TEC1-04906 Thermoelectric Cooler Peltier 25*25mm

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The TEC1-04906 is a 25×25mm semiconductor cooling module designed for a 6A current, with a maximum temperature difference of approximately 65–70°C and a cooling capacity of approximately 25–30W. 
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⬜ Product PDF Spec Contact Customer Service
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
🟩 Source Factory:Online Factory Video
🟫 Multiple Payment Methods:T/T|PayPal|Alipay
⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

🔷Thermal Generators Product Drawing

🔷Thermoelectric Devices Basic Performance Spec

Type ModelChipΔTmax (°C)R (Ω)Umax (V)Imax (A)Pmax (W)Size (mm)
TEC1-04906K10600.755.863525×25×3.4
K146525×25×3.8
K187025×25×4.2


🔷Peltier Element Cooler Additional Performance Spec

ParameterSpecification
Substrate96% alumina 0.76mm + oxygen‑free copper 0.4mm, sintered process
Lead WireSilicone wire, 22 AWG, L=100mm
TerminalsNot included as standard; can be installed upon request
Mounting Pressure1.5 kg (0.25 kg/cm²)
PackagingPolystyrene (PS) foam box
Sealant704 silicone rubber
Max. Temperature ResistanceTin‑lead solder, melting point 138°C
Storage ConditionsTemperature < 120°C, Humidity < 60% RH

🔷Thermoelectric Generator Performance Curve

🔷Thermoelectric Cooler Product Overview

The TEC1-04906 is a 25×25mm semiconductor cooling module designed for a 6A current, with a maximum temperature difference of approximately 65–70°C and a cooling capacity of approximately 25–30W. This product is noise-free, vibration-free, and maintenance-free, and can switch between cooling and heating modes by reversing the current direction. With its balanced performance, it is suitable for medium-power, precision temperature control applications such as portable mini-refrigerators, beauty devices, and medical equipment.

🔷Peltier Cooler Operation Principle

⚛️ Core Principle: The Peltier Effect

When a direct current passes through a circuit composed of two different semiconductor materials, heat is absorbed at one junction and released at the other. This is the basis for cooling.


🔩 Internal Structure: A Precision Thermelectric Stack

To achieve efficient “heat transport,” the TEC1-04906 consists of numerous pairs of P-type and N-type semiconductor grains arranged alternately:


P-type semiconductor: This can be understood as having a shortage of electrons, leaving “holes” as charge carriers.


N-type semiconductor: Contains excess free electrons as charge carriers.


These grains are connected in series via metal conductive strips (typically copper) to form a thermoelectric stack, which is sandwiched between two thermally conductive, insulated ceramic substrates. The ceramic substrates form the “cold side” and “hot side” of the cooling plate.


🔄 Operating Process: Heat Transfer in Three Steps

Electrical Drive: When a direct current is applied, electrons and holes move in a specific direction driven by an external electric field.


Heat Absorption at the Cold End: At the cold-end junction, electrons flow from the P-type semiconductor (lower energy level) into the N-type semiconductor (higher energy level). This process absorbs heat, lowering the temperature at that location and achieving cooling.


Heat Release at the Hot End: At the hot-end junction, electrons return from a higher energy level to a lower energy level, releasing heat and causing the temperature at that location to rise.


As long as power is continuously supplied, heat is continuously “pumped” from the cold end to the hot end. By reversing the current direction, the cold and hot ends switch places, allowing for a seamless transition between cooling and heating modes.

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