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The TEC1-20212 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 50 × 100 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Cooling Element Product Drawing
🔷Thermoelectric Generation Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-20212 | K10 | 60 | 1.56 | 24.0 | 12.0 | 288 | 50×100×3.4 |
| TEC1-20212 | K16 | 65 | 1.56 | 24.0 | 12.0 | 288 | 50×100×4.0 |
| TEC1-20212 | K22 | 70 | 1.56 | 24.0 | 12.0 | 288 | 50×100×4.6 |
🔷Thermoelectric Generator Modules Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 12.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermo Cooler Performance Curve
🔷Peltier Heater Product Overview
The TEC1-20212 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 50 × 100 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series.
This product is available in three crystal configurations—K10, K16, and K22—with thicknesses of 3.4 mm, 4.0 mm, and 4.6 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 12.0 A, a maximum cooling power of 288 W, and an internal resistance of just 1.56 Ω.
Its extra-large 50 × 100 mm rectangular package allows it to be embedded inside high-end, high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and top-tier extreme power cooling of 288W. The 50mm width and 100mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of extremely large-area loads. This product features a 24V high-voltage, 12.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 1.56Ω—the lowest in this series—Joule heat loss (I²R ≈ 224.6W) at a current of 12.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 100 mm × 50 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length), capable of safely carrying the high current of 12.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 12.5 kg (0.25 kg/cm²), ensuring a tight fit between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for top-tier, high-power large industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the ultimate flagship choice for cooling requirements involving ultra-large, high-power-density applications in spacious environments.
🔷TEC Peltier Product Applications
1. Temperature Control for High-Power, Large-Scale Industrial Laser Modules
High-power, large-scale industrial semiconductor laser modules generate a significant amount of heat during operation. The TEC1-20212’s 288W cooling capacity for top-tier, extreme-power applications enables efficient temperature control across an ultra-large 50×100mm area, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for top-tier, extreme-power laser processing, optical communications, and LIDAR systems.
2. Heat Dissipation for Large Industrial Equipment
High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-20212 can be mounted directly on the surface of these components; its 288W peak cooling capacity provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and service life.
3. Temperature Control for High-Performance Medical Equipment
High-end medical imaging equipment and large in-vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-20212 delivers powerful cooling capabilities thanks to its extra-large coverage area, maintenance-free operation, and stable performance.
4. Heat Dissipation for High-Power Communication Base Stations
High-power communication devices, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-20212 can be used for active cooling, and its 24.0V operating voltage is fully compatible with communication equipment power platforms.
🔷TEC Module Installation and Usage Recommendations
Assembly Pressure: Recommended 12.5 kg (0.25 kg/cm²). It is recommended to apply high-performance thermal grease (thermal conductivity > 5 W/m·K) evenly to both surfaces.
Hot-End Cooling Requirements (Critical): With a power consumption of 288 W, heat generation is extremely high. We recommend using a large extruded aluminum heatsink measuring at least 60 × 110 × 70 mm, paired with a high-airflow fan (airflow > 70 CFM), or implementing a water-cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.
Power Supply Requirements: Maximum voltage 24.0 V, maximum current 12.0 A. A regulated power supply rated at 24 V/14 A or higher is recommended. Power supply ripple < 50 mV.
Lead Wires: Standard configuration includes 18 AWG silicone-insulated wire (length 300 mm), rated for a safe current carrying capacity of 12.0 A.
Current Limit: Must not exceed 12.0A; it is recommended to connect a 14A self-resetting fuse in series.
Storage Conditions: Temperature < 120°C, humidity < 60% Rh.
Maximum Temperature: Must not exceed 138°C; soldering temperature < 280°C, duration < 5 seconds.
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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