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The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Peltier Effect CoolerPeltiers Product Drawing
🔷Cooler with Peltier Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03101 | K28 | 55 | 2.06 | 3.7 | 1.4 | 5 | 20×20×5.2 |
| TEC1-03101 | K34 | 60 | 2.06 | 3.7 | 1.4 | 5 | 20×20×5.8 |
| TEC1-03101 | K40 | 65 | 2.06 | 3.7 | 1.4 | 5 | 20×20×6.4 |
🔷Peltier Device Cooler Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Module Cooler Performance Curve
🔷Peltiers Product Overview
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). This product has a maximum voltage of only 3.7V, a maximum current of only 1.4A, a maximum cooling power of only 5W, and an internal resistance of 2.06Ω.
This is the model with the lowest power consumption (5W), lowest current (1.4A), and greatest thickness (6.4mm) in the entire 20×20mm series. Compared to the TEC1-03102 (2.2 A/8 W/1.31 Ω/max. 65°C), the TEC1-03101 reduces power consumption by an additional 37.5% (5 W vs. 8 W), and current by 36% (1.4A vs. 2.2A), while maintaining the same maximum temperature difference (65°C). Its energy efficiency has been further improved to 13°C/W (65°C/5W), placing it in a clear lead within the entire series. Compared to the TEC1-04901 (1.4A/8W/3.23Ω/ max 65°C/5.8V), both operate at the same current, but the TEC1-03101 consumes less power (5W vs. 8W), operates at a lower voltage (3.7V vs. 5.8V), and offers higher energy efficiency, making it better suited for applications powered by button cells or micro lithium batteries where power consumption is a critical concern. This product is the ultimate temperature control solution within the 20×20mm product family for applications requiring ultra-low power consumption, minimal thermal load, battery power, and deep cooling.
🔷Thermoelectric Peltier Device Product Applications
1. Ultra-micro wearable devices
Ultra-micro wearable devices such as smart rings, continuous glucose monitors (CGMs), and EEG monitoring patches have internal volumes of less than 5 cm³ and battery capacities of less than 200 mAh. With its ultra-low power consumption of 5 W and dimensions of 20 × 20 mm, the TEC1-03101 can actively cool the core chip by 5–8°C while affecting battery life by less than 5%.
2. Implantable and Body-Worn Medical Devices
Body-worn devices such as insulin patch pumps, Holter ECG patches, and drug iontophoresis devices have extremely stringent requirements for power consumption, size, and safety. The TEC1-03101’s ultra-low power consumption ensures that devices operate for extended periods without overheating, while its low current of 1.4A guarantees electrical safety.
3. Button-Battery-Powered IoT Sensors
For devices such as miniature environmental sensors and RFID temperature tags powered by CR2032 button batteries (capacity approximately 220 mAh), the TEC1-03101 can operate intermittently with an average power consumption of < 50 mW, enabling autonomous temperature control for several months.
4. Energy-Harvesting Power Supply Systems
For off-grid devices powered by small solar panels (e.g., 5V/50mA), thermoelectric generators (TEGs), or vibration energy harvesters, the TEC1-03101’s 5W power consumption and 3.7V voltage perfectly match the output characteristics of energy-harvesting systems.
5. Quantum Dots and Single-Photon Detectors
Quantum optical devices, such as quantum dot lasers and SPAD (single-photon avalanche diodes), are extremely temperature-sensitive and have very low thermal loads (< 100 mW). The TEC1-03101’s gentle cooling characteristics enable precise temperature control to ±0.01°C without introducing electrical noise or vibration.
6. Ultra-Precision MEMS Sensors
The zero-bias stability of sensors such as MEMS gyroscopes, accelerometers, and micromechanical resonators is significantly affected by temperature. The TEC1-03101 can maintain the sensor temperature at a constant 25°C ±0.05°C with a power consumption of only 1–2 W, significantly improving measurement accuracy.
7. Wearable Thermal Management and Personal Comfort
For wearable comfort devices such as smart cooling wristbands, cooling patches, and miniature personal air conditioners, the TEC1-03101—powered by a small lithium battery—provides gentle, long-lasting cooling.
8. Biochips and Organ-on-a-Chip
Cell culture areas in microfluidic biochips and organ-on-a-chip devices require precise temperature control at 37°C with minimal thermal load (< 500 mW). The TEC1-03101 provides a vibration-free, electromagnetic interference-free, temperature-controlled environment.
9. Optical Communication Microcomponents
For temperature control of ultra-compact optical modules, silicon photonic chips, and miniature EDFAs, the TEC1-03101 can maintain a constant temperature of 25°C with power consumption as low as 0.5 W or less.
10. Chip-Level Precision Temperature Control
For surface-mount cooling of chips such as low-power MCUs, Bluetooth/Wi-Fi modules, and MEMS microphones, the TEC1-03101 can reduce chip temperature by 5–10°C, thereby improving stability.
🔷Peltier Device Product Structure
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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