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The TEC1-03102 is a semiconductor cooling module designed for ultra-low power consumption and ultra-compact precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for ultra-portable devices, micro-sensors, and precision optical modules where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Controller Product Drawing
🔷Thermal Generators Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03102 | K12 | 60 | 1.31 | 3.7 | 2.2 | 8 | 10×10×3.2 |
🔷Thermoelectric Devices Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 0.25 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Element Cooler Performance Curve
🔷Thermoelectric Generator Product Overview
The TEC1-03102 is a semiconductor cooling module designed for ultra-low power consumption and ultra-compact precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for ultra-portable devices, micro-sensors, and precision optical modules where space is extremely limited.
This product features a K12 crystal configuration with a thickness of 3.2 mm and a maximum cooling temperature difference of 60°C (under a hot-end temperature of Th=40°C). It operates at a maximum voltage of just 3.7 V, a maximum current of 2.2 A, and a maximum cooling power of 8 W, with an internal resistance of 1.31 Ω.
Its 10×10mm world-leading micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, endoscope probes, and micro-sensors. While maintaining an effective temperature difference of 60°C and a cooling power of 8W, the package area is only 100mm², making it one of the world’s smallest high-performance cooling chips and enabling active temperature management for miniaturized devices. This product utilizes a 96% alumina ceramic substrate and a 0.2 mm oxygen-free copper sintering process, achieving a perfect balance between excellent thermal conductivity and electrical insulation—the substrate is only 0.76 mm thick, the copper layer is just 0.2 mm, and the total weight is less than 2 grams, resulting in extremely low thermal mass and extremely fast temperature response. It comes standard with 26 AWG ultra-soft silicone rubber leads (100 mm in length). The leads are extremely flexible and exert virtually no mechanical stress on the micro-cooling plate, making them suitable for precision mounting and micron-level assembly. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the device to operate in complex environments with high humidity and significant temperature fluctuations. The all-solid-state design ensures precision operation with zero noise and zero vibration. With ultra-low power consumption of 8W and a low operating voltage of 3.7V, it can be powered directly by a single lithium battery for several hours without requiring any boost circuits, making it the ideal temperature control core for ultra-portable devices powered by coin cells or micro lithium batteries.
🔷Thermoelectric Cooler Product Selection
| 模型 | 热电偶对 | Umax（伏特） | Imax（安培） | DTmax（°C） | 瓦特 | 电阻器（Ω） | 长度（mm） | 宽度（mm） |
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
🔷Peltier Cooler Operation Principle
TEC1-03102 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. The oxygen-free copper layer is only 0.2 mm thick, effectively reducing thermal capacity and weight, resulting in a more responsive temperature response.
When a forward DC voltage (up to 3.7 V) is applied, a 2.2 A current drives the holes in the P-type material and the electrons in the N-type material to migrate in opposite directions. As the charge carriers cross the PN junction interface, the cold junction absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot junction releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.
This product achieves a maximum temperature difference of 60°C (K12 model) when the hot-end temperature is 40°C, meaning the cold end can reach as low as approximately -20°C. Achieving this temperature difference with an input power of 8 W demonstrates excellent energy efficiency. Due to its ultra-low power consumption, the device generates very little heat on its own and requires minimal cooling—in most applications, a miniature heat sink or even just the thermal radiation from the cooling plate’s own substrate is sufficient to meet heat dissipation needs, providing a viable temperature control solution for enclosed micro-devices where fans or heat sinks cannot be installed.
The TEC1-01701 is a flagship micro semiconductor cooling module designed for ultra-low-voltage operation, ultra-low power consumption, and deep cooling. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules on the global market, specifically engineered for extreme miniaturization, low-voltage power supplies (such as single-cell dry batteries and energy harvesting systems), and applications requiring ultra-long battery life. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01702 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and ultra-low-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage energy harvesting systems). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01703 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and precision temperature control at medium-to-low power levels. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage USB power sources). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-01704 is a miniature semiconductor cooling module designed for ultra-low-voltage operation, high current, and high power density cooling. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring high-efficiency cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and USB 1.8V/2V low-voltage power supplies). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03101 is a flagship semiconductor cooling module designed for ultra-low power consumption, extreme miniaturization, and precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules currently available on the global market, specifically engineered for ultra-portable devices, micro-sensors, precision optical modules, and implantable medical devices where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-03103 is a semiconductor cooling module designed for ultra-miniaturized, low-to-medium-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for micro-devices, optical modules, and sensors with extremely limited space. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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