🔷Peltier Module Product Drawing

🔷TEC Cooler Basic Performance Spec

🔷Thermoelectric Cooler Peltier Additional Performance Spec

🔷Peltier Cooling Module Performance Curve

🔷Peltier Effect CoolerPeltiers Product Overview

The TEC1-03101 is a flagship semiconductor cooling module designed for ultra-low power consumption, extreme miniaturization, and precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules currently available on the global market, specifically engineered for ultra-portable devices, micro-sensors, precision optical modules, and implantable medical devices where space is extremely limited.

This product features a K20 chip configuration with a thickness of 4.0 mm and a maximum cooling temperature difference of 60°C (under a hot-end temperature of Th=40°C). It operates at a maximum voltage of just 3.7 V, a maximum current of 1.4 A, and a maximum cooling power of 5 W, with an internal resistance of 2.06 Ω.

Its 10×10 mm world-leading micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, endoscope probes, and micro-sensors. While maintaining an effective temperature difference of 60°C and a cooling power of 5W, the package area is only 100 mm², making it one of the world’s smallest high-performance heat sinks and enabling active temperature management for miniaturized devices. This product utilizes a 96% alumina ceramic substrate and a 0.2mm oxygen-free copper sintering process, achieving a perfect balance between excellent thermal conductivity and electrical insulation—the substrate is only 0.76mm thick, the copper layer is just 0.2mm, and the total weight is less than 2 grams, resulting in extremely low thermal mass and extremely fast temperature response. It comes standard with 26 AWG ultra-soft silicone rubber leads (100 mm in length). The leads are extremely flexible and exert virtually no mechanical stress on the micro-cooling plate, making them suitable for precision mounting and micron-level assembly. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the device to operate in complex environments with high humidity and significant temperature fluctuations.

🔷Cooler with Peltier Product Applications

1. Ultra-micro wearable devices

Ultra-micro wearable devices such as smart rings, continuous glucose monitors (CGMs), and EEG monitoring patches have internal volumes of less than 2 cm³ and battery capacities of less than 100 mAh. With its 10×10 mm dimensions and 5 W power consumption, the TEC1-03101 can actively cool the core chip by 5–8°C while affecting battery life by less than 5%.

2. Temperature Control for Micro Camera Modules

Image sensors in devices such as micro cameras, endoscopic cameras, and industrial endoscope probes are temperature-sensitive; heat generation can affect image quality. The TEC1-03101’s 10×10 mm size allows it to be mounted on the back of the sensor, effectively reducing thermal noise and improving image clarity.

3. Implantable and Wearable Medical Devices

Wearable devices such as insulin patch pumps, Holter monitor patches, and drug iontophoresis devices have extremely high requirements for power consumption, size, and safety. The TEC1-03101’s ultra-compact size and ultra-low power consumption of 5W ensure that devices operate for extended periods without overheating, while its low current of 1.4A ensures electrical safety.

4. Micro-Optical Modules and Optical Communication Components

Components such as 10G/25G SFP+ optical modules and silicon photonics chips are temperature-sensitive and have extremely limited space. The TEC1-03101’s 10×10 mm size fits perfectly into standard optical module packages, and its actual power consumption is extremely low while maintaining a constant laser temperature at an ambient temperature of 25°C.

5. Button-Cell-Powered IoT Sensors

For devices such as miniature environmental sensors and RFID temperature tags powered by CR2032 button cells (capacity approximately 220 mAh), the TEC1-03101 can operate intermittently (e.g., cooling for 3 minutes per hour) with an average power consumption of < 30 mW, enabling autonomous temperature control for several months.

6. Quantum Dots and Single-Photon Detectors

Quantum optical devices, such as quantum dot lasers and SPAD (single-photon avalanche diodes), are extremely temperature-sensitive and have very low thermal loads (< 100 mW). The TEC1-03101’s gentle cooling characteristics allow for precise temperature control to within ±0.01°C without introducing electrical noise or vibration.

7. Ultra-Precision MEMS Sensors

Sensors such as MEMS gyroscopes, accelerometers, and micromechanical resonators are significantly affected by temperature in terms of zero-bias stability. The TEC1-03101 can maintain the sensor temperature at a constant 25°C ±0.05°C, significantly improving measurement accuracy.

8. Biochips and Microfluidic Chips

Cell culture areas in microfluidic biochips and organ-on-a-chip devices require precise temperature control at 37°C with minimal thermal load (< 500 mW). The TEC1-03101 provides a vibration-free, electromagnetic interference-free, temperature-controlled environment.

9. Direct Chip-Level Cooling

For surface-mount cooling of low-power MCUs, Bluetooth/Wi-Fi modules, MEMS microphones, and other chips, the TEC1-03101 can reduce chip temperature by 5–8°C, thereby improving stability.

🔷Peltier Device Cooler Product Structure