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The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Devices Product Drawing
🔷Peltier Element Cooler Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-04902 | K10 | 60 | 2.26 | 5.8 | 2.2 | 13 | 20×20×3.4 |
| TEC1-04902 | K18 | 65 | 2.26 | 5.8 | 2.2 | 13 | 20×20×4.2 |
| TEC1-04902 | K26 | 70 | 2.26 | 5.8 | 2.2 | 13 | 20×20×5.0 |
🔷Thermoelectric Generator Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Cooler Performance Curve
🔷Peltier Cooler Product Overview
The TEC1-04902 is a miniature semiconductor cooling module designed specifically for ultra-low-power, precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). This product has a maximum voltage of 5.8V, a maximum current of only 2.2A, a maximum cooling power of 13W, and an internal resistance of 2.26Ω. Its most notable feature is its extremely low operating current and power consumption—it has the lowest power consumption among the entire 20×20mm product series while still covering the full temperature difference range of 60–70°C. Compared to other models in the same series—the TEC1-04903 (3.0 A/17 W), TEC1-04904 (4.0A/23W), and TEC1-04905 (5.0A/29W) in the same series, the TEC1-04902 achieves the same level of cooling temperature difference with the lowest power consumption, making it the preferred temperature control solution for battery-powered, low-thermal-load, and power-sensitive portable devices.
🔷Peltier Module Product Features
1. Wide Temperature Range Coverage, Comprehensive Lineup
Offers three chip options: K12 (60°C), K18 (65°C), and K24 (70°C). A single package size covers the entire temperature range from standard cooling to deep cooling, allowing users to flexibly select models based on target temperatures and enabling modular product design.
2. Low-Current Drive, Energy-Efficient
With a maximum current of just 3.0A and a maximum power of 17W, it offers the lowest power consumption among comparable 20×20mm products. It is ideal for battery-powered devices, portable instruments, and applications with strict limits on total system power consumption, effectively extending device runtime.
3. Low-Voltage Power Supply, High Compatibility
With a maximum voltage of just 5.8V, it is directly compatible with common 5V USB power sources, single-cell lithium batteries (3.7–4.2V boosted to 5V), or low-voltage switching power supplies. This eliminates the need for additional high-voltage drive circuit design, reducing the cost and complexity of the power supply system.
4. Moderate Internal Resistance, Controllable Thermal Loss
With an internal resistance of 1.51 Ω, the I²R Joule heat loss at a 3.0 A operating current is approximately 13.6 W, representing a reasonable proportion of total power loss. Compared to high-current products, the TEC1-04903 places less strain on power supply thermal management, making it easier to control the overall temperature rise of the system.
5. Multiple Thickness Options for Flexible Installation
Available in three thicknesses—3.6 mm, 4.2 mm, and 4.8 mm—each corresponding to a different die height. Users can flexibly select the appropriate option based on internal space constraints and heat sink mounting methods to achieve optimal mechanical compatibility.
6. High-Quality Ceramic Substrate Combining Thermal Conductivity and Electrical Insulation
The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with oxygen-free copper (0.4 mm), offering both high thermal conductivity (Al₂O₃ thermal conductivity coefficient of approximately 24–28 W/m·K) and high electrical insulation strength (breakdown voltage > 4 kV), ensuring efficient heat transfer and electrical safety.
7. Reliable Lead Matching and Convenient Installation
Comes standard with 24 AWG silicone-insulated wire (100 mm in length). The wire gauge is optimized for a 3.0 A current rating, and the flexible, bend-resistant wire facilitates flexible routing and system integration in confined spaces.
8. Sealed Protection and Eco-Friendly Manufacturing
A 704 silicone rubber perimeter seal provides protection against moisture, dust, and shock, enhancing the product’s long-term reliability in harsh environments such as high humidity and extreme temperature fluctuations. Internal solder joints use environmentally friendly bismuth-tin solder (melting point 138°C), which complies with RoHS standards and ensures strong, temperature-resistant connections.
9. Bidirectional Temperature Control, Dual-Function Design
Simply switching the input current polarity allows for the exchange of hot and cold surfaces, supporting both cooling and heating modes. This makes it suitable for temperature-controlled systems requiring bidirectional temperature regulation (such as PCR thermal cycling and precision ovens).
10. Low Noise, Vibration-Free, Solid-State Operation
With an all-solid-state design—no compressor and no moving parts—it operates with zero noise and zero vibration, making it particularly suitable for noise- and vibration-sensitive applications (such as optical experiments, medical testing, and high-precision measurements).
The TEC1-03101 is the flagship ultra-low-power semiconductor cooling module in the 20×20mm series, featuring the lowest power consumption and lowest current draw. With dimensions of 20×20mm, it is available in three chip configurations—K28, K34, and K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm (the thickest in the entire series), corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-side temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-precise temperature control, and high-efficiency applications. It measures 20 × 20 mm and is available in three chip configurations—K18, K28, and K38, with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 55°C, 60°C, and 65°C (under a hot-end temperature of Th=40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03104 is a miniature semiconductor cooling module designed for low-power, high-efficiency precision temperature control. It measures 20 × 20 mm and is available in three chip configurations—K10, K18, and K26 chip configurations, with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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