🔷Thermoelectric Cooling Device Product Drawing

🔷Thermoelectric Cooling Element Basic Performance Spec

🔷Thermoelectric Generation Additional Performance Spec

🔷Thermo Cooler Performance Curve

🔷Peltier Heater Product Overview

TEC1-07103 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 71 pairs of semiconductor grains (the “071” in the model number denotes 71 pairs), representing a large-scale thermopile design—with more thermocouple pairs, it can generate a greater temperature difference and cooling capacity at the same current, providing sufficient heat pump capacity for temperature control along a 40mm-long strip. The 0.4 mm thick oxygen-free copper layer ensures uniform heat diffusion along the 40 mm length.

When a forward DC voltage (maximum 8.5 V) is applied, a 3.0 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop rapidly, while the hot-end node releases energy, causing the temperature to rise. Under the continuous drive of a strong electric field, a large amount of heat is continuously “pumped” from the cold end to the hot end, achieving rapid active cooling.

This product achieves a maximum temperature difference of 70°C (Model K18) when the hot-end temperature is 40°C, meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at an input power of 26W demonstrates balanced energy efficiency. The moderately high current of 3.0A provides ample cooling capacity, while the drive circuit design remains straightforward and places moderate demands on the power supply’s load-carrying capacity. The 10×40 mm ultra-long bar-shaped design allows it to fit snugly along the 40 mm length of high-power laser arrays or elongated power devices. The large contact area and short heat conduction path effectively reduce the contact thermal resistance between the cold end and the load, ensuring that the high-power cooling capacity is fully utilized.

🔷TEC Peltier Product Applications

1. Temperature Control for High-Power Laser Arrays

High-power semiconductor laser arrays generate a significant amount of heat during operation, causing the temperature of the tube housing to rise sharply, which affects output power and wavelength stability. The TEC1-07103’s 26W high-power cooling capacity enables efficient temperature control on the side of a 10×40mm elongated package, covering multiple laser units along the 40mm length and stabilizing the laser temperature at the setpoint ±0.05°C. It is suitable for industrial laser processing, optical communications, and LIDAR systems.

2. Heat Dissipation for Elongated Power Electronic Devices

Long, strip-shaped power electronic devices—such as power MOSFET arrays, IGBT modules, and RF power amplifier arrays—generate concentrated heat during operation; excessive temperatures can lead to performance degradation or even burnout. The TEC1-07103 can be mounted on the back of the device, providing robust active cooling with its 26W high-power output to reduce core temperatures by 15–20°C, thereby enhancing device reliability and lifespan.

3. Temperature Control for High-Performance Linear Sensors

Linear detection elements, such as high-end industrial line-scan CCD/CMOS image sensors and satellite remote sensing sensor arrays, generate significant heat during operation. The TEC1-07103’s 26W power effectively dissipates the heat generated by the sensors, uniformly covering the rear surface of the sensor along its 40mm length to eliminate temperature gradients and ensure imaging and measurement accuracy.

4. High-Performance Micro Laser Modules and LIDAR Systems

High-power laser emitter modules in automotive LIDAR systems generate extremely high heat density during operation. The TEC1-07103 can be embedded inside the module; its high power rating of 3.0A/26W provides robust active thermal control for the laser chip, ensuring detection accuracy and reliability in extreme environments (-40°C to 85°C).

5. Thermal Management for Rectangular Battery Packs

Rectangular battery packs in devices such as drones and robots generate significant heat during high-current charging and discharging. The TEC1-07103’s 26W power rating rapidly dissipates heat from the cell surfaces, balancing temperatures across the 40mm length of the pack and extending cycle life.

6. Temperature Control for Industrial Laser Processing Equipment

Long, slender optical components (such as gratings and mirror arrays) in industrial laser processing equipment are subject to thermal deformation during operation, which affects the precision of the optical path. The TEC1-07103 provides active temperature control to maintain a constant temperature for these optical components, ensuring processing accuracy.

🔷TEC Module Operation Principle

TEC1-07103 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 71 pairs of semiconductor grains (the “071” in the model number denotes 71 pairs), representing a large-scale thermopile design—with more thermocouple pairs, it can generate a greater temperature difference and cooling capacity at the same current, providing sufficient heat pump capacity for temperature control along a 40mm-long strip. The 0.4 mm thick oxygen-free copper layer ensures uniform heat diffusion along the 40 mm length.

When a forward DC voltage (maximum 8.5 V) is applied, a 3.0 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop rapidly, while the hot-end node releases energy, causing the temperature to rise. Under the continuous drive of a strong electric field, a large amount of heat is continuously “pumped” from the cold end to the hot end, achieving rapid active cooling.

This product achieves a maximum temperature difference of 70°C (Model K18) when the hot-end temperature is 40°C, meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at an input power of 26W demonstrates balanced energy efficiency. The moderately high current of 3.0A provides ample cooling capacity, while the drive circuit design remains straightforward and places moderate demands on the power supply’s load-carrying capacity. The 10×40 mm ultra-long bar-shaped design allows it to fit snugly along the 40 mm length of high-power laser arrays or elongated power devices. The large contact area and short heat conduction path effectively reduce the contact thermal resistance between the cold end and the load, ensuring that the high-power cooling capacity is fully utilized.