🔷Thermal Generators Product Drawing

🔷Thermoelectric Devices Basic Performance Spec

🔷Peltier Element Cooler Additional Performance Spec

🔷Thermoelectric Generator Performance Curve

🔷Thermoelectric Cooler Product Overview

The TEC1-06308 is a flagship semiconductor cooling module designed for large-area, extreme high-power-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is specifically optimized for ultra-high-power laser modules, industrial laser processing equipment, high-power electronic components, and high-performance medical equipment—all of which require large-area temperature control and can handle extremely high thermal loads.

This product is available in three crystal configurations—K10, K12, and K14—with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 7.6 V, a maximum current of 8.0 A, a maximum cooling power of 61 W, and an internal resistance of just 0.74 Ω.

The large 20×40mm rectangular package allows it to be embedded within ultra-high-power laser modules, high-power electronic equipment, and industrial equipment—while ensuring a maximum cooling temperature difference of 70°C and delivering 61W of extreme high-power cooling, the 20mm width and 40mm length provide ample heat exchange area, helping to evenly distribute cooling capacity across large-area, high-thermal-load surfaces. The core advantage of this product lies in its extremely low internal resistance design of 0.74 Ω—the lowest in the series—which effectively controls Joule heat loss (I²R ≈ 47.4 W) at the maximum current of 8.0 A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures rapid and uniform dissipation of the maximum heat load of 61 W across the large 40 mm × 20 mm surface area, preventing localized overheating. It comes standard with 20 AWG silicone rubber leads (100 mm in length), capable of safely handling a maximum current of 8.0 A. Sealed with 704 silicone rubber around the perimeter, it operates in a fully solid-state, noise-free, and vibration-free manner, ensuring stable and reliable performance.

This product is typically used in applications such as temperature control for ultra-high-power laser modules, industrial laser processing equipment, heat dissipation for high-power electronic components, high-performance medical devices, high-power communication components, and industrial sensors. It is the flagship choice for cooling applications requiring extreme ultra-high power density over large areas.

🔷Peltier Cooler Product Features

1. Large-area symmetrical design with ample heat exchange surface area

The large 20×40 mm rectangular package provides ample heat exchange surface area, facilitating uniform heat transfer to large-area, high-thermal-load surfaces. It is suitable for medium-to-large-sized, extreme ultra-high-power temperature control equipment.

2. Extreme high-current, extreme high-power cooling with top-tier performance

With a maximum current of 8.0 A and a maximum power of 61 W, this model achieves top-tier power density cooling within its large-area package. As the most powerful flagship model in the series, it is suitable for compact devices with extremely high thermal loads.

3. Ultra-Low Internal Resistance Design for High Electrical Efficiency

With an internal resistance of just 0.74 Ω—the lowest in the entire series—Joule heat loss (I²R) at the extreme high current of 8.0 A is approximately 47.4 W. This ensures that more electrical energy is converted into effective cooling capacity rather than self-generated heat, resulting in outstanding energy efficiency.

4. Deep-Freezing Capability, Large Surface Area and Wide Temperature Difference

At a maximum ultra-high power of 61W, it achieves a maximum temperature difference of 70°C, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep freezing.

5. Three Chip Options for Flexible Adaptation

Three chip configurations are available: K10 (60°C), K12 (65°C), and K14 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.

6. Ultra-Thin Design to Save Vertical Space

With a thickness of just 3.4–3.8 mm, it maintains a slim profile even in ultra-high-power models, making it ideal for compact devices with strict vertical space constraints.

7. Excellent Power Supply Compatibility

With a maximum voltage of 7.6 V, it is highly compatible with platforms powered by two lithium-ion batteries in series (7.4 V). No complex power conversion is required, allowing direct integration into common portable device power architectures.

8. High-Quality Substrate with Excellent Large-Area Heat Dissipation

The substrate utilizes a sintering process combining 96% aluminum oxide ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The relatively thick copper layer ensures rapid and uniform distribution and efficient dissipation of the maximum heat load of 61 W across a large area of 40 mm × 20 mm.

9. Extra-Thick Leads, Safely Handling 8.0A

Comes standard with 20 AWG silicone-coated wire (100 mm in length), whose current-carrying capacity is fully matched to the maximum current of 8.0A, ensuring safe and reliable transmission of high currents with minimal voltage drop.

10. High Adaptability to Assembly Pressure

Recommended assembly pressure of 2.0 kg (0.25 kg/cm²), ensuring tight contact between the large-area cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance.

11. Sealed Protection, Strong Environmental Adaptability

Perimeter sealing with 704 silicone rubber provides excellent moisture, dust, and shock resistance, enabling operation in complex environments with high humidity and significant temperature fluctuations.

12. Bidirectional Temperature Control, Dual-Function Single Element

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

13. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision applications with strict noise and vibration requirements.

🔷Peltier Module Product Structure