The thermoelectric cooling device (TEM) is composed of N-type and P-type bismuth telluride (Bi-Te) materials. This structure enables the transfer of heat to be directed from one end of the device to the other when an alternating current flows between the two materials.

Among them, N-type materials contain excess free electrons, while P-type materials have electron vacancies (i.e., "holes"). The electrons and holes act as carriers for heat transfer. As they move, they drive the heat through the thermoelectric element.

The thermal flux rate of the device (i.e., the heat transferred by TEM) is directly proportional to the current of the input DC power supply. Based on this characteristic, by precisely adjusting the input current within the range from 0 to the maximum value, it is possible to achieve precise control over the thermal flux rate and temperature changes of the TEM.


Core Features and Advantages

1. No refrigerant, stable operation: Can operate continuously without any refrigerant, without pollution sources; the whole device is in solid pieces form, without rotating or sliding components. During operation, there is no vibration or noise, long service life and easy installation, without rotational effect.

2. Dual functions of cooling and heating, excellent heating efficiency: It has both cooling and heating functions. Although the cooling efficiency is average, the heating efficiency is always greater than 1. A single piece can replace the separate heating system and cooling system, simplifying the equipment structure.

3. Precise temperature control, easy to automate and adapt: It is a current conversion type piece. By adjusting the input current, high-precision temperature control can be achieved. Combined with temperature detection equipment, it can easily realize remote control, program control and computer control, facilitating the establishment of an automatic control system.

4. Small thermal inertia, rapid response: The time for switching between cooling and heating and reaching a stable state is short. Under the working condition of good heat dissipation at the hot end and no load at the cold end, the maximum temperature difference can be achieved in less than one minute after power-on.

5. Reverse can generate electricity, suitable for medium and low temperature areas: When used in reverse, it can achieve temperature difference power generation, especially suitable for power generation scenarios in medium and low temperature areas, with strong functional expansion.

6. Wide adjustable power range: The power of a single cooling element is small, but by combining the same type of elements into an electrical stack, and then building a cooling system through series and parallel connections, the power can be flexibly adjusted, covering a range from several milliwatts to tens of thousands of watts, suitable for different scene requirements.

7. Wide temperature difference range: It can achieve wide-range temperature difference adjustment from +90℃ positive temperature to -130℃ negative temperature, with strong application compatibility.


The application scope of semiconductor thermoelectric components includes: cooling, heating, and power generation. The applications of cooling and heating are more common, and there are the following aspects:

1. Military applications: infrared detection and guidance systems for missiles, radars, submarines, etc.

2. Medical applications; cooling devices, cold fusion, cataract removal devices, blood analyzers, etc.

3. Laboratory equipment: cold traps, cold boxes, cold tanks, electronic low-temperature testing devices, various constant temperature and high-low temperature experimental instrument chips.

4. Specialized devices: low-temperature testing instruments for petroleum products, low-temperature testing instruments for biochemical products, bacterial incubators, constant temperature developing tanks, computers, etc.

5. Daily life applications: air conditioners, dual-purpose coolers, water dispensers, electronic mailboxes, etc. In addition, there are other applications as well.



Parameters of semiconductor cooling sheet



Material of semiconductor cooling sheet

Component NameConsumer Grade Standard MaterialIndustrial Grade/High Power Standard Material
P-type/N-type Thermoelectric LegsBismuth Telluride-based Solid Solution (P-type: Bi₂Te₃-Sb₂Te₃; N-type: Bi₂Te₃-Bi₂Se₃)High Purity Bismuth Telluride-based Solid Solution (Precise doping, low internal resistance)
Ceramic SubstrateAlumina Ceramic (Al₂O₃, Thermal Conductivity ≥ 20W/m·K)Aluminum Nitride Ceramic (AlN, Thermal Conductivity ≥ 180W/m·K)
Metal ElectrodePurple Copper + Nickel Coating (Ni)Purple Copper + Nickel-Gold Coating (Ni/Au)
Welding LayerTin-Bismuth Alloy Solder (Low melting point, easy to solder)High Reliability Tin-Bismuth Alloy/Silver-based Solder (High temperature resistance)
Encapsulation Frame/SealEpoxy Resin/Silicone RubberHigh Temperature Resistant Epoxy Resin/Polyimide (PI)
Overall Encapsulation/Thermoelectric Pile Assembly- (No separate material, includes combination of components)- (No separate material, includes combination of components)

Automatic inspection of semiconductor cooling sheets in the production line: Suitable for full inspection in mass production or high-proportion sampling inspection, replacing manual work to improve efficiency and consistency, inspecting appearance, electrical performance, and cooling function; Adopting the "automatic initial screening + manual re-inspection" mode, the advantages are fast detection, small error, and continuous operation.

Manual inspection of TEC: Visual inspection of appearance, measuring electrical performance with a multimeter, and testing cooling function with power-on.

Our semiconductor cooling sheets undergo sampling inspections at each production stage, balancing quality and cost; The finished products undergo multiple rounds of automatic and manual inspections to ensure quality.

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