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The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Power Generator Product Drawing
🔷Element Peltier Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03110 | K10 | 60 | 0.29 | 3.7 | 10 | 37 | 20×20×3.4 |
| TEC1-03110 | K12 | 65 | 0.29 | 3.7 | 10 | 37 | 20×20×3.6 |
| TEC1-03110 | K14 | 70 | 0.29 | 3.7 | 10 | 37 | 20×20×3.8 |
🔷Peltier Cooling Element Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷TEC Cooling System Performance Curve
🔷Thermoelectric Cooling Device Product Overview
The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). This product has a maximum voltage of only 3.7V, a maximum current of up to 10A, a maximum cooling power of 37W, and an internal resistance of just 0.29Ω.
Among the entire 20×20mm product series, this model features the highest current (10A), highest power (37W), lowest internal resistance (0.29Ω), and lowest voltage (3.7V). Compared to other products in the same series, the TEC1-03110 operates at an ultra-low voltage of less than 4V and can achieve high-power cooling of 37W within the extremely small 20×20mm footprint, offering extremely high power density. With an internal resistance of just 0.29Ω—the lowest in the series—it features minimal Joule heat loss (I²R = 29W, accounting for approximately 78%, which is a typical high-efficiency design in low-voltage, high-current systems) and high electrical energy utilization efficiency. This product is particularly suitable for applications with stringent space constraints but high cooling power requirements, making it the “performance flagship” of the 20×20 mm series.
🔷Thermoelectric Cooling Element Product Selection
| 模型 | 热电偶对 | Umax（伏特） | Imax（安培） | DTmax（°C） | 瓦特 | 电阻器（Ω） | 长度（mm） | 宽度（mm） |
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
🔷Thermoelectric Generation Principle of Operation
The TEC1-03110 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of high-density P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates.
When a forward DC voltage (up to 3.7 V) is applied, a high current of 10 A drives the holes in the P-type material and the electrons in the N-type material to migrate rapidly in opposite directions. At the PN junction interface, a large number of charge carriers exchange energy as they pass through—the cold junction absorbs lattice vibration energy (phonons), causing the temperature to drop rapidly, while the hot junction releases energy, causing the temperature to rise. Under the continuous drive of a strong electric field, a large amount of heat is continuously “pumped” from the cold end to the hot end, enabling rapid active cooling.
The core distinction between the TEC1-03110 and other models in the same series lies in its design philosophy of ultra-low voltage, ultra-high current, and extremely low internal resistance. With a maximum voltage of 3.7V, it can be powered directly by a single lithium-ion battery (nominal voltage 3.7V, fully charged 4.2V), eliminating the need for a DC-DC boost converter. This avoids the 5–15% efficiency loss and additional costs associated with boost circuits, resulting in higher overall system efficiency. With an internal resistance of just 0.29 Ω, the Joule heat loss at a current of 10 A is 29 W; the hot end requires a high-efficiency heat sink (water cooling or a large air-cooled heat sink is recommended) to dissipate heat promptly.
When the hot-end temperature is 40°C, this product achieves a maximum temperature difference of 70°C (K14 model), meaning the cold-end temperature can reach as low as approximately -30°C. Due to its high cooling power (37W), the heat generated at the hot end is correspondingly high (total heat generation ≈ input power + cooling power ≈ 37W + actual heat pump power). It must be equipped with a cooling system capable of sufficient heat dissipation (recommended: extruded aluminum heatsink of at least 50×50×30 mm + high-performance fan or water block); otherwise, excessive hot-end temperatures will severely limit the cooling performance at the cold end. At the same time, high-current operation places greater demands on the power supply’s load-carrying capacity and the lead wires’ current-carrying capacity. When designing the system, the compatibility among the power supply, lead wires, and heat dissipation must be comprehensively considered.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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