🔷Thermoelectric Generation Product Drawing

🔷Thermoelectric Generator Modules Basic Performance Spec

🔷Thermo Cooler Additional Performance Spec

🔷Peltier Heater Performance Curve

🔷TEC Peltier Product Overview

The TEC1-01702 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and ultra-low-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage energy harvesting systems).

This product is available in three chip configurations—K10, K16, and K22—with thicknesses of 3.0 mm, 3.6 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of just 2.0V (the lowest in the entire series), a maximum current of 2.2A, a maximum cooling power of 4W, and an internal resistance of 0.71Ω.

Its 10×10mm world-class micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, and endoscope probes. While delivering a maximum cooling temperature difference of 70°C and 4W of cooling power, the package occupies an area of only 100mm². The product’s core advantage lies in its ultra-low drive voltage of 2.0V—it can be powered directly by two dry-cell batteries (3V in series, with simple voltage limiting), a small solar cell (2V output), a single nickel-metal hydride battery (1.2V, requiring two in series), or a low-voltage energy harvesting system. This eliminates the need for complex boost circuits, greatly expanding the possibilities for active cooling in low-voltage power supply scenarios. The 0.71Ω internal resistance ensures minimal Joule heating loss at a 2.2A current (I²R ≈ 3.4W), resulting in high electrical energy conversion efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76mm) and 0.2mm oxygen-free copper, achieving excellent thermal conductivity and electrical insulation, with a total weight of less than 2 grams. It comes standard with 26 AWG ultra-soft silicone rubber leads, which are extremely flexible. Sealed with 704 silicone rubber, it is fully solid-state, noise-free, and vibration-free. Its ultra-low power consumption of 4 W makes it particularly suitable for ultra-miniaturized devices powered by button cells or micro lithium batteries.

🔷TEC Module Product Applications

1. Low-Voltage Portable Devices

Portable devices powered by two dry-cell batteries (3V) or small solar cells—such as outdoor environmental monitors and handheld detectors—can be directly powered by batteries thanks to the TEC1-01702’s ultra-low drive voltage of 2.0V, eliminating the need for a boost circuit. This significantly reduces system power consumption and cost while extending the battery replacement interval.

2. Temperature Control for Micro Camera Modules

Image sensors in micro cameras and endoscope probes are temperature-sensitive, and heat generation can affect image quality. With its 10×10 mm size, the TEC1-01702 can be mounted on the back of the sensor; its 4 W power rating effectively reduces thermal noise and improves image clarity.

3. Micro-Optical Modules and Optical Communication Devices

Devices such as 10G/25G SFP+ optical modules and silicon photonics chips are temperature-sensitive and have extremely limited space. The TEC1-01702’s 10×10 mm size allows it to be seamlessly integrated into standard optical module packages, and its low-voltage 2V drive characteristic ensures perfect compatibility with the module’s internal low-voltage power rails, maintaining laser wavelength stability.

4. Ultra-Micro Wearable Devices

Ultra-micro wearable devices such as smart rings, continuous glucose monitors (CGMs), and EEG monitoring patches have internal volumes of < 2 cm³ and battery capacities of < 100 mAh. The TEC1-01702’s 10×10 mm size and 4 W power consumption enable active cooling of core chips with minimal impact on battery life.

5. Implantable and Body-Worn Medical Devices

Body-worn devices such as insulin patch pumps, Holter ECG patches, and drug iontophoresis devices have extremely stringent requirements for power consumption, size, and safety. The TEC1-01702’s ultra-low 2V operating voltage ensures electrical safety, while its ultra-low 4W power consumption ensures the device operates for extended periods without overheating.

6. Button-Cell-Powered IoT Sensors

For devices such as miniature environmental sensors and RFID temperature tags that use CR2032 button cells (capacity approximately 220 mAh), the TEC1-01702 can operate intermittently (e.g., cooling for 3 minutes per hour) with an average power consumption of < 20 mW, enabling autonomous temperature control for several months.

7. Energy-Harvesting Power Systems

For off-grid devices powered by small solar panels (2 V/50 mA), thermoelectric generators (TEGs), or vibration energy harvesters, the TEC1-01702’s 2 V/4 W characteristics perfectly match the output characteristics of energy-harvesting systems, enabling self-sustaining temperature control.

8. Quantum Dots and Single-Photon Detectors

Quantum optical devices, such as quantum dot lasers and SPAD (single-photon avalanche diodes), are extremely temperature-sensitive and have minimal thermal loads (< 100 mW). The TEC1-01702’s gentle cooling capability allows for precise temperature control to within ±0.01°C without introducing electrical noise or vibration.

9. Ultra-Precision MEMS Sensors

For sensors such as MEMS gyroscopes and accelerometers, zero-bias stability is significantly affected by temperature. The TEC1-01702 can maintain the sensor temperature at a constant 25°C ±0.05°C, significantly improving measurement accuracy.

10. Direct Chip-Level Cooling

For surface-mount cooling of low-power MCUs, Bluetooth/Wi-Fi modules, MEMS microphones, and other chips, the TEC1-01702 can reduce chip temperature by 5–8°C, thereby improving stability.

🔷Thermoelectric Cooler Module Installation and Usage Recommendations

Assembly Pressure: Recommended 0.25 kg (0.25 kg/cm²). It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.

Heat Sink Requirements: With an extremely low power consumption of 4 W, in most scenarios, a 15 × 15 × 10 mm micro heat sink is sufficient—or active cooling may not even be necessary, as natural convection or heat dissipation through the device enclosure is adequate.

Power Supply Requirements: Maximum voltage 2.0 V, maximum current 2.2 A. You can use two dry-cell batteries connected in series and stepped down to 2 V via an LDO regulator, or use a low-voltage regulated power supply rated at 2 V/2.5 A or higher. Recommended power supply ripple: < 50 mV.

Lead Wires: Comes standard with 26 AWG silicone-coated wires, which fully meet the 2.2 A requirement and do not need to be replaced.

Current Limitation: Do not exceed 2.2A; it is recommended to connect a 2.5A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation, and apply conformal coating to the lead solder joints.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.