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The TEC1-19520 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Cooler Peltier Product Drawing
🔷Peltier Cooling Module Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-19520 | K10 | 60 | 0.94 | 24.0 | 20.0 | 480 | 60×120×3.4 |
| TEC1-19520 | K16 | 65 | 0.94 | 24.0 | 20.0 | 480 | 60×120×4.0 |
| TEC1-19520 | K22 | 70 | 0.94 | 24.0 | 20.0 | 480 | 60×120×4.6 |
🔷Peltier Effect CoolerPeltiers Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm (dual wires) |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Cooler with Peltier Performance Curve
🔷Peltier Device Cooler Product Overview
The TEC1-19520 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series.
This product is available in three chip configurations—K10, K16, and K22—with thicknesses of 3.4 mm, 4.0 mm, and 4.6 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 20.0 A, a maximum cooling power of 480 W, and an internal resistance of just 0.94 Ω.
Its extra-large 60 × 120 mm rectangular package allows it to be embedded inside high-end, high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and extreme power cooling up to 480W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large loads. This product features a 24V high-voltage, 20.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 0.94Ω—the lowest in this series—Joule heat loss (I²R ≈ 376W) at 20.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length, twin-wire configuration), capable of safely carrying the high current of 20.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure of up to 18.0 kg (0.25 kg/cm²) ensures that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for top-tier, high-power large industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the ultimate flagship choice for cooling applications requiring extreme power density in extra-large, high-surface-area spaces.
🔷Peltier Module Cooler Product Features
1. Extra-large, symmetrical design with ample heat exchange area
The extra-large 60×120mm rectangular package is one of the largest models in this series, providing an extremely generous heat exchange area that is suitable for large, high-power temperature-controlled equipment.
2. High-power cooling with top-tier performance
With a maximum current of 20.0 A and a maximum power of 480 W, it achieves top-tier power density cooling within its extra-large, high-surface-area package, making it the most powerful ultimate flagship model in the series.
3. Deep cooling capability, extra-large surface area, and wide temperature differential
It achieves a maximum temperature differential of 70°C at the 480 W maximum power, with the cold end reaching as low as approximately -30°C.
4. Three Chip Options for Flexible Adaptability
Offers three chip configurations: K10 (60°C), K16 (65°C), and K22 (70°C).
5. Ultra-Low Internal Resistance Design for High Energy Conversion Efficiency
With an internal resistance of just 0.94 Ω, this is the model with the lowest internal resistance in the series. At a high current of 20.0 A, Joule heating losses are effectively controlled, allowing more electrical energy to be converted into effective cooling capacity.
6. Ultra-Thin Design to Save Vertical Space
With a thickness of only 3.4–4.6 mm, it maintains an excellent slim profile among models operating at maximum power.
7. Excellent Power Supply Compatibility
With a maximum voltage of 24.0V, it is highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms.
8. High-Quality Substrate with Superior Heat Dissipation Across an Extra-Large Area
A thicker copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 120 mm × 60 mm.
9. Dual-Wire Lead Design for Safe 20.0A Current Carrying Capacity
Comes standard with 18 AWG silicone-coated wires (300 mm long, dual-wire configuration), meeting the demands of high-current transmission and wiring for large equipment while reducing the current-carrying load on each individual wire.
10. Exceptional Adaptability to Assembly Pressure
Recommended assembly pressure of 18.0 kg (0.25 kg/cm²), ensuring tight contact with the extra-large heat sink.
11. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.
12. Bidirectional Temperature Control, Dual-Function Single Core
Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.
13. Zero Noise, Zero Vibration, Precision Operation
Fully solid-state construction ensures completely silent and vibration-free operation.
🔷Peltiers Product Structure
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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