TEC1-04902 Thermoelectric Cooler Peltier 15*15mm

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The TEC1-04902 is a miniature semiconductor cooling module that balances coverage of moderate temperature differences with low-power operation. Measuring just 15 × 15 mm, it is specifically designed for portable devices with extremely limited space but certain requirements for cooling depth.
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🟨 MOQ:1 Pcs
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🔷Thermoelectric Module Product Drawing

🔷Thermoelectric Peltier Basic Performance Spec

Type ModeChip ModelΔTmax (°C)ACR (Ω)Umax (V)Imax (A)Pmax (W)Size (mm)
TEC1-04902K10602.065.82.21315×15×3.0
TEC1-04902K12652.065.82.21315×15×3.2
TEC1-04902K14702.065.82.21315×15×3.4


🔷TEG Module Additional Performance Spec

ParameterSpecification
Substrate Material96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process
Lead Wire SpecificationSilicone wire, 26 AWG, L = 100 mm
Terminal SpecificationNot included as standard; available upon request
Assembly Pressure0.5 kg (0.25 kg/cm²)
Packaging StandardPolystyrene (PS) foam box
Sealant Material704 silicone rubber sealant
Maximum Temperature ResistanceBismuth-tin eco-friendly solder, melting point 138°C
Storage EnvironmentTemperature < 120°C, Humidity < 60% Rh


🔷Solid State Cooler Performance Curve

🔷Thermoelectric Power Generator Product Overview

The TEC1-04902 is a miniature semiconductor cooling module that balances coverage of moderate temperature differences with low-power operation. Measuring just 15 × 15 mm, it is specifically designed for portable devices with extremely limited space but certain requirements for cooling depth.


This product is available in three crystal configurations—K10, K12, and K14—with thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It has a maximum voltage of 5.8V, a maximum current of 2.2A, a maximum cooling power of 13W, and an internal resistance of 2.06Ω.


Compared to the 20×20mm version of the TEC1-04902 (which also features 2.2A/13W/70°C, an internal resistance of 2.06Ω, and dimensions of 20×20×3.4–4.4mm), the 15×15 mm version reduces the package area by 43.75% (from 400 mm² to 225 mm²) while maintaining exactly the same electrical parameters and temperature difference performance; it also reduces the thickness to 3.0–3.4 mm and increases the power density from 32.5 mW/mm² to 57.8 mW/mm². Additionally, the 15×15 mm version achieves a maximum temperature difference of 70°C—5°C higher than the similarly sized TEC1-04901 (15×15 mm, maximum 65°C)—making it the model in the 15×15 mm series with the widest temperature difference range and moderate power consumption.

🔷Element Peltier Product Applications

1. Smartphone Thermal Management

The ultra-thin design (3.0 mm) of the TEC1-04902 allows it to be embedded in the tiny gap between the smartphone’s motherboard and screen, providing localized active cooling for the SoC chip. This reduces the chip’s surface temperature by 8–12°C, effectively preventing thermal throttling and improving the smoothness of gaming and video rendering. The 13W power consumption can be briefly supported by the smartphone’s battery (during intermittent operation).


2. Wearable Devices

Wearable devices such as smartwatches and AR/VR headsets generate significant heat when running high-performance applications. With its 15×15 mm dimensions and 3.0 mm thickness, the TEC1-04902 can be mounted directly on the surface of the main control chip to actively cool the device by 5–8°C during intensive operation, while impacting battery life by less than 15% per charge.


3. Optical Communications and Miniature Optical Modules

Devices such as SFP/SFP+ optical modules, silicon photonics chips, and miniature EDFAs have extremely limited internal space. The TEC1-04902’s 15×15 mm dimensions align perfectly with standard optical module packaging, stabilizing the laser wavelength within ±0.05 nm of the ITU channel center, making it an ideal choice for next-generation temperature control solutions in miniaturized optical modules.


4. Infrared Temperature Measurement and Thermal Imaging Equipment

In devices such as handheld infrared thermometers and miniature thermal imagers (e.g., modules with 32×32 resolution), sensors require a stable temperature reference to reduce thermal noise. The TEC1-04902 can maintain the sensor temperature at a constant 25°C with a power consumption of only 2–4 W, enabling handheld devices to operate continuously for 6–8 hours on a single charge.


5. Portable Medical Diagnostics and POCT Devices

Rapid on-site testing devices, such as handheld PCR analyzers and temperature control modules for microfluidic chips, require lithium-ion battery power and must operate continuously for several hours. In constant-temperature amplification applications at 60–65°C, the TEC1-04902 maintains a temperature accuracy of ±0.1°C with an actual power consumption of only 4–7 W; when paired with a 7.4 V/2000 mAh lithium-ion battery, it supports 3–5 hours of continuous operation.


6. Biological Sample Cold Chain and Personal Healthcare

For products such as portable insulin pen coolers and vaccine transport containers (2–8°C), the TEC1-04902, paired with a 3.7V/3000mAh lithium-ion battery, can maintain a constant temperature for 4–6 hours, making it suitable for personal daily use and short-distance cold-chain delivery within cities.


7. Consumer Electronics and Portable Cooling

For products such as cooling back clips for gaming phones, outdoor cooling neck warmers, portable mini cosmetic refrigerators, and personal beverage coolers, the TEC1-04902 can be powered by a standard 5V/2A USB power source or power bank without requiring a dedicated adapter. The cold side temperature can reach 5–10°C, providing significant cooling performance.


8. Thermal Management for Drones and Lightweight Robots

Flight control chips and video transmission modules in small drones experience significant temperature rises during flight. The TEC1-04902 is compact (15×15 mm) and lightweight (approximately 5 g), enabling active cooling during flight intervals to extend device lifespan.


9. Chip-Level Direct Cooling

With its 15×15 mm dimensions, the TEC1-04902 can be directly mounted onto the surface of IC packages such as FPGAs, ASICs, and AI inference chips. Utilizing its moderate power output of 13 W, it reduces chip hotspot temperatures by 8–12°C, enhancing sustained computing power output.


10. Precision Laboratory Instruments

For equipment such as thermostatic cuvettes in compact spectrophotometers and temperature compensation modules for pH electrodes, the TEC1-04902’s gentle cooling characteristics prevent thermal shock to samples. Additionally, it operates vibration-free and noise-free (< 20 dB), ensuring it does not interfere with precision measurements or microscopic observations.

🔷Peltier Cooling Element Product Show

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