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The TEC1-33215 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, top-tier, extreme power density, high-voltage precision temperature control. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for top-tier, ultra-high-power industrial equipment, high-power laser modules, high-performance medical devices, and other applications requiring extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-33215 | K10 | 60 | 2.07 | 39.8 | 15.0 | 597 | 60×120×3.4 |
| TEC1-33215 | K12 | 65 | 2.07 | 39.8 | 15.0 | 597 | 60×120×3.6 |
| TEC1-33215 | K14 | 70 | 2.07 | 39.8 | 15.0 | 597 | 60×120×3.8 |
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 300 mm (dual wires) |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
The TEC1-33215 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, top-tier, extreme power density, high-voltage precision temperature control. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for top-tier, ultra-high-power industrial equipment, high-power laser modules, high-performance medical devices, and other applications requiring extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three chip configurations—K10, K12, and K14—with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 39.8 V, a maximum current of 15.0 A, a maximum cooling power of 597 W, and an internal resistance of just 2.07 Ω.
Its extra-large 60 × 120 mm rectangular package allows it to be embedded inside top-tier, high-power industrial equipment and and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and extreme power cooling of 597W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating the uniform transfer of cooling capacity to the surface of extremely large-area loads. This product features a drive design rated for 39.8V ultra-high voltage and 15.0A current, making it highly compatible with common industrial power supplies (40V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 2.07Ω—the lowest in this series—Joule heat loss (I²R ≈ 465.8W) at a current of 15.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 20 AWG silicone-coated leads (300 mm in length, twin-wire configuration), capable of safely carrying the high current of 15.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring tight contact between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for top-tier, ultra-high-power, extra-large industrial laser modules; heat dissipation for large industrial equipment; high-performance medical devices; and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density in extra-large, high-surface-area spaces.
| 模型 | 热电偶对 | Umax（伏特） | Imax（安培） | DTmax（°C） | 瓦特 | 电阻器（Ω） | 长度（mm） | 宽度（mm） |
|---|---|---|---|---|---|---|---|---|
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
Assembly Pressure: Recommended 18.0 kg (0.25 kg/cm²). It is recommended to apply high-performance thermal grease (thermal conductivity > 5 W/m·K) evenly to both surfaces.
Hot-End Cooling Requirements (Critical): With a power consumption of 597 W, heat generation is extremely high. We recommend using a large extruded aluminum heatsink measuring at least 65 × 125 × 100 mm, paired with a high-airflow fan (airflow > 150 CFM), or implementing a water-cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.
Power Supply Requirements: Maximum voltage 39.8 V, maximum current 15.0 A. A regulated power supply rated at 40 V/18 A or higher is recommended. Power supply ripple < 50 mV.
Lead Wires: Standard configuration includes 20 AWG silicone-insulated wires (length 300 mm, twin-wire), rated for a safe current carrying capacity of 15.0 A.
Current Limit: Must not exceed 15.0A; it is recommended to connect an 18A self-resetting fuse in series.
Storage Conditions: Temperature < 120°C, humidity < 60% Rh.
Maximum Temperature: Must not exceed 138°C; soldering temperature < 280°C, duration < 5 seconds.
TEC1-33215 is a high-performance thermoelectric cooling module based on semiconductor Peltier technology. It uses the Peltier effect to provide efficient cooling and heating functions, making it suitable for industrial temperature control and electronic cooling applications.
TEC1-33215 features high cooling performance, stable operation, compact structure, fast thermal response and reliable semiconductor technology. It is designed for applications requiring efficient heat transfer and precise temperature management.
TEC1-33215 is commonly used in laser cooling systems, semiconductor equipment, medical devices, optical instruments, industrial temperature control systems and other applications requiring precise cooling solutions.
TEC1-33215 works based on the Peltier effect. When DC current passes through semiconductor materials inside the module, one side absorbs heat and becomes cold while the other side releases heat. By controlling current direction, the module can achieve both cooling and heating functions.
Yes. Proper heat dissipation on the hot side is essential for maintaining the cooling efficiency and extending the service life of the TEC1-33215 thermoelectric cooler. A suitable heat sink or cooling system should be selected according to the application requirements.
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