🔷Solid State Cooler Product Drawing

🔷Thermoelectric Power Generator Basic Performance Spec

🔷Element Peltier Additional Performance Spec

🔷Peltier Cooling Element Performance Curve

🔷TEC Cooling System Product Overview

The TEC1-01703 is a miniature semiconductor cooling module designed for ultra-low-voltage operation and precision temperature control at medium-to-low power levels. With dimensions of just 10 × 10 mm, it is one of the smallest semiconductor cooling modules on the global market and is specifically designed for ultra-compact devices requiring efficient cooling in low-voltage power supply systems (such as single-cell dry batteries, solar cells, and low-voltage USB power sources).

This product is available in three chip configurations—K10, K14, and K18—with thicknesses of 3.0 mm, 3.4 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It operates at a maximum voltage of just 2.0V (one of the lowest in the entire series), with a maximum current of 3A, a maximum cooling power of 6W, and an internal resistance of 0.52Ω.

Its 10×10mm world-class micro-package allows for easy integration into ultra-compact spaces such as micro-camera modules, optical modules, and endoscope probes. While delivering a maximum cooling temperature difference of 70°C and 6W of cooling power, the package occupies an area of only 100mm². The product’s core advantage lies in its ultra-low drive voltage of 2.0V—it can be powered directly by two dry-cell batteries (3V in series), a small solar cell (2V output), or a low-voltage power rail, eliminating the need for a boost circuit and greatly expanding the possibilities for active cooling in low-voltage power supply scenarios. The low internal resistance of 0.52Ω ensures minimal Joule heating at 3A current and high electrical energy conversion efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.2 mm oxygen-free copper, achieving excellent thermal conductivity and electrical insulation. It comes standard with 26 AWG silicone-coated leads that safely carry a 3 A current. Sealed with 704 silicone rubber, it is fully solid-state, noise-free, and vibration-free. Its 6 W medium-to-low power consumption and 3 A medium current provide a good balance between low-voltage power supply and cooling capacity.

🔷Thermoelectric Cooling Device Product Features

1. World-leading miniaturization for minimal space requirements

With an ultra-compact 10×10 mm package size and a thickness of just 3.0–3.8 mm, it is one of the smallest semiconductor cooling chips on the global market and can be easily integrated into various ultra-compact devices.

2. Ultra-Low Voltage Operation, Direct Low-Voltage Power Supply

With a maximum voltage of just 2.0V, it can be powered directly by two dry-cell batteries (3V, requiring simple voltage limiting), a small solar cell (2V), or a low-voltage power source, eliminating the need for a boost circuit and significantly reducing system cost and complexity.

3. Low-to-medium power consumption operation, excellent battery life

With a maximum current of 3A and maximum power of 6W, it delivers ample cooling capacity despite its extremely compact size, while maintaining moderate power consumption, making it ideal for battery-powered portable devices.

4. Low internal resistance design for efficient energy conversion

With an internal resistance of 0.52 Ω, the I²R Joule heat loss at a current of 3 A is only approximately 4.7 W, ensuring that more electrical energy is converted into effective cooling capacity rather than self-generated heat.

5. Full Temperature Range Coverage, Flexible Selection

Available in three chip configurations—K10 (60°C), K14 (65°C), and K18 (70°C)—to cover all application scenarios from standard cooling to deep cooling.

6. Three Thickness Options to Fit Different Spaces

Thicknesses are 3.0 mm, 3.4 mm, and 3.8 mm. the K18 model, at 3.8 mm thick, facilitates 70°C deep cooling.

7. High-Quality Substrate, Lightweight Design

The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.2 mm), resulting in an extremely lightweight overall structure with low thermal mass and rapid temperature response.

8. Fine-Gauge Leads for Ultimate Lightweight Design

Comes standard with 26 AWG silicone-coated wire (100 mm in length). The fine gauge and flexible wire cause virtually no stress on the cooling plate, making it suitable for precision assembly.

9. Sealed Protection, Strong Environmental Adaptability

Sealed with 704 silicone rubber around the perimeter, it offers excellent moisture, dust, and shock resistance, enabling it to withstand complex environments with high humidity and significant temperature fluctuations.

10. Bidirectional Temperature Control, Dual-Function in a Single Core

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

11. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design contains no moving parts, ensuring completely silent and vibration-free operation—ideal for high-precision applications with strict noise and vibration requirements.

🔷Thermoelectric Cooling Element Product Structure