🔷TEC Cooler Product Drawing

🔷Thermoelectric Cooler Peltier Basic Performance Spec

🔷Peltier Cooling Module Additional Performance Spec

🔷Peltier Effect CoolerPeltiers Performance Curve

🔷Cooler with Peltier Product Overview

The TEC1-06308 is a flagship semiconductor cooling module designed for large-area, extreme high-power-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is specifically optimized for ultra-high-power laser modules, industrial laser processing equipment, high-power electronic components, and high-performance medical equipment—all of which require large-area temperature control and can handle extremely high thermal loads.

This product is available in three crystal configurations—K10, K12, and K14—with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 7.6 V, a maximum current of 8.0 A, a maximum cooling power of 61 W, and an internal resistance of just 0.74 Ω.

The large 20×40mm rectangular package allows it to be embedded within ultra-high-power laser modules, high-power electronic equipment, and industrial equipment—while ensuring a maximum cooling temperature difference of 70°C and delivering 61W of extreme high-power cooling, the 20mm width and 40mm length provide ample heat exchange area, helping to evenly distribute cooling capacity across large-area, high-thermal-load surfaces. The core advantage of this product lies in its extremely low internal resistance design of 0.74 Ω—one of the lowest in the series—which effectively controls Joule heat loss (I²R ≈ 47.4 W) at the maximum current of 8.0 A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures rapid and uniform dissipation of the maximum heat load of 61 W across the large 40 mm × 20 mm surface area, preventing localized overheating. It comes standard with 20 AWG silicone rubber leads (100 mm in length), capable of safely handling a maximum current of 8.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, making it suitable for complex operating environments with high humidity and significant temperature fluctuations. The all-solid-state design ensures precision operation with zero noise and zero vibration, making it particularly suitable for high-precision applications with strict noise and vibration requirements.

This product is typically used in applications such as temperature control for ultra-high-power laser modules, industrial laser processing equipment, heat dissipation for high-power electronic components, high-performance medical devices, high-power communication components, and industrial sensors. It is the flagship choice for cooling applications requiring extreme ultra-high power density over large areas.

🔷Peltier Device Cooler Product Selection

🔷Peltier Module Cooler Installation and Usage Recommendations

Assembly Pressure: 2.0 kg (0.25 kg/cm²) is recommended. Large-area cooling plates require higher assembly pressure to ensure a tight fit with the heat sink and the surface being cooled, effectively reducing thermal contact resistance. It is recommended to apply a uniform layer of high-performance thermal grease (thermal conductivity > 5 W/m·K) to both surfaces, with a thickness of 0.05–0.1 mm.

Installation Orientation: The 20×40 mm rectangular TEC has a specific orientation. During installation, ensure that the 40 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.

Hot-End Heat Dissipation Requirements (Critical) : With a power dissipation of 61 W, heat generation is extremely high. It is recommended to use a large extruded aluminum heat sink measuring at least 35 × 50 × 40 mm, paired with a high-airflow fan (airflow > 20 CFM), or to employ a liquid cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the minimum achievable temperature at the cold end and the maximum cooling capacity; insufficient cooling will result in a significant decline in cooling performance or even failure.

Power Supply Requirements: Maximum voltage 7.6V, maximum current 8.0A. It is recommended to use two lithium-ion power batteries connected in series (7.4V; ensure the battery discharge capacity is ≥9A) or a regulated power supply rated at 7.6V/9A or higher. The power supply ripple should be < 50mV.

Wiring Instructions: Comes standard with 20 AWG silicone-coated wire, which is fully compatible with the 8.0A maximum current rating and can be used as is.

Current Limitation: Do not exceed 8.0A; it is recommended to connect a 9A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation, and coat the lead solder joints with conformal coating.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.