🔷Thermoelectric Generation Product Drawing

🔷Thermoelectric Generator Modules Basic Performance Spec

🔷Thermo Cooler Additional Performance Spec

🔷Peltier Heater Performance Curve

🔷TEC Peltier Product Overview

The TEC1-05301 is a semiconductor cooling module designed for ultra-long, narrow spaces and low-power precision temperature control. With dimensions of 10 × 30 mm and a long, asymmetrical package design, it is optimized for compact devices that require a layout extending along a long axis—such as laser arrays, long sensors, and medical and cosmetic probes—enabling active temperature management within extremely narrow spaces.

This product is available in three crystal configurations—K14, K24, and K34—with thicknesses of 3.4 mm, 4.4 mm, and 5.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 6.4 V, a maximum current of 1.4 A, a maximum cooling power of 9 W, and an internal resistance of 3.57 Ω.

The ultra-long 10 × 30 mm package allows it to be easily embedded into the sides of laser array housings, elongated sensor modules, and the interiors of beauty device handles—all while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 9W. With a length of 30mm and a width of just 10mm, it provides an ideal contact area for elongated heat sources, making it particularly suitable for applications requiring uniform temperature control along a longer dimension. This product utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the thicker copper layer ensures uniform heat diffusion along the 30 mm length. It comes standard with 26 AWG silicone leads (100 mm in length), which are flexible and facilitate wiring within elongated spaces. The 704 model features a silicone rubber perimeter seal and is fully solid-state, ensuring zero noise and vibration.

This product is typically used in applications such as laser array temperature control, constant-temperature maintenance for long, narrow image sensors, temperature control for PCR microfluidic chip channels, beauty devices, and industrial laser processing equipment. It is the ideal choice for low-power temperature control requirements in ultra-long, narrow, and compact spaces.

🔷TEC Module Product Features

1. Extra-long, asymmetrical design with wide coverage

The unique 10×30 mm elongated package provides 30 mm of coverage along its length and is optimized for devices requiring a long temperature-controlled area, such as laser arrays and elongated sensors.

2. Ultra-low power consumption for extended runtime

With a maximum current of just 1.4 A and a maximum power of only 9 W, it achieves a perfect balance between low power consumption and deep cooling within its ultra-long, slender package, making it ideal for battery-powered portable devices.

3. Deep cooling capability: compact size with a large temperature difference

It achieves a maximum temperature difference of 70°C at a low power consumption of just 9W, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.

4. Three Chip Options for Flexible Adaptation

Three chip configurations are available: K14 (60°C), K24 (65°C), and K34 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.

5. Three Thickness Options to Suit Different Spaces

Thicknesses are 3.4 mm, 4.4 mm, and 5.4 mm. The K34 model, at 5.4 mm thick, provides ample space for the cooling grains in a 30-mm-long strip, helping to achieve deep cooling of 70°C.

6. High-Quality Substrate for Excellent Long-Distance Heat Dissipation

The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The thicker copper layer ensures uniform heat distribution and rapid heat dissipation along the 30 mm length.

7. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the element to operate in complex environments with high humidity and significant temperature fluctuations.

8. Bidirectional Temperature Control, Dual-Function Single Element

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

9. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision applications with strict noise and vibration requirements.

🔷Thermoelectric Cooler Module Installation and Usage Recommendations

Assembly Pressure: Recommended 0.75 kg (0.25 kg/cm²). It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.

Installation Orientation: The extra-long TEC module has distinct long and short sides. During installation, ensure that the 30 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage. It is recommended to secure one side of the heat sink first, then press the device being cooled against the cold end surface.

Hot-end cooling requirements: With a relatively low power consumption of 9 W, it is recommended to use an extruded aluminum heat sink measuring at least 20 × 35 × 15 mm, combined with a low-speed fan (airflow > 3 CFM) or cooling via the device’s metal enclosure.

Power Supply Requirements: Maximum voltage 6.4V, maximum current 1.4A. Can be powered by two lithium batteries connected in series (7.4V, must be stepped down to 6.4V) or a regulated power supply rated at 6.4V/1.5A or higher. Recommended power supply ripple < 50mV.

Lead Wires: The standard 26 AWG silicone-coated wires fully meet the 1.4A requirement and do not need to be replaced.

Current Limitation: Do not exceed 1.4A; it is recommended to connect a 1.5A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation; coat the lead solder joints with conformal coating.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.