🔷Peltier Effect CoolerPeltiers Product Drawing

🔷Cooler with Peltier Basic Performance Spec

🔷Peltier Device Cooler Additional Performance Spec

🔷Peltier Module Cooler Performance Curve

🔷Peltiers Product Overview

The TEC1-19505 is a flagship semiconductor cooling module designed for industrial-grade precision temperature control of extremely large areas and ultra-high power. With dimensions of 60 × 120 mm, it is currently one of the largest models in this series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extremely large temperature-controlled areas and extremely high thermal loads, such as ultra-large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads.

This product is available in three crystal configurations—K32, K38, and K44—with thicknesses of 5.6 mm, 6.2 mm, and 6.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 5.0 A, a maximum cooling power of 120 W, and an internal resistance of 3.74 Ω.

The extra-large 60×120mm rectangular package allows it to be embedded inside extra-large industrial equipment, high-power laser modules, and similar applications. While ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 120W, the 60mm width and 120mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of extra-large loads. This product features a 24V high-voltage, 5.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms. The low internal resistance of 3.74Ω effectively controls Joule heating loss (I²R ≈ 93.5W) at 5.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying a 5.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for extra-large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving extra-large, high-voltage, ultra-high-power applications with extensive surface areas.

🔷Thermoelectric Peltier Device Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The 60×120 mm extra-large rectangular package is one of the largest models in this series, providing an extremely ample heat exchange area. This facilitates uniform heat transfer to the surface of extra-large loads, making it suitable for extra-large, high-power temperature-controlled equipment.

2. Ultra-high-power cooling with robust performance

With a maximum current of 5.0 A and a maximum power of 120 W, this module achieves high-power-density cooling within its extra-large, high-surface-area package, making it suitable for extra-large equipment with extremely high thermal loads.

3. Deep Cooling Capability: Extra-Large Surface Area with High Temperature Differential

It achieves a maximum temperature differential of 70°C at an ultra-high power of 120W, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.

4. Three Chip Options for Flexible Adaptation

Three chip configurations are available: K32 (60°C), K38 (65°C), and K44 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.

5. Three Thickness Options for Different Space Requirements

Thicknesses are 5.6 mm, 6.2 mm, and 6.8 mm. The K44 model, with a thickness of 6.8 mm, provides ample space for the cooling elements, enabling deep cooling down to 70°C for extra-large, high-area applications.

6. High-Voltage Design for Excellent System Compatibility

With a maximum voltage of 24.0V, it is highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms, eliminating the need for complex power conversion.

7. Low Internal Resistance Design for Efficient Power Conversion

With an internal resistance of only 3.74Ω, Joule heating losses are effectively controlled at a current of 5.0A, ensuring that more electrical energy is converted into effective cooling capacity rather than self-generated heat.

8. High-Quality Substrate, Uniform Heat Dissipation Across an Extra-Large Surface Area

The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The thick copper layer ensures that heat is evenly distributed and rapidly dissipated across an extra-large surface area of 120 mm × 60 mm.

9. Extra-Long Leads for Flexible Wiring in Large Equipment

Comes standard with 20 AWG silicone-coated wire (300 mm in length) to meet the wiring needs of extra-large equipment and facilitate flexible routing inside the equipment.

10. Exceptional Adaptability to High Assembly Pressure

Recommended assembly pressure of 18.0 kg (0.25 kg/cm²), ensuring tight contact between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and adapting to industrial environments.

11. Sealed Protection, Strong Environmental Adaptability

Perimeter sealing with 704 silicone rubber provides excellent moisture, dust, and shock resistance, enabling operation in complex industrial environments with high humidity and significant temperature fluctuations.

12. Bidirectional Temperature Control, Dual-Function Single Core

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

13. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision industrial applications with strict noise and vibration requirements.

🔷Peltier Device Installation and Usage Recommendations

Assembly Pressure: 18.0 kg (0.25 kg/cm²) is recommended. Extra-large cooling plates require extremely high assembly pressure to ensure a tight fit between the heat sink and the surface being cooled, effectively reducing thermal contact resistance. It is recommended to apply a uniform layer of high-performance thermal grease (thermal conductivity > 5 W/m·K) to both surfaces, with a thickness of 0.05–0.1 mm.

Installation Orientation: The 60×120 mm extra-large TEC has a specific dimensional orientation. During installation, ensure that the 120 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.

Hot-Side Cooling Requirements (Important): With a power dissipation of 120 W, it is recommended to use a large extruded aluminum heat sink measuring at least 65 × 125 × 50 mm, paired with a high-airflow fan (airflow > 35 CFM) or a heat pipe/liquid cooling solution to ensure timely heat dissipation from the hot side. The cooling efficiency of the hot side directly determines the lowest achievable temperature at the cold side.

Power Supply Requirements: Maximum voltage 24.0V, maximum current 5.0A. We recommend using a regulated power supply rated at 24V/6A or higher (either industrial or telecommunications power supplies are acceptable). The power supply ripple should be < 50mV.

Lead Wires: Standard configuration includes 20 AWG silicone-coated wires (300 mm in length), which fully meet the 5.0 A requirement; the extra-long leads facilitate internal wiring in extra-large equipment.

Current Limit: Must not exceed 5.0A. It is recommended to connect a 6A self-resetting fuse in series for overcurrent protection.

Anti-Condensation Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation; coat the lead solder joints with conformal coating.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.