🔷Thermoelectric Cooling Devices Product Drawing

🔷Peltier Elements Basic Performance Spec

🔷Thermoelectric Controller Additional Performance Spec

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🔷Thermoelectric Devices Product Overview

The TEC1-05303 is a semiconductor cooling module designed for precision temperature control in extra-long, narrow spaces at medium-to-high power levels. Measuring 10 × 30 mm and featuring a long, asymmetric package design, it is optimized for compact devices such as laser arrays, power electronic components, and long-shaped sensors that require a layout extending along the longer dimension and have high thermal loads, enabling active cooling with high power density in extremely long, narrow spaces.

This product is available in three chip configurations—K10, K14, and K18—with thicknesses of 3.0 mm, 3.4 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 6.4 V, a maximum current of 3.0 A, a maximum cooling power of 19 W, and an internal resistance of 1.66 Ω.

The 10 × 30 mm ultra-long, narrow package allows it to be easily embedded into narrow, elongated spaces such as the sides of laser array housings, elongated sensor modules, and power electronic modules— —while ensuring a maximum deep cooling temperature difference of 70°C and high-power cooling of 19W, it provides a 30mm coverage range along its length with a width of only 10mm, offering an ideal contact area for long, high-heat-load heat sources. The 1.66Ω internal resistance keeps Joule heating (I²R ≈ 14.9W) at a reasonable level at a current of 3.0A, allowing more electrical energy to be converted into effective cooling capacity. This product utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures rapid and uniform dissipation of the high heat load (19 W) along the 30 mm length, preventing localized overheating. It comes standard with 26 AWG silicone-coated leads (100 mm in length), which are flexible. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state construction ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for high-power laser arrays, heat dissipation for long, slender power electronic devices, industrial-grade sensor temperature stabilization, and high-performance micro-laser modules. It is the ideal choice for medium-to-high-power temperature control requirements in ultra-long, slender, and compact spaces.

🔷Peltier Element Cooler Product Applications

1. Temperature Control for High-Power Laser Arrays

High-power semiconductor laser arrays generate a significant amount of heat during operation, causing the temperature of the tube housing to rise sharply, which affects output power and wavelength stability. The TEC1-05303’s 19W high-power cooling capacity enables efficient temperature control on the side of a 10×30mm elongated housing, covering multiple laser units along the 30mm length and stabilizing the laser temperature at the setpoint ±0.05°C. It is suitable for industrial laser processing, optical communications, and LIDAR systems.

2. Heat Dissipation for Long, Strip-Shaped Power Electronic Devices

Long, strip-shaped power electronic devices—such as power MOSFET arrays, IGBT modules, and RF power amplifier arrays—generate concentrated heat during operation. The TEC1-05303 can be mounted on the back of the device; its 19W cooling capacity provides robust active cooling, reducing core temperature by 15–20°C and enhancing device reliability and lifespan.

3. Temperature Stabilization for Long, Strip-Shaped Image Sensors

Long, strip-shaped detection elements—such as high-end industrial line-scan CCD/CMOS image sensors and satellite remote sensing sensor arrays—generate significant heat during operation, and temperature fluctuations directly affect imaging quality and detection accuracy. The TEC1-05303’s 19W cooling capacity effectively dissipates the heat generated by the sensors, uniformly covering the rear surface along the length of the sensor to eliminate temperature gradients and ensure imaging and measurement accuracy.

4. High-Performance Micro Laser Modules and LIDAR Systems

High-power laser emitter modules in automotive LIDAR systems generate extremely high heat density during operation. The TEC1-05303 can be embedded inside the module; its high power rating of 3.0A/19W provides robust active thermal control for the laser chip, ensuring detection accuracy and reliability in extreme environments (-40°C to 85°C).

5. Temperature Control Module for Portable PCR Instruments

The reaction chamber in portable PCR analyzers is typically designed as a long, narrow microfluidic chip channel. The TEC1-05303’s 10×30 mm dimensions are compatible with longer microfluidic chips, and its 3.0 A current enables rapid temperature cycling within the 60–95°C range (with heating and cooling rates of up to 4–5°C/s), meeting the demands of high-throughput, rapid on-site testing.

6. Thermal Management for Rectangular Battery Packs

Rectangular battery packs used in devices such as drones and robots generate significant heat during high-current charging and discharging, and localized high temperatures accelerate aging. The TEC1-05303’s 19 W power output rapidly dissipates heat from the cell surfaces, balancing the temperature across all cells along its 30 mm length and extending cycle life.

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