TEC1-20205 Thermoelectric Cooler Peltier 50*100mm

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The TEC1-20205 is a semiconductor cooling plate designed for ultra-large-area, ultra-high-power industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical packaging design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads.
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
🟩 Source Factory:Online Factory Video
🟫 Multiple Payment Methods:T/T|PayPal|Alipay
⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

🔷Peltier Elements Product Drawing

🔷Thermoelectric Controller Basic Performance Spec

Type ModeChip ModelΔTmax (°C)ACR (Ω)Umax (V)Imax (A)Pmax (W)Size (mm)
TEC1-20205K18603.7424.05.012050×100×4.2
TEC1-20205K28653.7424.05.012050×100×5.2
TEC1-20205K38703.7424.05.012050×100×6.2

🔷Thermal Generators Additional Performance Spec


ParameterSpecification
Substrate Material96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process
Lead Wire SpecificationSilicone wire, 20 AWG, L = 300 mm
Terminal SpecificationNot included as standard; available upon request
Assembly Pressure12.5 kg (0.25 kg/cm²)
Packaging StandardPolystyrene (PS) foam box
Sealant Material704 silicone rubber sealant
Maximum Temperature ResistanceBismuth-tin eco-friendly solder, melting point 138°C
Storage EnvironmentTemperature < 120°C, Humidity < 60% Rh

🔷Thermoelectric Devices Performance Curve


🔷Peltier Element Cooler Product Overview

The TEC1-20205 is a semiconductor cooling plate designed for ultra-large-area, ultra-high-power industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical packaging design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads.


This product is available in three crystal configurations—K18, K28, and K38—with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 5.0 A, a maximum cooling power of 120 W, and an internal resistance of 3.74 Ω.


The extra-large 50×100 mm rectangular package allows it to be embedded within ultra-high-power large-scale industrial equipment, ultra-high-power laser modules, and similar systems—while ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 120 W, the 50 mm width and 100 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of extra-large loads. This product features a 24V high-voltage, 5.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms. The low internal resistance of 3.74Ω effectively controls Joule heat loss (I²R ≈ 93.5W) at 5.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 100 mm × 50 mm ultra-large surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying the high current of 5.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 12.5 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.


This product is typically used in applications such as temperature control for ultra-high-power large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving ultra-high power and large-area spaces.

🔷Thermoelectric Generator Product Selection

模型热电偶对Umax(伏特)Imax(安培)DTmax(°C)瓦特电阻器(Ω)长度(mm)宽度(mm)
TEC-03102-30x6x3.25313.82.2674.61.37306
TEC-03102-30x6x3.3313.82.7665.71.11306
TEC-03104-30x6x3.3313.84.3668.90.71306
TEC-06102-30x5.7x3.1617.42678.13305.7
TEC-06503-30x7x2.55657.93.467151.85307
TEC-06302-38x7.6x3.04637.62.467102.59387.6
TEC-03102-30x8x3.8313.82.9676.11.03308
TEC-07102-30x8x2.9718.62.76712.72.6308
TEC-06502-8x40x3657.92.46710.72.59840
TEC-05304-30x9.8x3.1536.44.26715.11.22309.8
TEC-01704-10x10x3.1172.14.1684.70.41010
TEC-03101-10x10x3313.81.4682.92.21010
TEC-06303-60x10x3.7637.63.46714.41.816010
TEC-04901-12x12x2.9495.91.56753.151212
TEC-03102-15x15x4313.82.5665.31.191515
TEC-03102-15x15x3.8313.82.8665.91.071515
TEC-04904-15x15x3.1495.94.26713.91.131515
TEC-04804-15x15x3.32485.84.36613.71.11515
TEC-04902-18x18x4495.92.4677.82.021818
TEC-04902-20x20x4495.92.1666.82.322020
TEC-04903-20x20x3.6495.93.16610.11.552020
TEC-07102-20x20x4718.62.3661132020
TEC-07103-20x20x3.5718.63.366162.072020
TEC-06311-20x40x3.05637.611.26747.30.552040
TEC-06311-40x20x3.05637.611.26747.30.554020
TEC-07102-23x23x4718.62.3661132323
TEC-07103-23x23x3.5718.63.366162.072323
TEC-04903-25x25x4.2495.93.96712.91.222525
TEC-07102-30x30x4718.62.3661133030
TEC-07103-30x30x3.7718.63.366162.073030
TEC-07103-30x30x4718.63.66617.41.93030
TEC-12701-30x30x4.5512715.41.36711.49.253030
TEC-12702-30x30x4.212715.426717.46.083030
TEC-12702-30x30x4.0712715.42.26718.95.63030
TEC-12703-30x30x3.712715.43.46628.93.653030
TEC-12704-30x30x3.412715.44.26636.22.923030
TEC-12702-40x40x4.212715.42.86624.14.384040
TEC-12703-40x40x3.912715.43.46628.93.654040
TEC-12704-40x40x3.412715.44.26636.22.924040
TEC-12704-40x40x412715.44.86641.12.574040
TEC-12705-40x40x3.6512715.45.666482.24040
TEC-12706-40x40x3.9512715.46.66755.91.894040
TEC-12707-40x40x412715.47.46762.91.684040
TEC-12708-40x40x3.612715.48.86774.91.414040
TEC-12716-40x40x3.212715.416.3661390.764040
TEC-06303-40x20x3.6637.633.422.81.984020

🔷Thermoelectric Cooler Installation and Usage Recommendations


Assembly Pressure: 12.5 kg (0.25 kg/cm²) is recommended. Extra-large cooling plates require extremely high assembly pressure to ensure a tight fit with the heat sink and the surface being cooled, thereby effectively reducing thermal contact resistance. It is recommended to apply a uniform layer of high-performance thermal grease (thermal conductivity > 5 W/m·K) to both surfaces, with a thickness of 0.05–0.1 mm.


Installation Orientation: The 50×100 mm extra-large TEC has a specific dimensional orientation. During installation, ensure that the 100 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.


Hot-End Cooling Requirements (Important): With a relatively high power dissipation of 120 W, it is recommended to use a large extruded aluminum heat sink measuring at least 55 × 105 × 45 mm, paired with a high-airflow fan (airflow > 30 CFM) or a heat pipe/liquid cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.


Power Supply Requirements: Maximum voltage 24.0V, maximum current 5.0A. We recommend using a regulated power supply rated at 24V/6A or higher (either industrial or telecommunications power supplies are acceptable). The power supply ripple should be < 50mV.


Lead Wires: Standard configuration includes 20 AWG silicone-coated wires (300 mm in length), which fully meet the 5.0 A requirement; the extra-long leads facilitate wiring inside large equipment.


Current Limit: Must not exceed 5.0A. It is recommended to connect a 6A self-resetting fuse in series for overcurrent protection.


Anti-Condensation Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation; coat the lead solder joints with conformal coating.


Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.


Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.

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