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The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Cooler Product Drawing
🔷Peltier Cooler Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03102 | K18 | 55 | 1.31 | 3.7 | 2.2 | 8 | 20×20×4.2 |
| TEC1-03102 | K28 | 60 | 1.31 | 3.7 | 2.2 | 8 | 20×20×5.2 |
| TEC1-03102 | K38 | 65 | 1.31 | 3.7 | 2.2 | 8 | 20×20×6.2 |
🔷Peltier Module Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷TEC Cooler Performance Curve
🔷Thermoelectric Cooler Peltier Product Overview
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). This product has a maximum voltage of only 3.7 V, a maximum current of only 2.2 A, a maximum cooling power of only 8 W, and an internal resistance of 1.31 Ω.
Compared to the full 20×20mm product series, the TEC1-03102 is one of the models with the lowest power consumption and lowest current draw, while also being the thickest (6.2mm) model. Its cooling efficiency per unit power is exceptionally high—it can generate a temperature difference of approximately 8.1°C per watt of power consumption (65°C/8W), offering the highest energy efficiency ratio among all models. Compared to the TEC1-03104 (4A/15W/0.72Ω), its power consumption is reduced by nearly half (8W vs. 15W), while the temperature difference decreases by only 5°C, making it more suitable for ultra-low-power applications; Compared to the TEC1-04901 (1.4A/8W/3.23Ω/5.8V), both have the same power consumption, but the TEC1-03102 features a lower drive voltage (3.7V vs. 5.8V) and a higher energy efficiency ratio (8.1°C/W vs. 7.6°C/W), offering superior compatibility with single-cell lithium batteries. This product is an ideal choice within the 20×20mm series for ultra-low-power, battery-powered applications with minimal thermal loads that require deep cooling.
🔷Peltier Cooling Module Product Features
1. Ultra-low power consumption for maximum battery life
With a maximum current of just 2.2A and a maximum power of only 8W, it is one of the models with the lowest power consumption in the entire 20×20mm series. When paired with a small lithium battery (such as a 3.7V/1000mAh battery), it can operate continuously for 4 to 6 hours, making it an ideal temperature control solution for battery-powered portable devices.
2. Lowest Operating Voltage, Hassle-Free Single-Cell Power Supply
With a maximum operating voltage of just 3.7V, it is perfectly matched to a single lithium battery. No boost circuit is required, ensuring maximum power efficiency and the lowest system cost. Even when the battery voltage drops to 3.0V, it can still maintain most of its cooling performance.
3. Highest Energy Efficiency Ratio, High Cooling Capacity per Watt
With a maximum temperature difference of 65°C and an input power of only 8W, it generates a temperature difference of approximately 8.1°C per watt of power consumption, making it the model with the highest energy efficiency ratio in the entire 20×20mm series. It is particularly suitable for applications that demand extremely high battery life and temperature control precision but do not require high cooling capacity.
4. Gentle cooling, gentle on sensitive loads
With a cooling power of only 8W, the rate of temperature change is gradual, preventing severe thermal shock to heat-sensitive loads such as biological samples, optical crystals, and precision sensors. It is suitable for applications requiring slow and gentle cooling.
5. Greater Thickness and Ample Crystal Grain Height
Available in three thicknesses—4.2mm, 5.2mm, and 6.2mm—it is the thickest model in the 20×20mm series. The K38 chip has a thickness of 6.2 mm and a greater internal grain height, which helps improve cooling depth and efficiency.
6. Moderate internal resistance, suitable for low-current designs
With an internal resistance of 1.31 Ω, the Joule heat loss (I²R) at a current of 2.2 A is 6.3 W. This represents a reasonable proportion of total power loss, allowing more electrical energy to be converted into effective cooling capacity.
7. High-Quality Substrate with Excellent Thermal and Electrical Insulation
The substrate is manufactured using a sintering process combining 96% aluminum oxide ceramic (0.76 mm) and oxygen-free copper (0.4 mm), offering high thermal conductivity and high electrical insulation strength to ensure long-term reliability.
8. Fine-Gauge Leads for Lightweight and Flexible Installation
Standard 26 AWG silicone-coated wire (100 mm long) features a fine gauge and flexible construction, making it suitable for routing in extremely confined spaces and reducing stress on the cooling plate caused by the leads.
9. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the unit to operate in complex environments with high humidity and drastic temperature fluctuations.
10. Bidirectional Temperature Control, Dual-Function Design
Simply reversing the input current polarity swaps the hot and cold surfaces to activate heating mode, making it suitable for precision temperature-controlled systems requiring bidirectional temperature regulation.
11. Zero Noise, Zero Vibration, Precision Operation
The all-solid-state design contains no moving parts, ensuring completely silent and vibration-free operation. It is ideal for high-precision measurement, optical experiments, and medical testing scenarios that are extremely sensitive to noise and vibration.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
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