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The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Peltier Module Product Drawing
🔷Cooling Module Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03106 | K10 | 60 | 0.48 | 3.7 | 6.0 | 22 | 20×20×3.4 |
| TEC1-03106 | K14 | 65 | 0.48 | 3.7 | 6.0 | 22 | 20×20×3.8 |
| TEC1-03106 | K18 | 70 | 0.48 | 3.7 | 6.0 | 22 | 20×20×4.2 |
🔷Tec Thermoelectric Cooler Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 22 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Semiconductor Cooler Performance Curve
🔷TEC Peltier Module Product Overview
The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). This product has a maximum voltage of only 3.7V, a maximum current of 6A, a maximum cooling power of 22W, and an internal resistance of 0.48Ω.
Compared to other models in the same series, the TEC1-03106 offers moderate levels across key parameters such as current (6A), power (22W), internal resistance (0.48Ω), and voltage (3.7V), combining high-power cooling capability with good system compatibility. Compared to the TEC1-03110 (10A/37W/0.29Ω) and TEC1-03108 (8A/30W/0.36Ω), the TEC1-03106 achieves an effective cooling power of 22W with a lower current requirement (6A), placing less strain on the power supply, leads, and driver circuit, resulting in lower system integration complexity and costs; compared to low-power models such as the TEC1-04502 (2.2A/12W/1.91Ω), its cooling capacity is nearly double. This product is a mid-range model that strikes a good balance between high power and ease of use, making it suitable for a wide range of applications requiring 20W-class cooling within a compact 20×20mm space and with limited power supply conditions.
🔷Peltier Heater Cooler Product Structure
🔷Advanced TEC Product Features
1. Ultra-low-voltage operation, hassle-free direct power supply from a single battery
With a maximum voltage of just 3.7V, it is perfectly matched to a single lithium-ion battery (nominal 3.7V, fully charged 4.2V, discharge range 3.0–4.2V). It can be powered directly by 18650, 21700, or polymer lithium-ion batteries without requiring a boost circuit, thereby avoiding the 5–15% efficiency loss and additional costs associated with DC-DC conversion, resulting in higher overall system efficiency.
2. Moderate Current Design for High System Compatibility
With a maximum current of 6A—which is on the lower end of the range among high-power models in the same series—it places moderate demands on the power supply’s load-carrying capacity (standard 18650 power cells are sufficient) and even lower demands on the lead wire’s current-carrying capacity (standard 22 AWG wire safely handles over 7A). This simplifies the selection of drive MOSFETs and significantly reduces system integration complexity.
3. Moderate-Power Cooling with Ample Capacity
With a maximum power of 22W, it achieves a cooling power density of 5.5W/cm² within a 20×20mm package. This not only meets the cooling requirements of most compact devices but also avoids placing excessive strain on the thermal management system, allowing for a relatively simple heat sink solution (air cooling is sufficient; water cooling is not required).
4. Low Internal Resistance, Balanced Energy Efficiency
With an internal resistance of 0.48 Ω, the I²R Joule heat loss at a 6 A operating current is 17.3 W. This represents a reasonable proportion of total losses, ensuring that more electrical energy is converted into effective cooling capacity rather than self-generated heat, achieving a good balance between high power and energy efficiency.
5. Full Temperature Range Coverage, Flexible Selection
Three die options are available: K10 (60°C), K14 (65°C), and K18 (70°C), covering the full temperature range from standard cooling to deep cooling. Users can flexibly select the appropriate model based on their target temperature.
6. Moderate Thickness, Flexible Installation Compatibility
Available in three thicknesses—3.4 mm, 3.8 mm, and 4.2 mm—these options cover common package sizes ranging from slim to standard thickness, allowing users to flexibly match the product to their equipment’s internal space and heat sink mounting methods.
7. High-Quality Substrate for Reliable Electrical Safety
The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm), offering high thermal conductivity and high electrical insulation strength to ensure electrical safety and efficient heat transfer under 6A operating conditions.
8. Thick-Gauge Leads for Safe 6A Current Carrying Capacity
Standard 22 AWG silicone-coated wires (100 mm in length) are provided, with a current-carrying capacity fully matched to the 6A operating current (22 AWG safely carries approximately 5–7A). The wires are flexible and heat-resistant, ensuring safe and reliable high-current transmission.
9. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the element to withstand complex environments with high humidity and drastic temperature fluctuations.
10. Bidirectional Temperature Control, Flexible Application
Simply reversing the input current polarity swaps the hot and cold surfaces, enabling heating mode. This makes it suitable for precision temperature control systems requiring bidirectional temperature regulation.
11. Fast Response and Superior Dynamic Temperature Control
The low internal resistance design results in a short thermal time constant, allowing the system to reach a steady-state temperature difference within a very short time (<3 seconds) after power-on. This makes it suitable for applications requiring rapid temperature ramping and frequent temperature switching.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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