🔷Thermoelectric Peltier Device Product Drawing

🔷Peltier Device Basic Performance Spec

🔷Thermoelectric Module Additional Performance Spec

🔷Thermoelectric Peltier Performance Curve

🔷TEG Module Product Overview

The TEC1-03101 is a miniature semiconductor cooling module designed for ultra-low-power, high-efficiency deep cooling. With dimensions of just 15×15 mm, it is one of the lowest-power, highest-efficiency miniature TECs currently available on the market, specifically engineered for battery-powered applications with extremely limited space.

This product is available in three crystal configurations—K18, K28, and K38—with thicknesses of 3.8 mm, 4.8 mm, and 5.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-side temperature of Th=40°C). It has a maximum voltage of just 3.7V, a maximum current of just 1.4A, a maximum cooling power of just 5W, and an internal resistance of 2.06Ω.

Compared to the 15×15mm TEC1-03102 (2.2A/8W/1.31Ω/60–70°C), the TEC1-03101 reduces current by 36% (1.4A vs. 2.2A) and power consumption is reduced by 37.5% (5W vs. 8W), while maintaining the same maximum temperature difference of 70°C, resulting in a significant improvement in energy efficiency—it can generate a temperature difference of 14°C per watt of power consumption (70°C/5W), while the TEC1-03102 achieves 8.75°C/W, representing an energy efficiency improvement of approximately 60% and making it the most energy-efficient model in the current product line.

Compared to the 15×15mm TEC1-04901 (1.4A/8W/3.23Ω/60–70°C/5.8V), both operate at the same current (1.4A), but the TEC1-03101 has lower power consumption (5W vs. 8W), operates at a lower voltage (3.7V vs. 5.8V), and offers higher energy efficiency (14°C/W vs. 8.75°C/W). It leads across all key metrics and is particularly well-suited for applications with extremely stringent power consumption requirements.

Compared to the 15×15mm TEC1-03103 (3A/11W/0.96Ω/60–70°C), the TEC1-03101 consumes less than half the power (5W vs. 11W) and offers 2.2 times the energy efficiency (14°C/W vs. 6.36°C/W), making it the ultimate choice for ultra-low-power applications.

This product is the flagship ultra-low-power model in the 15×15mm series, offering the lowest power consumption, highest energy efficiency, and widest temperature range coverage.

🔷Solid State Cooler Product Applications

1. Ultra-micro wearable devices

Ultra-micro wearable devices such as smart rings, continuous glucose monitors (CGMs), and EEG monitoring patches have internal volumes of less than 5 cm³ and battery capacities of less than 200 mAh. With its 15×15 mm dimensions and 5 W power consumption, the TEC1-03101 can actively cool the core chip by 5–8°C while affecting battery life by less than 5%.

2. Implantable and Body-Worn Medical Devices

Body-worn devices such as insulin patch pumps, Holter ECG patches, and drug iontophoresis devices have extremely stringent requirements for power consumption, size, and safety. The TEC1-03101’s ultra-low power consumption ensures that devices operate for extended periods without overheating, while its low current of 1.4A ensures electrical safety.

3. Miniature Optical Modules and Optical Communication Components

Components such as SFP/SFP+ optical modules, silicon photonics chips, and miniature EDFAs have extremely limited internal space. The TEC1-03101’s 15×15 mm dimensions align perfectly with standard optical module packaging. At an ambient temperature of 25°C, the actual power consumption required to maintain a constant laser temperature can be as low as 0.3–0.8 W, making it an ideal choice for ultra-low-power optical modules.

4. Button-Cell-Powered IoT Sensors

For devices such as miniature environmental sensors and RFID temperature tags powered by CR2032 button cells (capacity approximately 220 mAh), the TEC1-03101 can operate intermittently (e.g., cooling for 5 minutes per hour) with an average power consumption of <30 mW, enabling autonomous temperature control for several months.

5. Energy-Harvesting Power Systems

For off-grid devices powered by small solar panels (e.g., 5V/50mA), thermoelectric generators (TEGs), or vibration energy harvesters, the TEC1-03101’s 5W power consumption and 3.7V voltage perfectly match the output characteristics of energy-harvesting systems.

6. Quantum Dots and Single-Photon Detectors

Quantum optical devices, such as quantum dot lasers and SPAD (single-photon avalanche diodes), are extremely temperature-sensitive and have minimal thermal loads (< 100 mW). The TEC1-03101’s gentle cooling characteristics enable precise temperature control to ±0.01°C without introducing electrical noise or vibration.

7. Ultra-Precision MEMS Sensors

Sensors such as MEMS gyroscopes, accelerometers, and micromechanical resonators are significantly affected by temperature in terms of zero-bias stability. The TEC1-03101 can maintain the sensor temperature at a constant 25°C ±0.05°C with a power consumption of only 0.5–1.5 W, significantly improving measurement accuracy.

8. Biochips and Organ-on-a-Chip

Cell culture areas in microfluidic biochips and organ-on-a-chip devices require precise temperature control at 37°C with minimal thermal load (< 500 mW). The TEC1-03101 provides a vibration-free, electromagnetic interference-free, temperature-controlled environment.

9. Direct Chip-Level Cooling

For surface-mount cooling of low-power MCUs, Bluetooth/Wi-Fi modules, MEMS microphones, and other chips, the TEC1-03101 can reduce chip temperature by 5–10°C, improving stability.

10. Consumer Electronics and Portable Cooling

For products such as cooling back covers for gaming smartphones, outdoor cooling neck warmers, and miniature cosmetic refrigerators, the TEC1-03101 can be powered by a 5V/2A USB power source or a power bank, eliminating the need for a dedicated adapter.

🔷Thermoelectric Power Generator Product Structure