🔷Cooler with Peltier Product Drawing

🔷Peltier Device Cooler Basic Performance Spec

🔷Peltier Module Cooler Additional Performance Spec

🔷Peltiers Performance Curve

🔷Thermoelectric Peltier Device Product Overview

The TEC1-07101 is a semiconductor cooling module designed for ultra-long, narrow spaces and for low-power, high-voltage precision temperature control. Measuring 10 × 40 mm and featuring a long, asymmetric package design, it is optimized for compact devices—such as linear laser arrays, microfluidic chips, and industrial sensors—that require a layout extending along a long axis and are subject to extremely limited space, enabling active temperature management within extremely narrow spaces.

This product is available in three die configurations—K20, K28, and K36—with thicknesses of 4.0 mm, 4.8 mm, and 5.6 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 8.5 V, a maximum current of 1.4 A, a maximum cooling power of 12 W, and an internal resistance of 4.74 Ω.

The ultra-long 10 × 40 mm package allows it to be easily embedded into narrow, elongated spaces such as laser array housings, microfluidic chip substrates, microfluidic chip substrates, and other narrow, elongated spaces—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 12W, it provides a 40mm coverage range along the length with a width of only 10mm, offering an ideal, large-area contact surface for elongated heat sources. The core advantage of this product lies in its drive design featuring a high voltage of 8.5V and a low current of 1.4A—this combination of high voltage and low current minimizes line losses, making it suitable for long-distance lead wiring and distributed temperature control systems. The internal resistance of 4.74Ω ensures precise current control at low currents. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat diffusion along the 40 mm length. It comes standard with 26 AWG silicone-coated leads (100 mm in length), which are flexible. A 704 silicone rubber perimeter seal ensures a fully solid-state, noise-free, and vibration-free operation.

This product is typically used for temperature control in long, strip-shaped laser arrays, microfluidic biochips, long industrial sensors, and medical and cosmetic devices. It is the ideal choice for low-power temperature control in ultra-long, strip-shaped, and compact spaces.

🔷Peltier Device Product Features

1. Extra-long, asymmetrical design with wide coverage

The unique 10×40 mm elongated package provides 40 mm of coverage along its length and is optimized for devices requiring extended temperature-controlled areas, such as elongated laser arrays, microfluidic chips, and industrial sensors.

2. High-voltage, low-current design for minimal long-distance transmission losses

With a maximum voltage of 8.5V and a maximum current of 1.4A, the combination of high voltage and low current minimizes line losses (I²R). This makes it ideal for applications requiring long-distance wiring, reducing the impact of cable voltage drops on cooling performance.

3. Ultra-low-power operation for extended runtime

With a maximum current of just 1.4A and a maximum power of only 12W, this unit achieves a perfect balance between low power consumption and deep cooling within an ultra-long, slender package, making it ideal for battery-powered portable devices.

4. Deep Cooling Capability: Compact Size, Large Temperature Difference

It achieves a maximum temperature difference of 70°C at a low power consumption of just 12W, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.

5. Three Chip Options for Flexible Adaptation

Three chip configurations are available: K20 (60°C), K28 (65°C), and K36 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.

6. Three Thickness Options to Suit Different Spaces

Thicknesses are 4.0 mm, 4.8 mm, and 5.6 mm. The K36 model, at 5.6 mm thick, provides ample space for the 40 mm extra-long bar-shaped cooling element, helping to achieve 70°C deep cooling.

7. High Internal Resistance Design for Precise Current Control

With an internal resistance of 4.74 Ω, precise control of a 1.4 A current at 8.5 V is easier to achieve. This places lower demands on the drive circuit and is suitable for high-precision constant-current source drives.

8. High-Quality Substrate, Excellent Long-Distance Heat Dissipation

The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The relatively thick copper layer ensures uniform heat distribution and rapid heat dissipation along the 40 mm length.

9. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the device to operate in complex environments with high humidity and significant temperature fluctuations.

10. Bidirectional Temperature Control, Dual-Function Single Element

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

11. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision applications with strict noise and vibration requirements.

🔷Thermoelectric Module Product Testing

I. Incoming Inspection and Installation Verification

Appearance and Structural Inspection: Inspect the ceramic substrate for cracks or chipped corners; check the lead insulation for damage. For the TEC1-07101, which has an aspect ratio of 4:1, special attention must be paid to ensuring there is no noticeable warping at either end.

AC Resistance (ACR) Measurement: Measure the ACR value using a four-wire milliohm meter; this is the key indicator for determining whether the internal grains are damaged. The nominal value is 4.74 Ω, and the measured value should fall within ±5%. It is recommended to retest the ACR after installation; if the change exceeds 5%, it may indicate that excessive installation stress has caused microcracks to form internally.

II. Performance Testing

Maximum Temperature Difference (ΔTmax) Test: Maintain the hot-end temperature at the nominal value of Th = 40°C, apply the nominal current of 1.4 A to the TEC, and record the temperature difference between the hot and cold ends once the temperature has stabilized. For the K36 wafer model, the nominal value is 70°C; the measured value is typically required to be no less than 95% of the nominal value.

Insulation Withstand Voltage (Hi-Pot) Test: High voltage is applied between the TEC’s positive and negative terminals and the substrate to ensure there is no breakdown or leakage current, thereby verifying the product’s electrical safety under severe conditions.

III. Reliability Testing

In accordance with industry standards such as T/UNP 733-2025 “Test Methods for Semiconductor Thermoelectric Cooling Devices (TEC),” the following tests are recommended:

Test Item    Reference Conditions    Key Evaluation Criteria

Lead Tensile Strength Test    Apply a static load of 20 N to the leads and maintain for 1 minute.    No visible damage; ACR change ≤ 5%.

Temperature Cycling    Undergo dozens of temperature cycles ranging from -25°C to +85°C.    ACR change ≤ ±10%.

High-Temperature Storage    Store at +80°C for 1,000 hours. ACR change ≤ ±10%.

Power Cycling    Simulate frequent power on/off cycles by performing more than 50,000 power cycles.    ACR change ≤ 5%.

IV. Test Pass/Fail Criteria

ACR (Alternating Current Resistance): This is the key indicator for determining whether a TEC has failed. An ACR change exceeding 5% before and after testing is generally considered a failure; some stringent standards allow a tolerance of ±10%.

Appearance and Functionality: No cracks, no performance degradation, and no insulation failure after testing.