The TEC1-04903 is a miniature semiconductor cooling module designed for low-power, precision temperature control. It measures 20 × 20 mm and is available in three crystal configurations—K12, K18, and K24 configurations, with thicknesses of 3.6 mm, 4.2 mm, and 4.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Peltier Heater Cooler Product Drawing

🔷Advanced TEC Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-04903 | K12 | 60 | 1.51 | 5.8 | 3.0 | 17 | 20×20×3.6 |
| TEC1-04903 | K18 | 65 | 1.51 | 5.8 | 3.0 | 17 | 20×20×4.2 |
| TEC1-04903 | K24 | 70 | 1.51 | 5.8 | 3.0 | 17 | 20×20×4.8 |
🔷Thermoelectric Cooling Devices Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 24 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Elements Performance Curve

🔷Thermoelectric Controller Product Overview
The TEC1-04903 is a miniature semiconductor cooling module designed for low-power, precision temperature control. It measures 20 × 20 mm and is available in three crystal configurations—K12, K18, and K24 configurations, with thicknesses of 3.6 mm, 4.2 mm, and 4.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). This product has a maximum voltage of 5.8V, a maximum current of only 3.0A, a maximum cooling power of 17W, and an internal resistance of 1.51Ω. Its notable features include low-current, low-power operation; it achieves a maximum temperature difference of 70°C with 17W of power within a 20×20mm package, demonstrating outstanding energy efficiency. Compared to the TEC1-04904 (4.0A/23W) and TEC1-04905 (5.0A/29W) in the same series, the TEC1-04903 covers the full temperature difference range of 60–70°C while operating at lower current and power consumption, making it an ideal choice for battery-powered and low-thermal-load applications.
🔷Thermal Generators Product Applications
1. Portable Medical and Home Health Devices
The low-power consumption of the TEC1-04903 makes it ideal for battery-powered portable medical devices, such as handheld PCR testers (which consume little power and can operate continuously for 4 to 6 hours), skin temperature therapy devices, and portable insulin coolers. It operates efficiently at 17 W within a temperature range of 2–8°C, meeting the demands of both home and field medical applications.
2. Optical Communications and Compact Optical Modules
Optical communication devices such as SFP/SFP+ optical modules, miniaturized EDFAs (erbium-doped fiber amplifiers), and WSSs (wavelength-selective switches) have extremely limited internal space and strict power consumption constraints (typically <2W module power budget). The TEC1-04903’s 20×20mm size and low 3.0A current draw make it an ideal choice for temperature control solutions in these compact optical modules, capable of stabilizing the laser wavelength within ±0.05nm of the ITU channel center.
3. Consumer Electronics and Mobile Devices
Consumer products such as smartphone cooling cases, tablet cooling docks, portable mini-refrigerators, and outdoor cooling neck warmers are highly sensitive to power consumption and size. The TEC1-04903 can be powered by a standard 5V/2A USB power source and is directly compatible with mainstream power banks without requiring a special adapter, significantly reducing product accessory costs.
4. Infrared Sensing and Thermal Imaging
Uncooled infrared focal plane arrays (such as micro-thermal imaging modules with 80×60 resolution) have low power consumption but require a stable, low-temperature operating environment to ensure a NETD < 50 mK. The TEC1-04903 can stabilize the sensor at a constant temperature of 25°C or 15°C with a power consumption of only 5–8 W (actual operating power), making it suitable for handheld thermal imagers and security surveillance cameras.
5. Precision Instruments and Scientific Experiments
Laboratory instruments such as compact spectrophotometers, fluorescence detectors, pH meter temperature compensation modules, and conductivity meters rely on core sensors that are sensitive to temperature drift. The TEC1-04903 provides a constant-temperature environment with low noise and no vibration, minimizing measurement errors and enhancing the reliability of experimental data.
6. Automotive Electronics and Cabin Comfort Systems
In-vehicle devices such as automotive LiDAR transceiver modules, HUD (Head-Up Display) optical engines, and infrared cameras for driver fatigue monitoring can experience internal temperatures exceeding 90°C under intense summer heat, severely affecting performance. The TEC1-04903 serves as an active cooling solution, maintaining the temperature of critical optoelectronic components below 55°C to ensure automotive-grade reliability.
7. Industrial Control and Outdoor Equipment
Equipment such as outdoor security cameras, traffic signal controllers, and industrial wireless sensor nodes is constantly exposed to high temperatures and direct sunlight. The low-power consumption of the TEC1-04903 allows it to be powered by a combination of solar panels and a battery, enabling a self-sustaining active cooling system that extends the stable operating time of the equipment under extreme heat.
8. Battery Thermal Management and Drones
Small drone batteries experience significant temperature rises during rapid charging and discharging, and high temperatures accelerate cell aging and capacity degradation. The TEC1-04903 can be mounted on the surface of the battery pack to actively cool the battery during flight intervals or while charging, maintaining the battery temperature within the optimal operating range of 25–35°C and extending its cycle life.
9. Constant-Temperature Incubation and Biological Transport
For small constant-temperature transport containers used with enzyme-linked immunosorbent assay (ELISA) kits, vaccine samples, and bioactive materials, The TEC1-04903 maintains high-precision temperature control (±0.3°C) at 4°C or -20°C, with power consumption as low as 10–12 W. Paired with a 12V/5Ah lithium battery, it can sustain stable temperature control for 4–6 hours, making it suitable for short-distance cold-chain delivery within urban areas.
10. Teaching, Research, and Innovative Experiments
The low-voltage, low-current characteristics of the TEC1-04903 make it extremely easy to drive in university laboratories. When paired with an Arduino/Raspberry Pi and a MOSFET driver module, it enables PID temperature control experiments, making it an ideal teaching component for research projects such as thermoelectric effect instruction, testing of materials’ thermoelectric properties, and heat pump efficiency evaluation.
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03106 is a miniature semiconductor cooling module designed for medium-power cooling and high-efficiency temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K14, and K18 chip configurations, with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03108 is a miniature semiconductor cooling module designed for high-power cooling and rapid temperature control applications. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03110 is a miniature semiconductor cooling module designed for applications requiring high power density and high cooling capacity. It measures 20 × 20 mm and is available in three chip configurations—K10, K12, and K14 chip configurations, with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-04502 is a miniature semiconductor cooling module designed for low-power, precision temperature control and high-efficiency cooling. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-04901 is a miniature semiconductor cooling module specifically designed for ultra-low power consumption and ultra-precise temperature control. It measures 20 × 20 mm and is available in three chip configurations—K16, K26, K36 crystal configurations, with thicknesses of 4.0 mm, 5.0 mm, and 6.0 mm, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw