current (8A) with low voltage. Compared to the TEC1-03110 (10A/37W/0.29Ω), the TEC1-03108 reduces current requirements by 20% (8A vs. 10A) while maintaining a similar power density, making it more compatible with power supplies, leads, and driver circuits, and simplifying system integration; Compared to the TEC1-04502 (2.2A/12W/1.91Ω), its power density is 150% higher. This product is particularly suitable for high-performance applications requiring 30W-class cooling within an extremely compact 20×20mm space, where the supply voltage is limited (such as when powered by a single lithium-ion battery).
🔷Thermoelectric Cooler Module Product Applications
1. Car Refrigerators and High-Capacity Portable Cooling
The TEC1-03108’s 30W power rating and 3.7V low-voltage operation make it ideal for portable cooling devices powered by a single lithium-ion battery or a 12V automotive system (stepped down to 3.7V via a DC-DC converter). Using two units in parallel can achieve 60W of cooling power; when paired with a high-efficiency heat sink, this enables rapid cooling to 0–5°C in car refrigerators with a volume of 10–15L.
2. Temperature Control for High-Power Lasers and Optical Modules
High-power semiconductor lasers (such as 5–10W-class LDs) and fiber laser pump sources generate significant heat and are temperature-sensitive. The TEC1-03108’s 30W high-power cooling capacity provides precise temperature control within a compact 20×20 mm space, stabilizing laser temperatures to within ±0.05°C, making it suitable for industrial laser processing, LiDAR, and optical communication systems.
3. Medical Diagnostics and IVD Equipment
Large-scale IVD equipment, such as fully automated biochemical analyzers, chemiluminescent immunoassay analyzers, and flow cytometers, requires rapid temperature cycling and high-throughput testing. The TEC1-03108’s fast response time (reaching steady state in <3 seconds) and high-power cooling capability meet the stringent temperature cycling rate requirements of high-throughput testing equipment.
4. High-Performance Infrared Detection and Thermal Imaging Systems
High-end uncooled infrared focal plane arrays (e.g., 640×512 resolution) require the sensor to be cooled to below -20°C to reduce thermal noise. The TEC1-03108’s 30W power output provides sufficient cooling capacity within a 20×20mm package, meeting the temperature control requirements of high-performance infrared detection systems and improving NETD performance.
5. Battery Thermal Management and High-Power Electronic Cooling
Smart battery packs for drones and power batteries for power tools generate significant heat during rapid charging and discharging. The TEC1-03108 enables active, high-power cooling of cell hotspots, balancing temperature differences within the battery pack and extending cycle life. It can also serve as an auxiliary active cooling solution for power electronic devices such as high-power IGBTs, MOSFETs, and RF power amplifiers.
6. 5G Base Stations and RF Power Modules
RF power amplifiers (PAs) in 5G base stations have extremely high heat density (10–30 W per chip). The TEC1-03108 can be mounted on the back of the PA chip, utilizing its 30 W cooling capacity to reduce the core temperature by 15–20°C, thereby improving PA efficiency and reliability.
7. Thermal Management for High-Performance Computing and Server Chips
High-performance computing chips such as CPUs, GPUs, and FPGAs consume enormous amounts of power when operating at full load. The TEC1-03108 can be mounted on the chip surface or integrated into a heat sink module to serve as an auxiliary active cooling solution, reducing chip hotspot temperatures by 10–15°C and enhancing sustained computing power output.
8. Industrial Laser Processing and 3D Printing
Industrial-grade lasers generate a large amount of heat during operation and require high-power active cooling. The TEC1-03108’s high-power cooling capacity and rapid response characteristics make it an ideal choice for temperature control systems in industrial laser processing equipment.
9. Constant-Temperature Incubation and Biological Sample Cold Chain
Large constant-temperature incubators require high cooling capacity and rapid temperature recovery capabilities. The TEC1-03108 can rapidly return to the set temperature after the door is opened to retrieve or place samples, ensuring sample safety.
10. Scientific Research and Advanced Education
In scientific research experiments across fields such as materials science, physics, and electrical engineering, the TEC1-03108 can be used for cutting-edge research projects, including testing the performance of thermoelectric materials and evaluating the efficiency of high-power heat pumps.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
Get A Free Quote
