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The TEC1-03103 is a semiconductor cooling module designed for ultra-miniaturized, low-to-medium-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for micro-devices, optical modules, and sensors with extremely limited space. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Tec Thermoelectric Cooler Product Drawing
🔷Semiconductor Cooler Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03103 | K10 | 60 | 0.96 | 3.7 | 3.0 | 11 | 10×10×3.2 |
🔷TEC Peltier Module Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 0.25 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Heater Cooler Performance Curve
🔷Advanced TEC Product Overview
The TEC1-03103 is a semiconductor cooling module designed for ultra-miniaturized, low-to-medium-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for micro-devices, optical modules, and sensors with extremely limited space.
This product features a K10 chip configuration with a thickness of 3.2 mm and a maximum cooling temperature difference of 60°C (under a hot-side temperature of Th=40°C). It operates at a maximum voltage of just 3.7 V, a maximum current of 3 A, and a maximum cooling power of 11 W, with an internal resistance of 0.96 Ω.
Its 10×10 mm world-class micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, endoscope probes, and micro-sensors. While delivering an effective temperature difference of 60°C and a cooling power of 11 W, the package occupies an area of only 100 mm², making it one of the world’s smallest high-performance cooling chips. This product utilizes a 96% alumina ceramic substrate and a 0.2 mm oxygen-free copper sintering process, achieving a perfect balance between excellent thermal conductivity and electrical insulation. With a substrate thickness of just 0.76 mm and a copper layer of only 0.2 mm, the assembly is extremely lightweight, has minimal thermal mass, and offers rapid temperature response. It comes standard with 26 AWG ultra-soft silicone rubber leads (100 mm in length); the flexible leads exert virtually no mechanical stress on the micro-chiller, making it suitable for high-precision mounting. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling it to adapt to a variety of complex operating environments. The all-solid-state design ensures precise operation with zero noise and zero vibration. With a medium-to-low power consumption of 11W and a low operating voltage of 3.7V, it can be powered directly by a single lithium battery without the need for an additional boost circuit, making it the ideal temperature control core for battery-powered, ultra-portable devices.
🔷Thermoelectric Cooling Devices Product Features
1. World-leading miniaturization for minimal space requirements
With an ultra-compact 10×10 mm package size and a thickness of just 3.2 mm, it is one of the smallest semiconductor cooling chips on the global market and can be easily integrated into various ultra-compact devices.
2. Low-to-medium power consumption with excellent battery life
With a maximum current of 3A and maximum power of 11W, it delivers ample cooling capacity despite its extremely compact size, while maintaining moderate power consumption, making it ideal for battery-powered portable devices.
3. Ultra-Low Voltage Operation, Direct Single-Cell Power Supply
With a maximum operating voltage of just 3.7V, it is directly compatible with a single lithium-ion battery (3.0–4.2V), eliminating the need for any boost circuits. This ensures high power supply efficiency and low system costs.
4. Ample cooling capacity with a wide temperature differential range
Achieves a maximum cooling temperature differential of 60°C at 11W power consumption, with the cold end reaching as low as approximately -20°C, covering the standard cooling needs of most micro-devices.
5. High-Quality Substrate, Lightweight Design
The substrate is manufactured using a sintering process combining 96% aluminum oxide ceramic (0.76 mm) and oxygen-free copper (0.2 mm), resulting in an extremely lightweight unit with low thermal mass and rapid temperature response.
6. Fine-Gauge Leads for Ultimate Lightweight Design
Comes standard with 26 AWG silicone-coated wire (100 mm in length). The fine gauge and flexible wire cause virtually no stress on the cooling plate, making it suitable for precision assembly.
7. Sealed Protection, Strong Environmental Adaptability
Sealed with 704 silicone rubber around the perimeter, it offers excellent moisture, dust, and shock resistance, enabling it to withstand complex environments with high humidity and significant temperature fluctuations.
8. Bidirectional Temperature Control, Dual-Function in a Single Core
Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.
9. Zero Noise, Zero Vibration, Precision Operation
The all-solid-state design contains no moving parts, ensuring completely silent and vibration-free operation—ideal for high-precision applications with strict noise and vibration requirements.
🔷Peltier Elements Product Structure
The TEC1-01701 is a flagship micro semiconductor cooling module designed for ultra-low-voltage operation, ultra-low power consumption, and deep cooling. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules on the global market, specifically engineered for extreme miniaturization, low-voltage power supplies (such as single-cell dry batteries and energy harvesting systems), and applications requiring ultra-long battery life. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01702 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and ultra-low-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage energy harvesting systems). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01703 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and precision temperature control at medium-to-low power levels. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage USB power sources). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01704 is a miniature semiconductor cooling module designed for ultra-low-voltage operation, high current, and high power density cooling. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring high-efficiency cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and USB 1.8V/2V low-voltage power supplies). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03101 is a flagship semiconductor cooling module designed for ultra-low power consumption, extreme miniaturization, and precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules currently available on the global market, specifically engineered for ultra-portable devices, micro-sensors, precision optical modules, and implantable medical devices where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a semiconductor cooling module designed for ultra-low power consumption and ultra-compact precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for ultra-portable devices, micro-sensors, and precision optical modules where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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