🔷Thermoelectric Cooler Product Drawing

🔷Peltier Cooler Basic Performance Spec

🔷Peltier Module Additional Performance Spec

🔷TEC Cooler Performance Curve

🔷Thermoelectric Cooler Peltier Product Overview

The TEC1-05304 is a flagship semiconductor cooling module designed for ultra-long, narrow spaces and high-power, high-density cooling. Measuring 10 × 30 mm and featuring a long, asymmetric package design, it is optimized for compact devices—such as high-power laser arrays, long power electronic components, and high-performance sensors—that require a layout extending along a long axis and have high thermal loads, enabling high-density active cooling within extremely long, narrow spaces.

This product is available in three chip configurations—K10, K12, and K14—with thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 6.4 V, a maximum current of 4.0 A, a maximum cooling power of 26 W, and an internal resistance of just 1.25 Ω.

The 10 × 30 mm ultra-long, narrow package allows it to be easily integrated into narrow, elongated spaces such as high-power laser array housings and long, narrow power electronic modules— —while ensuring a maximum deep cooling temperature difference of 70°C and high-power cooling of 26W, it provides a 30mm coverage range along its length with a width of only 10mm, offering an ideal contact area for long, high-thermal-load heat sources. The ultra-low internal resistance of 1.25Ω results in significantly lower Joule heating (I²R ≈ 20W) at a high current of 4.0A compared to similar products, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. This product utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures rapid and uniform heat dissipation of 26 W along the 30 mm length. It comes standard with 24 AWG silicone-coated leads (100 mm in length), capable of safely carrying a high current of 4.0 A. The 704 model features a silicone rubber perimeter seal, ensuring fully solid-state operation with zero noise and vibration.

This product is typically used in applications such as temperature control for high-power laser arrays, heat dissipation for long, slender power electronic devices, temperature stabilization for high-performance sensors, and industrial laser processing equipment. It is the flagship choice for high-power temperature control requirements in ultra-long, slender, and compact spaces.

🔷Peltier Cooling Module Product Structure

🔷Peltier Effect CoolerPeltiers Operation Principle

TEC1-05304 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 53 pairs of semiconductor grains (the “053” in the model number denotes 53 pairs), representing a large-scale thermopile design—with more thermocouple pairs, it can generate a greater temperature difference and cooling capacity at the same current. The oxygen-free copper layer is 0.4 mm thick, ensuring uniform heat diffusion along the 30 mm length.

When a forward DC voltage (up to 6.4 V) is applied, a high current of 4.0 A drives holes in the P-type material and electrons in the N-type material to migrate rapidly in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop rapidly, while the hot-end node releases energy, causing the temperature to rise. Under the continuous drive of a strong electric field, a large amount of heat is continuously “pumped” from the cold end to the hot end, achieving rapid active cooling.

The core advantage of this product lies in its ultra-low internal resistance design of 1.25 Ω—the lowest in the entire product line. This ensures that Joule heating losses (I²R ≈ 20 W) at a high current of 4.0 A are significantly lower than those of other products in the same power class, allowing more electrical energy to be converted into effective cooling capacity. Of the 26W input power, approximately 20W is used to overcome Joule heating and thermal conduction losses, resulting in a net cooling capacity of about 6W—for long, high-heat-load components, this net cooling capacity is sufficient to achieve an effective temperature drop of 30–40°C. The 0.4 mm thick copper layer helps evenly dissipate the 26 W of heat generated at the hot end along the 30 mm length, preventing localized overheating.

This product achieves a maximum temperature difference of 70°C (Model K14) when the hot-end temperature is 40°C, meaning the cold end can reach as low as approximately -30°C. The 10 × 30 mm extra-long strip design allows it to fit snugly along the length of high-power laser arrays or long, strip-shaped power devices. With a large contact area and a short heat transfer path, it effectively reduces the contact thermal resistance between the cold end and the load, ensuring that the high-power cooling capacity is fully utilized.