The TEC1-01701 is a flagship micro semiconductor cooling module designed for ultra-low-voltage operation, ultra-low power consumption, and deep cooling. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules on the global market, specifically engineered for extreme miniaturization, low-voltage power supplies (such as single-cell dry batteries and energy harvesting systems), and applications requiring ultra-long battery life. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Peltier Module Product Drawing

🔷Cooling Module Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-01701 | K14 | 60 | 1.11 | 2.0 | 1.4 | 3 | 10×10×3.4 |
| TEC1-01701 | K24 | 65 | 1.11 | 2.0 | 1.4 | 3 | 10×10×4.4 |
| TEC1-01701 | K34 | 70 | 1.11 | 2.0 | 1.4 | 3 | 10×10×5.4 |
🔷Tec Thermoelectric Cooler Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.2 mm), sintered process |
| Lead Wire Specification | Silicone wire, 26 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 0.25 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷TEC Peltier Module Performance Curve

🔷Peltier Heater Cooler Product Overview
The TEC1-01701 is a flagship micro semiconductor cooling module designed for ultra-low-voltage operation, ultra-low power consumption, and deep cooling. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules on the global market, specifically engineered for extreme miniaturization, low-voltage power supplies (such as single-cell dry batteries and energy harvesting systems), and applications requiring ultra-long battery life.
This product is available in three die configurations—K14, K24, and K34—with thicknesses of 3.4 mm, 4.4 mm, and 5.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). The maximum voltage is only 2.0 V (the lowest in the entire series), the maximum current is only 1.4 A, the maximum cooling power is only 3 W, and the internal resistance is 1.11 Ω.
Its world-leading 10×10mm micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, endoscope probes, and implantable medical devices. While delivering a maximum cooling temperature difference of 70°C and 3W of cooling power, the package area is only 100mm². The product’s core advantage lies in its combination of ultra-low power consumption—featuring an ultra-low drive voltage of 2.0V and an ultra-low operating current of 1.4A—making it the lowest-power model (only 3W) in the entire 10×10mm series. It can be powered directly by two dry-cell batteries (3V in series, with simple voltage limiting), a single lithium battery (3.7V, requiring step-down to 2V), a small solar cell (2V output), or an energy harvesting system, without the need for complex boost circuits. The 1.11Ω internal resistance ensures minimal Joule heating loss at 1.4A (I²R ≈ 2.2W) and high electrical energy conversion efficiency. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and 0.2 mm oxygen-free copper, achieving excellent thermal conductivity and electrical insulation, with a total weight of less than 2 grams. It comes standard with 26 AWG ultra-soft silicone rubber leads, which are extremely flexible. Sealed with 704 silicone rubber, it is fully solid-state, noise-free, and vibration-free. Its ultra-low power consumption of 3 W makes it the ideal temperature control core for ultra-miniaturized devices powered by button cells or micro lithium batteries, enabling exceptionally long battery life.
This product is also available in three thickness options ranging from 3.4 mm to 5.4 mm. The K34 model, with a thickness of 5.4 mm, provides ample grain space for deep cooling within an extremely small 10×10 mm area, which is key to achieving a large temperature difference of 70°C.
🔷Advanced TEC Product Selection
| 模型 | 热电偶对 | Umax(伏特) | Imax(安培) | DTmax(°C) | 瓦特 | 电阻器(Ω) | 长度(mm) | 宽度(mm) |
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
🔷Thermoelectric Cooling Devices Product Features
1. World-leading miniaturization for minimal space requirements
With an ultra-compact 10×10 mm package size, it is one of the smallest semiconductor cooling chips on the global market and can be easily integrated into a wide range of ultra-compact devices.
2. World’s Lowest Drive Voltage and Power Consumption, Direct Low-Voltage Power Supply
With a maximum voltage of just 2.0V and maximum power consumption of only 3W, this is the model with the lowest voltage and lowest power consumption in the entire series. It can be powered directly by two dry-cell batteries, a small solar cell (2V), a nickel-metal hydride battery, or a low-voltage energy harvesting system—without the need for a boost circuit. This significantly reduces system cost and complexity, making it particularly suitable for off-grid devices with limited power supplies.
3. Ultra-Low Power Consumption Operation, Ultra-Long Battery Life
With a maximum current of just 1.4A and a maximum power consumption of only 3W, this device supports extremely long periods of continuous operation when paired with button cells or micro lithium batteries (e.g., a CR2032 battery can operate for several months in intermittent mode), making it the ultimate temperature control solution for extremely miniaturized battery-powered devices.
4. Deep Cooling Capability: Small Size, Large Temperature Difference
It achieves a maximum temperature difference of 70°C while consuming an extremely low power of just 3W, with the cold end reaching as low as approximately -30°C. This covers all application scenarios from conventional cooling to deep cooling, delivering outstanding energy efficiency.
5. Three Chip Options for Flexible Adaptation
Three chip configurations are available: K14 (60°C), K24 (65°C), and K34 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.
6. Three Thickness Options to Suit Different Spaces
Thicknesses are 3.4 mm, 4.4 mm, and 5.4 mm. The K34 model, at 5.4 mm, is the thickest in the 10×10 mm series, which helps achieve deep cooling down to 70°C.
7. Extremely Gentle Cooling with Zero Impact on Sensitive Loads
With a cooling power of only 3W and an extremely gradual rate of temperature change, this product is ideal for ultra-sensitive devices with strict temperature change rate limitations—such as live biological samples, quantum dot optical components, and ultra-precision MEMS sensors—preventing thermal shock damage.
8. High-Quality Substrate, Lightweight Design
The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.2 mm), resulting in an extremely lightweight overall structure with low thermal mass and rapid temperature response.
9. Fine-Gauge Leads, Ultimate Lightweight Design
Standard 26 AWG silicone-insulated wire (100 mm in length) features the thinnest gauge and is extremely flexible, exerting virtually no stress on the cooling plate and making it suitable for micrometer-level precision assembly.
10. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling operation in complex environments with high humidity and significant temperature fluctuations.
11. Bidirectional Temperature Control, Dual-Function Single Core
Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.
12. Zero Noise, Zero Vibration, Precision Operation
The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision applications with the most stringent requirements for noise and vibration.
The TEC1-01702 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and ultra-low-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage energy harvesting systems). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-01703 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and precision temperature control at medium-to-low power levels. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage USB power sources). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-01704 is a miniature semiconductor cooling module designed for ultra-low-voltage operation, high current, and high power density cooling. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring high-efficiency cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and USB 1.8V/2V low-voltage power supplies). 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03101 is a flagship semiconductor cooling module designed for ultra-low power consumption, extreme miniaturization, and precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest high-performance semiconductor cooling modules currently available on the global market, specifically engineered for ultra-portable devices, micro-sensors, precision optical modules, and implantable medical devices where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03102 is a semiconductor cooling module designed for ultra-low power consumption and ultra-compact precision temperature control. With dimensions of just 10×10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for ultra-portable devices, micro-sensors, and precision optical modules where space is extremely limited. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03103 is a semiconductor cooling module designed for ultra-miniaturized, low-to-medium-power precision temperature control. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules currently available on the global market and is specifically designed for micro-devices, optical modules, and sensors with extremely limited space. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw