The TEC1-07104 is a flagship semiconductor cooling module designed for ultra-long, narrow spaces and high-power, high-density cooling. With dimensions of 10 × 40 mm and a long, asymmetrical package design, it is optimized for high-power infrared lasers, beauty devices, industrial sensors, and other compact devices requiring a layout that extends along a long axis and carrying high thermal loads. It enables high-density active cooling within extremely long, narrow spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Cooler Module Product Drawing

🔷Thermoelectric Peltier Module Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-07104 | K10 | 60 | 1.66 | 8.5 | 4.0 | 34 | 10×40×3.0 |
| TEC1-07104 | K12 | 65 | 1.66 | 8.5 | 4.0 | 34 | 10×40×3.2 |
| TEC1-07104 | K14 | 70 | 1.66 | 8.5 | 4.0 | 34 | 10×40×3.4 |
🔷Cooling Module Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 24 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 1.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Tec Thermoelectric Cooler Performance Curve

🔷Semiconductor Cooler Product Overview
The TEC1-07104 is a flagship semiconductor cooling module designed for ultra-long, narrow spaces and high-power, high-density cooling. With dimensions of 10 × 40 mm and a long, asymmetrical package design, it is optimized for high-power infrared lasers, beauty devices, industrial sensors, and other compact devices requiring a layout that extends along a long axis and carrying high thermal loads. It enables high-density active cooling within extremely long, narrow spaces.
This product is available in three crystal configurations—K10, K14, and K18—with thicknesses of 3.0 mm, 3.4 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 8.5 V, a maximum current of 4.0 A, a maximum cooling power of 26 W, and an internal resistance of 2.21 Ω.
The 10 × 40 mm ultra-long, narrow package allows it to be easily integrated into high-power infrared laser housings, beauty device handles, and elongated sensor modules—while ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 26W, it provides a 40mm coverage range along the length with a width of only 10mm, offering an ideal contact area for elongated heat sources with high thermal loads. This product features a high-voltage (8.5V) and high-current (4.0A) drive design, delivering robust cooling performance suitable for high-thermal-load applications. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper, ensuring rapid and uniform heat dissipation of 26W along its 40 mm length. It comes standard with 24 AWG silicone leads (100 mm in length), capable of safely carrying the high current of 4.0 A. Sealed with 704 silicone rubber around the perimeter, it operates in an all-solid-state, noise-free, and vibration-free manner, ensuring stable and reliable performance.
This product is typically used in applications such as infrared laser temperature control, cold/hot compresses for beauty devices, industrial sensor temperature regulation, heat-dissipating back covers for mobile phones, and medical diagnostic equipment. It is the flagship choice for high-power temperature control in ultra-long, compact spaces.
🔷TEC Peltier Module Product Structure

🔷Peltier Heater Cooler Product Features
1. Extra-long, asymmetrical design with wide coverage
The unique 10×40 mm elongated package provides 40 mm of coverage along its length and is optimized for devices requiring a longer temperature-controlled area, such as high-power infrared lasers and elongated sensors.
2. High-current, high-power cooling with robust performance
With a maximum current of 4.0 A and a maximum power of 26 W, this model achieves high-power-density cooling within an extra-long, elongated package. As the most powerful model in the series, it is suitable for equipment with high thermal loads.
3. Deep Cooling Capability: Compact Size with Large Temperature Differential
It achieves a maximum temperature differential of 70°C at a high power of 26W, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.
4. Three Chip Options for Flexible Adaptation
Three chip configurations are available: K10 (60°C), K14 (65°C), and K18 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.
5. Ultra-Thin Design, Saves Vertical Space
With a thickness of only 3.0–3.8 mm, it is suitable for compact devices with strict vertical space constraints.
6. Low Internal Resistance Design, High Energy Conversion Efficiency
With an internal resistance of only 2.21 Ω, Joule heat loss is effectively controlled even at a high current of 4.0 A, allowing more electrical energy to be converted into effective cooling capacity.
7. High-Quality Substrate for Excellent Long-Distance Heat Diffusion
The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm), ensuring rapid and uniform distribution of up to 26 W of heat over a 40 mm length.
8. Thick-Gauge Leads for Safe 4.0A Current Carrying Capacity
Standard 24 AWG silicone-coated wire (100 mm long) ensures safe and reliable high-current transmission.
9. Sealed Protection for Strong Environmental Adaptability
Perimeter sealing with 704 silicone rubber provides excellent moisture, dust, and shock resistance. Operating temperature range: -45°C to 80°C; optimal performance is achieved at temperatures up to 50°C.
10. Bidirectional Temperature Control, Dual-Function Single Core
Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.
11. Zero Noise, Zero Vibration, Maintenance-Free Operation
Fully solid-state design with no moving parts, no wear, and no maintenance, resulting in low operating costs and an exceptionally long service life.
TEC1-07103 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-07102 is a semiconductor cooling module designed for precision temperature control in extra-long, narrow spaces with medium power requirements. With dimensions of 10 × 40 mm and a long, asymmetrical package design, it is optimized for compact devices that require a layout extending along a long axis—such as long-format laser arrays, microfluidic chips, and industrial sensors—enabling active temperature management within extremely narrow spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-07101 is a semiconductor cooling module designed for ultra-long, narrow spaces and for low-power, high-voltage precision temperature control. Measuring 10 × 40 mm and featuring a long, asymmetric package design, it is optimized for compact devices—such as linear laser arrays, microfluidic chips, and industrial sensors—that require a layout extending along a long axis and are subject to extremely limited space, enabling active temperature management within extremely narrow spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw