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The TEC1-20208 is a flagship industrial semiconductor cooling module designed for extremely large surface areas and extreme, top-tier power density cooling. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring extreme power density, ultra-high-power laser modules, high-performance medical devices, and other applications demanding extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Peltier Device Cooler Product Drawing
🔷Peltier Module Cooler Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-20208 | K12 | 60 | 2.34 | 24.0 | 8.0 | 192 | 50×100×3.6 |
| TEC1-20208 | K22 | 65 | 2.34 | 24.0 | 8.0 | 192 | 50×100×4.6 |
| TEC1-20208 | K32 | 70 | 2.34 | 24.0 | 8.0 | 192 | 50×100×5.6 |
🔷Peltiers Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 12.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Peltier Device Performance Curve
🔷Peltier Device Product Overview
The TEC1-20208 is a flagship industrial semiconductor cooling module designed for extremely large surface areas and extreme, top-tier power density cooling. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring extreme power density, ultra-high-power laser modules, high-performance medical devices, and other applications demanding extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three chip configurations—K12, K22, and K32—with thicknesses of 3.6 mm, 4.6 mm, and 5.6 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 8.0 A, a maximum cooling power of 192 W, and an internal resistance of just 2.34 Ω.
Its extra-large 50 × 100 mm rectangular package allows it to be embedded inside high-end, high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and cooling for extreme, top-tier power levels of 192W. The 50mm width and 100mm length provide an extremely generous heat exchange area, facilitating the uniform transfer of cooling capacity to the surface of very large loads. This product features a 24V high-voltage, 8.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 2.34Ω—the lowest in this series—Joule heat loss (I²R ≈ 149.8W) at 8.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 100 mm × 50 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone rubber leads (300 mm in length), capable of safely handling the high current of 8.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state structure ensures precision operation with zero noise and zero vibration. The recommended mounting pressure is up to 12.5 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for large industrial laser modules operating at extreme, top-tier power levels; heat dissipation for large industrial equipment; high-performance medical devices; and high-power communication base stations. It is the premier flagship choice for cooling requirements involving extremely large areas and extreme, top-tier power density.
🔷Thermoelectric Module Product Features
1. Extra-large, symmetrical design with ample heat exchange area
The extra-large 50×100 mm rectangular package is one of the largest models in this series, providing an extremely generous heat exchange area that is suitable for large, high-end temperature-controlled devices operating at extreme power levels.
2. Extreme high-power cooling with top-tier performance
With a maximum current of 8.0A and a maximum power of 192W, it achieves top-tier power density cooling within its extra-large, high-surface-area package, making it the most powerful flagship model in the series.
3. Deep cooling capability with an extra-large surface area and wide temperature differential
At the maximum power of 192W, it achieves a temperature differential of up to 70°C, with the cold end reaching as low as approximately -30°C.
4. Three Chip Options for Flexible Adaptability
Offers three chip configurations: K12 (60°C), K22 (65°C), and K32 (70°C).
5. Ultra-Low Internal Resistance Design for High Energy Conversion Efficiency
With an internal resistance of just 2.34Ω, it is the model with the lowest internal resistance in this series. Joule heat loss is effectively controlled at a high current of 8.0A, allowing more electrical energy to be converted into effective cooling capacity.
6. Ultra-Thin Design to Save Vertical Space
With a thickness of only 3.6–5.6 mm, it maintains an excellent slim profile among models with extreme, top-tier power ratings.
7. Excellent Power Supply Compatibility
With a maximum voltage of 24.0V, it is highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms.
8. High-Quality Substrate, Excellent Heat Dissipation Over an Extra-Large Area
A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 100 mm × 50 mm.
9. Extra-Thick, Extra-Long Leads for Safe 8.0A Current Carrying Capacity
Comes standard with 18 AWG silicone-coated wires (300 mm in length), meeting the demands of high-current transmission and wiring for large-scale equipment.
10. Exceptional Adaptability to High Assembly Pressures
Recommended assembly pressure of 12.5 kg (0.25 kg/cm²), ensuring tight contact with extra-large heat sinks.
11. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.
12. Bidirectional Temperature Control, Dual-Function Single Core
Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.
13. Zero Noise, Zero Vibration, Precision Operation
Fully solid-state construction ensures completely silent and vibration-free operation.
🔷Thermoelectric Peltier Product Structure
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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