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The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Cooling Devices Product Drawing
🔷Peltier Elements Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03104 | K10 | 60 | 0.72 | 3.7 | 4.0 | 15 | 20×20×3.4 |
| TEC1-03104 | K18 | 65 | 0.72 | 3.7 | 4.0 | 15 | 20×20×4.2 |
| TEC1-03104 | K26 | 70 | 0.72 | 3.7 | 4.0 | 15 | 20×20×5.0 |
🔷Thermoelectric Controller Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 24 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermal Generators Performance Curve
🔷Thermoelectric Devices Product Overview
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). This product has a maximum voltage of only 3.7V, a maximum current of 4A, a maximum cooling power of 15W, and an internal resistance of 0.72Ω.
Compared to other models in the same series, the TEC1-03104 ranks in the lower-middle range for key parameters such as current (4A), power (15W), and internal resistance (0.72Ω), offering the dual advantages of a wide temperature difference range (up to 70°C) and low-power operation (only 15W). Compared to the TEC1-03110 (10 A/37 W/0.29 Ω) and TEC1-03108 (8 A/30 W/0.36 Ω), the TEC1-03104 features significantly lower current and power consumption, substantially reducing requirements for power supplies, leads, and heat dissipation systems, and resulting in lower system integration complexity and costs; Compared to the TEC1-03106 (6A/22W/0.48Ω), its power consumption is further reduced by 32% while maintaining a maximum temperature difference capability of 70°C. This product offers the optimal balance between high temperature difference and low power consumption within the 20×20mm series, making it suitable for various applications that demand high energy efficiency, have moderate thermal loads, and require deep cooling.
🔷Peltier Element Cooler Product Selection
| 模型 | 热电偶对 | Umax（伏特） | Imax（安培） | DTmax（°C） | 瓦特 | 电阻器（Ω） | 长度（mm） | 宽度（mm） |
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
🔷Thermoelectric Generator Installation and Usage Recommendations
Assembly Pressure: 1.0 kg (0.25 kg/cm²) is recommended to ensure that the cooling plate is in close contact with the heat sink and the surface being cooled. It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.
Heat Sink Requirements for the Hot Side: With a power consumption of only 15 W, the TEC1-03104 allows for a relatively simplified heat dissipation solution. A 30 × 30 × 15 mm extruded aluminum heat sink paired with a low-speed, quiet fan (airflow > 5 CFM) is sufficient for most applications. For designs requiring absolute silence, a 50 × 50 × 30 mm passive heat sink can be used to achieve fanless natural convection cooling.
Power Supply Requirements: Maximum voltage 3.7V, maximum current 4A. We recommend using a regulated power supply of 3.7V/5A or higher (with a margin of >20%), or a standard 5V/2A USB power source combined with a step-down module. For a single-cell lithium battery, ensure the discharge capacity is ≥5A. Power supply ripple should be <50mV.
Lead Wires: The standard configuration includes 24 AWG silicone-coated wires, which are fully compatible with the 4A operating current and can be used directly without replacement.
Current Limitation: Do not exceed the rated maximum current of 4A. It is recommended to connect a self-resetting fuse (rated at 5A) in series for overcurrent protection and to prioritize constant-current drive mode to achieve more stable cooling performance.
Comprehensive Thermal Management Design: It is recommended to use a complete temperature control system consisting of a TEC, heat sink, and PID controller. Install temperature sensors (NTC or PT100) at both the cold and hot ends to form a closed-loop control system, ensuring temperature stability and system safety.
Anti-Condensation Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add an insulating layer (closed-cell foam, polyurethane foam), and apply triple-proof varnish to the lead solder joints.
Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.
Maximum Temperature: The operating temperature must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C and limit the soldering time to less than 5 seconds to prevent thermal shock damage to the internal grains.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
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