🔷Semiconductor Cooler Product Drawing

🔷TEC Peltier Module Basic Performance Spec

🔷Peltier Heater Cooler Additional Performance Spec

🔷Advanced TEC Performance Curve

🔷Thermoelectric Cooling Devices Product Overview

The TEC1-06306 is a flagship semiconductor cooling module designed for large-area, ultra-high-power, high-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is specifically optimized for high-power laser modules, industrial laser processing equipment, high-power electronic components, and medical and cosmetic devices—all of which require large-area temperature control and can handle extremely high thermal loads.

This product is available in three crystal configurations—K10, K14, and K18—with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 7.6 V, a maximum current of 6.0 A, a maximum cooling power of 46 W, and an internal resistance of just 0.99 Ω.

The large 20×40mm rectangular package allows it to be embedded within high-power laser modules, high-power electronic equipment, and industrial equipment—while ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 46W, the 20mm width and 40mm length provide ample heat exchange area, helping to evenly transfer cooling capacity to large-area, high-thermal-load surfaces. The core advantage of this product lies in its extremely low internal resistance of 0.99 Ω—the lowest in the series—which effectively controls Joule heating (I²R ≈ 35.6 W) at an ultra-high current of 6.0 A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate employs a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures rapid and uniform dissipation of the massive 46 W heat load across the large 40 mm × 20 mm surface area, preventing localized overheating. It comes standard with 22 AWG silicone-coated leads (100 mm in length), capable of safely carrying the ultra-high current of 6.0 A. Sealed with 704 silicone rubber around the perimeter, it operates in a fully solid-state, noise-free, and vibration-free manner, ensuring stable and reliable performance.

This product is typically used in applications such as temperature control for high-power laser modules, industrial laser processing equipment, heat dissipation for high-power electronic components, hot and cold probes for medical and cosmetic instruments, high-performance analytical instruments, and high-power communication devices. It is the flagship choice for applications requiring high-density cooling of extremely high power over a large area.

🔷Peltier Elements Product Applications

1. Temperature Control for High-Power Laser Modules

High-power semiconductor laser modules generate significant heat during operation, and temperature fluctuations directly affect the stability of output wavelength and power. The TEC1-06306’s 46W ultra-high cooling capacity enables efficient temperature control across the surface of a 20×40mm module, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for high-power industrial laser processing, optical communications, and LIDAR systems.

2. Temperature Control for Industrial Laser Processing Equipment

Optical components in high-power industrial laser processing equipment generate immense heat during operation, and thermal deformation can compromise processing accuracy. The TEC1-06306 provides active temperature control; its 46W ultra-high cooling capacity effectively manages the substantial heat generated during high-power laser processing, maintaining a constant temperature for optical components and ensuring processing accuracy and product quality.

3. Heat Dissipation for High-Power Electronic Devices

High-power electronic devices—such as power IGBT modules, high-power MOSFET arrays, and RF power amplifier modules—generate concentrated heat during operation; excessive temperatures can lead to performance degradation or even burnout. The TEC1-06306 can be mounted directly on the device surface; its ultra-high power of 46W provides robust active cooling, reducing core temperatures by more than 20°C and enhancing device reliability and lifespan.

4. Temperature Control for Medical and Aesthetic Equipment

The cold/hot therapy probes of high-end medical and aesthetic equipment (such as large-scale photorejuvenation devices and cryogenic hair removal devices) require large-area contact and rapid temperature response. The TEC1-06306 achieves alternating cooling and heating modes by switching the current direction; its ultra-high current of 6.0A ensures ultra-fast response, while its 46W power delivers ample cooling and heating capacity. The large 20×40mm surface area provides greater contact coverage, enhancing the user experience and treatment outcomes.

5. Temperature Control for High-Performance Analytical Instruments

Detectors in high-end scientific instruments—such as spectrophotometers, chromatographs, and thermal analyzers—generate significant heat during operation and must be maintained at a constant temperature. The TEC1-06306’s 46W power effectively dissipates the substantial heat generated by the detectors, while its large contact area ensures temperature consistency across all regions of the detector.

6. Heat Dissipation for High-Power Communication Devices

High-power communication devices such as 5G base stations, RF power amplifier modules, and high-power transmitters generate concentrated heat during operation. The TEC1-06306 can be used for active cooling of critical components; its 46W power output provides robust cooling capacity, and its 20×40mm surface area covers large heat-generating areas.

7. Temperature Control for High-Performance Sensors

High-end industrial sensors, infrared sensor arrays, and satellite remote sensing sensors generate significant heat during operation. The TEC1-06306’s 46W power output effectively dissipates the substantial heat generated by these sensors. Its large surface area provides uniform coverage across the sensor’s rear surface, eliminating temperature gradients and ensuring measurement accuracy.

🔷Thermoelectric Controller Work Principle

TEC1-06306 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 63 pairs of semiconductor grains (the “063” in the model number denotes 63 pairs), representing a medium-scale thermoelectric stack design. With a relatively large number of thermocouple pairs, it can generate a greater temperature difference and cooling capacity at the same current. The 0.4 mm-thick oxygen-free copper layer ensures uniform heat diffusion across the large 40 mm × 20 mm surface area.

When a forward DC voltage (up to 7.6 V) is applied, an ultra-high current of 6.0 A drives holes in the P-type material and electrons in the N-type material to migrate rapidly in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold junction absorbs lattice vibration energy (phonons), causing the temperature to drop rapidly, while the hot junction releases energy, causing the temperature to rise. Under the continuous drive of a strong electric field, a large amount of heat is continuously “pumped” from the cold end to the hot end, achieving rapid active cooling.

The core advantage of this product lies in its extremely low internal resistance of 0.99 Ω—the lowest in this series—which effectively controls Joule heating losses (I²R ≈ 35.6 W) under the ultra-high current of 6.0 A. Of the 46W input power, approximately 35.6W is used to overcome Joule heating and thermal conduction losses, resulting in a net cooling capacity of about 10.4W—for large-area, high-heat-load applications, this net cooling capacity is sufficient to achieve an effective temperature drop of 40–50°C, meeting the heat dissipation requirements of high-power equipment. The 7.6V voltage is highly compatible with a power supply configuration using two lithium batteries connected in series (7.4V), eliminating the need for additional step-up or step-down circuits. The 0.4mm-thick copper layer helps evenly dissipate the massive 46W heat generated at the hot end across the large 40mm × 20mm surface area, preventing localized overheating and improving heat dissipation efficiency.

This product achieves a maximum temperature difference of 70°C at a hot-end temperature of 40°C (K18 model), meaning the cold-end temperature can reach as low as approximately -30°C. Achieving this level of deep cooling under an ultra-high power input of 46W ensures balanced energy efficiency. The large 20×40mm footprint allows it to fit snugly against large-area loads, such as high-power laser modules. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.