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The TEC1-33203 is a flagship industrial semiconductor cooling module designed for ultra-large-area, ultra-high-voltage, low-power precision temperature control. With dimensions of 60 × 120 mm, it is one of the largest models in the series. Featuring an ultra-large rectangular symmetrical package design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring large-area temperature control with limited power consumption, such as ultra-large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control with limited power budgets. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-33203 | K28 | 60 | 10.36 | 39.8 | 3.0 | 119 | 60×120×5.2 |
| TEC1-33203 | K36 | 65 | 10.36 | 39.8 | 3.0 | 119 | 60×120×6.0 |
| TEC1-33203 | K44 | 70 | 10.36 | 39.8 | 3.0 | 119 | 60×120×6.8 |
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Tin-lead eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
The TEC1-33203 is a flagship industrial semiconductor cooling module designed for ultra-large-area, ultra-high-voltage, low-power precision temperature control. With dimensions of 60 × 120 mm, it is one of the largest models in the series. Featuring an ultra-large rectangular symmetrical package design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring large-area temperature control with limited power consumption, such as ultra-large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control with limited power budgets.
This product is available in three chip configurations—K28, K36, and K44—with thicknesses of 5.2 mm, 6.0 mm, and 6.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 39.8 V, a maximum current of 3.0 A, a maximum cooling power of 119 W, and an internal resistance of 10.36 Ω.
The extra-large 60×120mm rectangular package allows it to be embedded within extra-large industrial equipment, high-power laser modules, and similar applications—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 119W, the 60mm width and 120mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of extra-large loads. This product features a drive design rated for an ultra-high voltage of 39.8 V and a current of 3.0 A, making it highly compatible with common industrial power supplies (40 V) and telecommunications equipment power platforms. The high internal resistance of 10.36 Ω ensures precise current control, enabling the drive circuit to achieve high-precision constant-current regulation and thereby deliver stable temperature control. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 120 mm × 60 mm ultra-large surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying a 3.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for extra-large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving extra-large, high-voltage, low-power applications in spacious environments.
1. Extra-large, symmetrical design with ample heat exchange area
The extra-large 60×120 mm rectangular package is one of the largest models in this series, providing an extremely generous heat exchange area. This facilitates uniform heat transfer to the surface of extra-large loads, making it ideal for extra-large temperature-controlled equipment.
2. Ultra-high voltage design with excellent system compatibility
With a maximum voltage of 39.8V, it is highly compatible with common industrial power supplies (40V), telecommunications equipment power supplies, and other platforms, eliminating the need for complex power conversion.
3. Medium-Power Cooling with Ample Capacity
With a maximum current of 3.0A and a maximum power of 119W, it delivers sufficient cooling capacity within its extra-large, high-surface-area package, making it suitable for extra-large equipment with medium-to-high thermal loads.
4. Deep Cooling Capability for Ultra-Large, High-Area Applications with Large Temperature Differentials
At 119W, it achieves a maximum temperature differential of 70°C, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.
5. Three Chip Options for Flexible Adaptation
Three chip configurations are available: K28 (60°C), K36 (65°C), and K44 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.
6. Three Thickness Options to Suit Different Spaces
Thicknesses are 5.2 mm, 6.0 mm, and 6.8 mm. The K44 model, at 6.8 mm thick, provides ample space for the crystal grains, enabling deep cooling down to 70°C for extra-large, high-area applications.
7. High internal resistance design for precise current control
With an internal resistance of 10.36 Ω, precise control of a 3.0 A current at 39.8 V is easier to achieve. This places lower demands on the drive circuit and is suitable for high-precision constant-current source drives.
8. High-Quality Substrate, Uniform Heat Dissipation Across an Extra-Large Surface Area
The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The thick copper layer ensures that heat is evenly distributed and rapidly dissipated across the extra-large 120 mm × 60 mm surface area.
9. Extra-long leads for flexible wiring in large equipment
Comes standard with 20 AWG silicone-coated wire (300 mm long) to meet the wiring needs of extra-large equipment and facilitate flexible routing inside the equipment.
10. Exceptional adaptability to high assembly pressure
Recommended assembly pressure of 18.0 kg (0.25 kg/cm²), ensuring tight contact between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and adapting to industrial environments.
11. Sealed Protection, Strong Environmental Adaptability
Perimeter sealing with 704 silicone rubber provides excellent moisture, dust, and shock resistance, enabling operation in complex industrial environments with high humidity and significant temperature fluctuations.
12. Bidirectional Temperature Control, Dual-Function Single Element
Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.
13. Zero Noise, Zero Vibration, Precision Operation
The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision industrial applications with strict noise and vibration requirements.
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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