TEC1-04910 Thermoelectric Cooler Peltier 30*30mm

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The TEC1-04910 is a 30x30mm standard-size semiconductor cooling module designed for high current (10A), with a maximum temperature difference of approximately 65–70°C and a cooling capacity of approximately 40–45W. 
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
🟩 Source Factory:Online Factory Video
🟫 Multiple Payment Methods:T/T|PayPal|Alipay
⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

🔷Thermoelectric Power Generator Product Drawing

🔷Peltier Cooling Element Basic Performance Spec


Type ModelChipΔTmax (°C)ACR (Ω)Umax (V)Imax (A)Pmax (W)Size (mm)
TEC1-04910K10600.455.8105830×30×3.4
TEC1-04910K14650.455.8105830×30×3.8
TEC1-04910K18700.455.8105830×30×4.2

🔷TEC Cooler Additional Performance Spec


ParameterSpecification
Substrate96% alumina 0.76mm + oxygen‑free copper 0.4mm, sintered process
Lead WireUltra‑soft silicone wire, 18 AWG, L=200mm
TerminalsNot included as standard; can be installed upon request
Mounting Pressure2.3 kg (0.25 kg/cm²)
PackagingPolystyrene (PS) foam box
Sealant704 silicone rubber
Max. Temperature ResistanceTin‑lead solder, melting point 138°C
Storage ConditionsTemperature < 120°C, Humidity < 60% RH

🔷Thermoelectric Generator Modules Performance Curve

🔷Cooler with Peltier Product Overview

The TEC1-04910 is a 30x30mm standard-size semiconductor cooling module designed for high current (10A), with a maximum temperature difference of approximately 65–70°C and a cooling capacity of approximately 40–45W. This product is noise-free, vibration-free, and maintenance-free, and can switch between cooling and heating modes by reversing the current direction. With its powerful and efficient performance, it is suitable for applications requiring high-efficiency cooling, such as car refrigerators, laser cooling, and high-power electronic equipment.

🔷Thermoelectric Cooler Product Features

1. High-Power Cooling: Featuring a 12A high-current design with a maximum cooling power of 70W, it delivers powerful cooling performance.


2. Wide Temperature Difference Capability: The maximum temperature difference (ΔTmax) ranges from 65 to 70°C, making it suitable for applications requiring a large temperature difference.


3. Compact Design: Features a standard 30x30mm package with a thickness of 3.4–3.8 mm; different thicknesses are available depending on the internal chip.


4. Reliable Performance: Offers the common advantages of semiconductor cooling chips, including noise-free operation, vibration-free operation, maintenance-free operation, and precise temperature control.


5. Flexible Operation: Switching between cooling and heating modes is achieved simply by reversing the current direction.

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