English
The TEC1-20206 is a semiconductor cooling plate designed for ultra-large-area, ultra-high-power industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical packaging design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Peltier Cooler Product Drawing
🔷Peltier Module Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-20206 | K16 | 60 | 3.12 | 24.0 | 6.0 | 144 | 50×100×4.0 |
| TEC1-20206 | K28 | 65 | 3.12 | 24.0 | 6.0 | 144 | 50×100×5.2 |
| TEC1-20206 | K40 | 70 | 3.12 | 24.0 | 6.0 | 144 | 50×100×6.4 |
🔷TEC Cooler Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 12.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Cooler Peltier Performance Curve
🔷Peltier Cooling Module Product Overview
The TEC1-20206 is a top-of-the-line industrial semiconductor heat sink designed for cooling extremely large areas at extreme power densities. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three chip configurations—K16, K28, and K40—with thicknesses of 4.0 mm, 5.2 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 6.0 A, a maximum cooling power of 144 W, and an internal resistance of 3.12 Ω.
The extra-large 50×100mm rectangular package allows it to be embedded inside high-power industrial equipment and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and cooling for 144W of peak power, the 50mm width and 100mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling to the surface of very large loads. This product features a 24V high-voltage, 6.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms. The low internal resistance of 3.12Ω effectively controls Joule heat loss (I²R ≈ 112.3W) at 6.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the 100 mm × 50 mm extra-large surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying the high current of 6.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precision operation with zero noise and zero vibration. The recommended mounting pressure is up to 12.5 kg (0.25 kg/cm²), ensuring tight contact between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for large industrial laser modules operating at extreme power levels, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density in very large, high-surface-area spaces.
Translated with DeepL.com (free version)
🔷Peltier Effect CoolerPeltiers Product Applications
1. Temperature Control for High-Power Large Industrial Laser Modules
High-power large industrial semiconductor laser modules generate a significant amount of heat during operation. The TEC1-20206’s 144W maximum cooling capacity enables efficient temperature control over an extra-large 50×100mm area, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for high-power laser processing, optical communications, and LIDAR systems.
2. Heat Dissipation for Large Industrial Equipment
High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-20206 can be mounted directly on the component surface; its 144W maximum cooling capacity provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and lifespan.
3. Temperature Control for High-Performance Medical Equipment
High-end medical imaging equipment and large in-vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-20206 delivers robust cooling performance thanks to its extra-large coverage area, maintenance-free operation, and stable performance.
4. Heat Dissipation for High-Power Communication Base Stations
High-power communication components, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-20206 can be used for active cooling, and its 24.0V operating voltage is fully compatible with communication equipment power platforms.
🔷Cooler with Peltier Product Show
The TEC1-20220 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 50 × 100 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20215 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 50 × 100 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20212 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 50 × 100 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20210 is a flagship industrial semiconductor cooling module designed for extremely large surface areas and extreme, top-tier power density cooling. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring extreme power density, ultra-high-power laser modules, high-performance medical devices, and other applications demanding extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20208 is a flagship industrial semiconductor cooling module designed for extremely large surface areas and extreme, top-tier power density cooling. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring extreme power density, ultra-high-power laser modules, high-performance medical devices, and other applications demanding extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20205 is a semiconductor cooling plate designed for ultra-large-area, ultra-high-power industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical packaging design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20204 is a semiconductor cooling plate designed for ultra-large-area, high-power, industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring extensive temperature control over a large area and handling high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-20203 is a semiconductor cooling module designed for ultra-large-area, high-power, industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area and is optimized for large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control with moderate power requirements. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
Get A Free Quote
