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The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Peltiers Product Drawing
🔷Thermoelectric Peltier Device Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-04502 | K10 | 60 | 1.91 | 5.4 | 2.2 | 12 | 20×20×3.4 |
| TEC1-04502 | K18 | 65 | 1.91 | 5.4 | 2.2 | 12 | 20×20×4.2 |
| TEC1-04502 | K26 | 70 | 1.91 | 5.4 | 2.2 | 12 | 20×20×5.0 |
🔷Peltier Device Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Module Performance Curve
🔷Thermoelectric Peltier Product Overview
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). This product has a maximum voltage of 5.4 V, a maximum current of 2.2 A, a maximum cooling power of 12 W, and an internal resistance of 1.91 Ω.
Compared to other products in the same series, the TEC1-04502 achieves lower power consumption (12 W) and lower internal resistance (1.91 Ω) at a current of 2.2 A than the TEC1-04902 (same current, 13 W, internal resistance 2.26 Ω), while its maximum voltage has been reduced to 5.4V, resulting in better compatibility with low-voltage power supplies, lower self-heating, and superior energy efficiency. While covering the full temperature difference range (60–70°C), the TEC1-04502 achieves a good balance between low power consumption, low voltage, and high energy efficiency, making it one of the models with the most well-rounded overall performance in the 20×20mm series.
🔷TEG Module Product Structure
🔷Solid State Cooler Installation and Usage Recommendations
1.Assembly Pressure: 1.0 kg (0.25 kg/cm²) is recommended to ensure that the cooling plate is in close contact with the heat sink and the surface being cooled, thereby reducing interfacial thermal resistance. It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.
2.Hot-Side Cooling Requirements: The TEC1-04502 has a power dissipation of 12 W. A 30 × 30 × 15 mm extruded aluminum heat sink paired with a small, quiet fan (airflow > 3 CFM) is sufficient for most applications. For space-constrained designs or those requiring quiet operation, a 50 × 50 × 30 mm passive heat sink can be used to achieve natural convection cooling.
3.Power Supply Requirements: Maximum voltage is 5.4V. A regulated power supply of 5V/2.5A or higher is recommended to ensure sufficient peak startup current. Power supply ripple should be < 50mV to prevent current fluctuations from affecting cooling stability. For precise temperature control, constant-current (CC) drive is recommended over constant-voltage (CV) drive to avoid temperature drift caused by voltage fluctuations.
4.Current Limit: Do not exceed the rated maximum current of 2.2A. It is recommended to install a self-resetting fuse (rated at 2.5A) in series at the power supply input for overcurrent protection.
5.Lead Wiring: Use 26 AWG silicone-coated wire; the lead length should not exceed 150 mm. If longer leads are required, increase the wire gauge to 24 AWG or 22 AWG to minimize voltage drop. It is recommended to attach terminals to the lead ends or solder them to a PCB to ensure contact resistance is < 10 mΩ.
6.Anti-condensation Measures: When the cold junction temperature is below the ambient dew point, condensation will form on the surface of the cooling plate. It is recommended to fill the area around the cold junction with desiccant or add insulation (closed-cell foam, polyurethane foam); if necessary, apply a waterproof coating to the surface of the cold junction. For applications requiring deep cooling (cold end < 0°C), it is recommended to seal the perimeter of the cooling plate, leaving only the cold surface in contact with the load.
7.Temperature Sensor Recommendations: For precise temperature control, it is recommended to mount an NTC thermistor (e.g., 10 kΩ B=3435) or a PT100 platinum resistance thermometer on the surface of the cold end and feed the signal back to a PID controller to achieve closed-loop control.
8.Storage Conditions: Temperature < 120°C, humidity < 60% Rh. Avoid moisture and direct sunlight. For long-term storage, it is recommended to package the product in a sealed bag with desiccant.
9.Maximum Temperature: The operating temperature must not exceed the solder melting point of 138°C. When soldering by hand, keep the soldering iron temperature below 280°C and limit the soldering time to less than 5 seconds to prevent thermal shock damage to the internal grains.
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