TEC1-07110 Thermoelectric Cooler Peltier 30*30mm

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The 30×30mm TEC1-07110 semiconductor cooling module operates on an 8.5V power supply with a 10A current and delivers 85W of high power. 
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
🟩 Source Factory:Online Factory Video
🟫 Multiple Payment Methods:T/T|PayPal|Alipay
⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

🔷Semiconductor Cooler Product Drawing

🔷Advanced TEC Basic Performance Spec


TEC1-07110 Basic Parameters (Th=40℃)
Product ModelIn APEMax Temperature Difference(℃)Internal Resistance(Ω)Max Voltage(V)Max Current(A)Max Power(W)Size(mm)
TEC1-07110K10600.668.5108530x30x3.4
TEC1-07110K12650.668.5108530x30x3.6
TEC1-07110K14700.668.5108530x30x3.8


🔷Thermoelectric Generator Additional Performance Spec


TEC1-07110 Additional Parameters
ItemSpecification
Substrate Specification96% Alumina 0.76 + Oxygen-free Copper 0.4 Sintering Process
Lead SpecificationSuper Soft Silicone Wire 18AWG/L=200mm
Terminal SpecificationStandard Product Without Terminals, Can Be Added According To Requirements
Assembly Pressure2.3kg/ (0.25kg/CM²)
Packaging StandardPolystyrene (PS) Foam Box Packaging
Sealing Material704 Silicone Rubber Sealing
Max Temperature ResistanceBismuth-tin Environmental Protection Solder Melting Point 138℃
Storage EnvironmentTemperature < 120℃, Humidity < 60%Rh

🔷Thermoelectric Peltier Device Performance Curve


🔷Thermoelectric Cooling Element Product Overview

The 30×30mm TEC1-07110 semiconductor cooling module operates on an 8.5V power supply with a 10A current and delivers 85W of high power. It offers a cooling temperature difference of 60–70°C and operates quietly in both cooling and heating modes. Designed to meet compact, high-power cooling and heat dissipation needs, it is commonly used in mini-refrigerators, medical and beauty devices, and equipment cooling applications.

🔷Peltier Heater Cooler  Product Features

1. High-Power Compact Design: With a compact size of 30×30 mm, a rated voltage of 8.5 V, a maximum current of 10 A, and a peak power of 85 W, it delivers high cooling output in a small form factor, meeting high-power cooling demands in confined spaces.

2. Wide Temperature Range and Multiple Specifications Available: Available in three chip versions—K10, K12, and K14—with a maximum temperature difference ranging from 60 to 70°C to meet the cooling depth requirements of various scenarios, and stable performance under 40°C test conditions.

3. Low Internal Resistance and High Efficiency: With an internal resistance of only 0.66 Ω, it features low power loss, high thermoelectric conversion efficiency, and a fast cooling response upon power-up.

4. Highly Reliable Packaging Process: Utilizes a 96% alumina ceramic substrate combined with an oxygen-free copper sintering process, offering excellent thermal conductivity and high structural strength; sealed with 704 silicone rubber for moisture and dust resistance, making it suitable for complex operating environments.

5. High-Current-Rated Leads: Comes standard with 200 mm of 18 AWG ultra-flexible silicone rubber wire. The thick gauge and high conductivity ensure stable transmission of high currents; terminal blocks can be added as needed for flexible installation within equipment.

6. Reversible Cooling and Heating: Upon powering on, one side cools while the other heats; switching the current direction quickly toggles between cooling and heating modes, allowing a single unit to meet both cooling and constant-temperature heating needs.

7. Quiet, Vibration-Free Operation: With no compressor or moving mechanical parts, the unit operates with zero noise and vibration, making it ideal for noise-sensitive environments such as medical aesthetics, healthcare, and precision instrumentation.

8. Easy Assembly and Storage: Uses eco-friendly bismuth-tin solder with a melting point of 138°C, simplifying soldering and assembly; stored at temperatures below 120°C and humidity below 60% RH, the unit maintains its performance during long-term storage.

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