🔷Thermoelectric Peltier Product Drawing

🔷TEG Module Basic Performance Spec

🔷Solid State Cooler Additional Performance Spec

🔷Thermoelectric Power Generator Performance Curve

🔷Element Peltier Product Overview

The TEC1-07102 is a semiconductor cooling module designed for precision temperature control in extra-long, narrow spaces with medium power requirements. With dimensions of 10 × 40 mm and a long, asymmetrical package design, it is optimized for compact devices that require a layout extending along a long axis—such as long-format laser arrays, microfluidic chips, and industrial sensors—enabling active temperature management within extremely narrow spaces.

This product is available in three crystal configurations—K12, K16, and K20—with thicknesses of 3.2 mm, 3.6 mm, and 4.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 8.5 V, a maximum current of 2.2 A, a maximum cooling power of 19 W, and an internal resistance of 3.01 Ω.

The 10 × 40 mm ultra-long, narrow package allows it to be easily embedded into narrow, elongated spaces such as laser array housings, microfluidic chip substrates, microfluidic chip substrates, and other narrow, elongated spaces—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 19W, it provides a 40mm coverage range along the length with a width of only 10mm, offering an ideal large-area contact surface for elongated heat sources. This product features a drive design with a high voltage of 8.5V and a moderate current of 2.2A. The power supply system is flexible, making it suitable for both high-voltage power platforms and power sourcing from lithium-ion batteries via a boost circuit. The internal resistance of 3.01Ω provides moderate current control sensitivity. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat diffusion along the 40 mm length. It comes standard with 26 AWG silicone rubber leads (100 mm in length), which are flexible and facilitate wiring in extra-long, narrow spaces. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state structure ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for long, narrow laser arrays, microfluidic biochips, long, narrow industrial sensors, medical and cosmetic devices, and industrial laser processing equipment. It serves as a versatile solution that delivers high cooling capacity and precision in ultra-long, narrow, and compact spaces.

🔷Peltier Cooling Element Product Selection

🔷TEC Cooling System Installation and Usage Recommendations

Assembly Pressure: Recommended 1.0 kg (0.25 kg/cm²). It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.

Installation orientation: The extra-long TEC module has distinct long and short sides. During installation, ensure that the 40 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.

Hot-end Cooling Requirements: With a moderate power dissipation of 19 W, we recommend using an extruded aluminum heat sink measuring at least 20 × 45 × 15 mm, combined with a low-speed fan (airflow > 5 CFM) or cooling via the device’s metal enclosure.

Power Supply Requirements: Maximum voltage 8.5V, maximum current 2.2A. The device can be powered by two lithium-ion batteries connected in series (7.4V, close to 8.5V) or a regulated power supply rated at 8.5V/2.5A or higher. If boosting the voltage from a single lithium-ion battery is required, select a boost converter with an output capacity of ≥2.5A. A power supply with ripple < 50mV is recommended.

Lead Wires: The standard 26 AWG silicone-coated wires fully meet the 2.2A requirement and do not need to be replaced.

Current Limit: Do not exceed 2.2A; it is recommended to connect a 2.5A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation; coat the lead solder joints with conformal coating.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.