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The TEC1-33206 is a top-of-the-line industrial semiconductor cooling module designed for ultra-large-area, high-power-density, high-voltage precision temperature control. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for ultra-large industrial equipment operating at extreme power levels, high-power laser modules, high-performance medical devices, and other applications requiring extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-33206 | K14 | 60 | 5.18 | 39.8 | 6.0 | 239 | 60×120×3.8 |
| TEC1-33206 | K24 | 65 | 5.18 | 39.8 | 6.0 | 239 | 60×120×4.8 |
| TEC1-33206 | K34 | 70 | 5.18 | 39.8 | 6.0 | 239 | 60×120×5.8 |
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
The TEC1-33206 is a top-of-the-line industrial semiconductor cooling module designed for ultra-large-area, high-power-density, high-voltage precision temperature control. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for ultra-large industrial equipment operating at extreme power levels, high-power laser modules, high-performance medical devices, and other applications requiring extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three crystal configurations—K14, K24, and K34—with thicknesses of 3.8 mm, 4.8 mm, and 5.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 39.8 V, a maximum current of 6.0 A, a maximum cooling power of 239 W, and an internal resistance of 5.18 Ω.
Its extra-large 60 × 120 mm rectangular package allows it to be embedded inside ultra-high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and cooling for extreme power levels up to 239W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large-area loads. This product features a drive design rated for an ultra-high voltage of 39.8V and a current of 6.0A, making it highly compatible with common industrial power supplies (40V) and telecommunications equipment power platforms. The low internal resistance of 5.18Ω effectively controls Joule heating losses (I²R ≈ 186.5W) at 6.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying the high current of 6.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for ultra-large industrial laser modules operating at extreme power levels, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density in ultra-large, high-surface-area spaces.
1. Extra-large, symmetrical design with ample heat exchange area
The extra-large 60×120mm rectangular package is one of the largest models in this series, providing an extremely generous heat exchange area that is suitable for large, high-power temperature-controlled equipment.
2. High-power cooling with top-tier performance
With a maximum current of 6.0A and a maximum power of 239W, it achieves top-tier power density cooling within its extra-large, high-surface-area package, making it the most powerful flagship model in the series.
3. Deep cooling capability, extra-large surface area, and wide temperature differential
It achieves a maximum temperature differential of 70°C at the 239W maximum power, with the cold end reaching as low as approximately -30°C.
4. Three Chip Options for Flexible Adaptability
Offers three chip configurations: K14 (60°C), K24 (65°C), and K34 (70°C).
5. Low Internal Resistance Design for Efficient Power Conversion
With an internal resistance of just 5.18Ω, Joule heating loss is effectively controlled at a current of 6.0A, allowing more electrical energy to be converted into effective cooling capacity.
6. Ultra-Thin Design to Save Vertical Space
With a thickness of only 3.8–5.8 mm, it maintains an excellent slim profile among high-power models.
7. Ultra-High Voltage Design, Excellent System Compatibility
With a maximum voltage of 39.8 V, it is highly compatible with common industrial power supplies (40 V), telecommunications equipment power supplies, and other platforms.
8. High-Quality Substrate, Excellent Heat Diffusion Across Extra-Large Areas
A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 120 mm × 60 mm.
9. Extra-Long Leads for Flexible Wiring in Large Equipment
Comes standard with 20 AWG silicone-coated wire (300 mm in length) to meet the wiring requirements of large equipment.
10. Exceptional Adaptability to High Assembly Pressure
Recommended assembly pressure of 18.0 kg (0.25 kg/cm²), ensuring tight contact with extra-large heat sinks.
11. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.
12. Bidirectional Temperature Control, Dual-Function Single Core
Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.
13. Zero Noise, Zero Vibration, Precision Operation
Fully solid-state construction ensures completely silent and vibration-free operation.
Assembly Pressure: Recommended 18.0 kg (0.25 kg/cm²). It is recommended to apply high-performance thermal grease (thermal conductivity > 5 W/m·K) evenly to both surfaces.
Hot-End Cooling Requirements (Critical): With a power consumption of 239 W, heat generation is extremely high. We recommend using a large extruded aluminum heatsink measuring at least 65 × 125 × 65 mm, paired with a high-airflow fan (airflow > 60 CFM), or implementing a water-cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.
Power Supply Requirements: Maximum voltage 39.8 V, maximum current 6.0 A. A regulated power supply rated at 40 V/7 A or higher is recommended. Power supply ripple < 50 mV.
Lead Wires: Standard configuration includes 20 AWG silicone-insulated wires (length 300 mm), rated for a safe current carrying capacity of 6.0 A.
Current Limit: Must not exceed 6.0A; it is recommended to connect a 7A self-resetting fuse in series.
Storage Conditions: Temperature < 120°C, humidity < 60% Rh.
Maximum Temperature: Must not exceed 138°C; soldering temperature < 280°C, duration < 5 seconds.
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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