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The TEC1-01704 is a miniature semiconductor cooling module designed for ultra-low-voltage operation, high current, and high power density cooling. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring high-efficiency cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and USB 1.8V/2V low-voltage power supplies). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Peltier Module Cooler Product Drawing
🔷Peltiers Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-01704 | K10 | 60 | 0.39 | 2.0 | 4.0 | 8 | 10×10×3.0 |
| TEC1-01704 | K12 | 65 | 0.39 | 2.0 | 4.0 | 8 | 10×10×3.2 |
| TEC1-01704 | K14 | 70 | 0.39 | 2.0 | 4.0 | 8 | 10×10×3.4 |
🔷Thermoelectric Peltier Device Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process |
| Lead Wire Specification | Silicone wire, 24 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 0.25 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Device Performance Curve
🔷Thermoelectric Module Product Overview
The TEC1-01704 is a miniature semiconductor cooling module designed for ultra-low-voltage operation, high current, and high power density cooling. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring high-efficiency cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and USB 1.8V/2V low-voltage power supplies).
This product is available in three die configurations—K10, K12, and K14—with thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It operates at a maximum voltage of just 2.0V (the lowest in the entire series), with a maximum current of 4A, a maximum cooling power of 8W, and an internal resistance of only 0.39Ω (the lowest in the entire series).
Its 10×10 mm world-class micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, and endoscope probes. While delivering a maximum cooling temperature difference of 70°C and a cooling power of 8W, the package area is only 100 mm². The product’s core advantage lies in its ultra-low drive voltage of 2.0V—the lowest in the entire series. It can be powered directly by a single dry cell (1.5V), a series-connected nickel-metal hydride battery (1.2V), or a small solar cell (2V output), without requiring any boost circuits, greatly expanding the possibilities for active cooling in low-voltage power supply scenarios. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.2 mm oxygen-free copper, achieving excellent thermal conductivity and electrical insulation. The ultra-low internal resistance of 0.39 Ω results in extremely low Joule heating loss even at a high current of 4 A, ensuring high electrical energy conversion efficiency. It comes standard with 24 AWG silicone-coated leads that safely carry a 4 A current. Sealed with 704 silicone rubber, it is fully solid-state, noise-free, and vibration-free, making it suitable for precision applications with strict noise and vibration requirements.
🔷Thermoelectric Peltier Operation Principle
TEC1-01704 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. The oxygen-free copper layer is only 0.2 mm thick, effectively reducing thermal capacity and weight, resulting in a more responsive temperature response.
When a forward DC voltage (up to 2.0 V) is applied, a 4 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As the charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.
The core advantage of this product lies in the synergistic design of an ultra-low drive voltage of 2.0V and an ultra-low internal resistance of 0.39Ω. The low voltage allows the product to be powered directly by two dry cell batteries (3V in series, stepped down to 2V) or a small solar cell, eliminating the need for a DC-DC boost converter and avoiding the 10–20% efficiency loss associated with boost circuits. The ultra-low internal resistance of 0.39Ω ensures minimal Joule heating at a high current of 4A, allowing more electrical energy to be converted into effective cooling capacity rather than self-generated heat. At a hot-end temperature of 40°C, the K14 model achieves a maximum temperature difference of 70°C, with the cold end reaching as low as approximately -30°C, delivering deep cooling within an ultra-compact 10×10mm footprint.
🔷TEG Module Product Show
The TEC1-01701 is a flagship micro semiconductor cooling module designed for ultra-low-voltage operation, ultra-low power consumption, and deep cooling. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules on the global market, specifically engineered for extreme miniaturization, low-voltage power supplies (such as single-cell dry batteries and energy harvesting systems), and applications requiring ultra-long battery life. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01702 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and ultra-low-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage energy harvesting systems). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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The TEC1-03102 is a semiconductor cooling module designed for ultra-low power consumption and ultra-compact precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for ultra-portable devices, micro-sensors, and precision optical modules where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
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🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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