TEC1-03105 Thermoelectric Cooler Peltier 15*15mm

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The TEC1-03105 is a miniature semiconductor cooling module designed for medium-power cooling and high-density temperature control. With dimensions of just 15 × 15 mm, it delivers powerful cooling performance within an extremely compact footprint, making it the ideal temperature control core for high-performance, compact devices.
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
🟩 Source Factory:Online Factory Video
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🔷TEC Peltier Product Drawing

🔷TEC Module Basic Performance Spec

Type ModeChip ModelΔTmax (°C)ACR (Ω)Umax (V)Imax (A)Pmax (W)Size (mm)
TEC1-03105K10600.583.75.01915×15×3.0
TEC1-03105K12650.583.75.01915×15×3.2
TEC1-03105K14700.583.75.01915×15×3.4


🔷Thermoelectric Cooler Module Additional Performance Spec

ParameterSpecification
Substrate Material96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process
Lead Wire SpecificationSilicone wire, 22 AWG, L = 100 mm
Terminal SpecificationNot included as standard; available upon request
Assembly Pressure0.5 kg (0.25 kg/cm²)
Packaging StandardPolystyrene (PS) foam box
Sealant Material704 silicone rubber sealant
Maximum Temperature ResistanceBismuth-tin eco-friendly solder, melting point 138°C
Storage EnvironmentTemperature < 120°C, Humidity < 60% Rh


🔷Thermoelectric Peltier Module Performance Curve

🔷Cooling Module Product Overview

The TEC1-03105 is a miniature semiconductor cooling module designed for medium-power cooling and high-density temperature control. With dimensions of just 15 × 15 mm, it delivers powerful cooling performance within an extremely compact footprint, making it the ideal temperature control core for high-performance, compact devices.


This product is available in three chip configurations—K10, K12, and K14—with thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It operates at a maximum voltage of just 3.7V, a maximum current of 5A, and a maximum cooling power of 19W, with an internal resistance of only 0.58Ω.


Compared to the 15×15mm TEC1-03104 (4A/15W/0.72Ω/60–70°C; availability of this model must be confirmed separately), the TEC1-03105 maintains the same maximum temperature difference of 70°C while increasing the current to 5A and the power to 19W, offering even stronger cooling performance while still maintaining ultra-low voltage drive capability at 3.7V and extremely high power density.

🔷Tec Thermoelectric Cooler Product Features

1. Ultra-compact Design with Industry-Leading Power Density

Despite its ultra-compact 15×15 mm package and a thickness of just 3.0–3.4 mm, it delivers a cooling power of up to 19 W, with a cooling power density of 8.4 W/cm², placing it at the forefront of comparable products.


2. Ultra-Low Voltage Operation, Direct Power from a Single Battery

With a maximum voltage of just 3.7V, it is perfectly matched to a single lithium-ion battery and requires no boost circuit. It delivers a high output power of 19W at 3.7V, offering extremely high power efficiency.


3. High-current design, powerful cooling

With a maximum current of 5A and a power output of 19W, it delivers robust cooling performance within an extremely compact 15×15mm footprint, making it ideal for compact devices with high thermal loads.


4. Extremely Low Internal Resistance, High Energy Conversion Efficiency

With an internal resistance of just 0.58Ω and Joule heat loss (I²R) of 14.5W, more electrical energy is converted into effective cooling capacity rather than self-generated heat, resulting in outstanding energy efficiency.


5. Full Temperature Difference Coverage, Flexible Selection

Available in three temperature difference ratings—60°C, 65°C, and 70°C—to cover all requirements from standard cooling to deep cooling.


6. Ultra-Thin Design, Saves Vertical Space

With a thickness of just 3.0–3.4 mm, it is one of the thinnest models in the 15×15 mm series, making it suitable for ultra-thin devices with strict vertical space constraints.


7. High-Quality Substrate, Lightweight Design

The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.2 mm), resulting in a lightweight, low-thermal-capacity unit that facilitates rapid temperature response.


8. Thick-Gauge Leads for Safe 5A Current Carrying Capacity

Comes standard with 22 AWG silicone-coated wire (100 mm in length), whose current-carrying capacity is fully matched to the 5A operating current, ensuring safe and reliable high-current transmission.


9. Sealed Protection for Strong Environmental Adaptability

Sealed around the perimeter with 704 silicone rubber, it offers excellent moisture, dust, and shock resistance.


10. Bidirectional Temperature Control, Dual-Function Single Element

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.


11. Fast Response, Superior Dynamic Temperature Control

The low-resistance, high-current design results in a short thermal time constant, allowing the element to reach a steady-state temperature difference within a very short time (<3 seconds) after power-on.

🔷Semiconductor Cooler Product Structure

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