🔷Solid State Cooler Product Drawing

🔷Thermoelectric Power Generator Basic Performance Spec

🔷Element Peltier Additional Performance Spec

🔷Peltier Cooling Element Performance Curve

🔷TEC Cooling System Product Overview

The TEC1-03504 is a semiconductor cooling module designed for long, narrow spaces and high-power, high-density cooling. With dimensions of 10 × 20 mm and a long, narrow, asymmetrical package design, it is optimized for compact devices that require a layout extending in a single direction—such as laser tube housings, beauty devices, and bar-shaped sensors—enabling high-density active cooling within limited, elongated spaces.

This product is available in three chip configurations—K10, K12, and K14—with thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 4.2 V, a maximum current of 4.0 A, a maximum cooling power of 17 W, and an internal resistance of just 0.82 Ω.

The 10×20 mm elongated package allows it to be easily embedded into narrow, elongated spaces such as the side of a laser tube housing, the interior of a beauty device handle, or a strip-shaped sensor module—while ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 17 W, it provides a 20 mm coverage range along the length and is only 10 mm wide, offering an ideal contact area for elongated heat sources. The ultra-low internal resistance of 0.82Ω results in Joule heating loss (I²R ≈ 13.1W) at a high current of 4.0A that is significantly lower than that of comparable products; more electrical energy is converted into effective cooling capacity, delivering outstanding energy efficiency. This product utilizes a sintering process combining 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper. The relatively thick copper layer provides superior thermal diffusion capabilities, ensuring rapid and uniform dissipation of the 17W heat load. It comes standard with 24 AWG silicone-coated leads (100 mm in length), capable of safely carrying a 4.0A operating current. It features a 704 silicone rubber perimeter seal, ensuring fully solid-state operation with zero noise and vibration.

This product is typically used in applications such as temperature control for high-power semiconductor laser tubes, hot and cold probes for professional beauty devices, temperature regulation for industrial-grade bar-shaped sensors, and high-performance micro-laser modules. It is the ideal choice for high-power temperature control requirements in long, narrow, and compact spaces.

🔷Thermoelectric Cooling Device  Product Selection

🔷Thermoelectric Cooling Element Operation Principle

TEC1-03504 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 35 pairs of semiconductor grains (the “035” in the model number denotes 35 pairs), making it a medium-scale thermoelectric stack design. The oxygen-free copper layer is 0.4 mm thick—thicker than the 0.2 mm copper layer found in other models in the same series—providing superior thermal diffusion capabilities.

When a forward DC voltage (maximum 4.2 V) is applied, a high current of 4.0 A drives holes in the P-type material and electrons in the N-type material to migrate rapidly in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop rapidly, while the hot-end node releases energy, causing the temperature to rise. Under the continuous drive of a strong electric field, a large amount of heat is continuously “pumped” from the cold end to the hot end, achieving rapid active cooling.

The core advantage of this product lies in its ultra-low internal resistance design of 0.82 Ω. Among the entire product line, the TEC1-03504 has the lowest internal resistance, which means that the Joule heating loss (I²R ≈ 13.1 W) at a high current of 4.0 A is significantly lower than that of other products in the same power class, allowing more electrical energy to be converted into effective cooling capacity. Of the 17W input power, approximately 13W is used to overcome Joule heating and thermal conduction losses, resulting in a net cooling capacity of about 4W—which is sufficient to achieve an effective temperature drop of 30–40°C for long, slender heat loads. The 0.4 mm thick copper layer helps evenly dissipate the 17 W of heat from the hot end along the 20 mm length, preventing localized overheating.

This product achieves a maximum temperature difference of 70°C (Model K14) when the hot-end temperature is 40°C, meaning the cold end can reach as low as approximately -30°C. The 10 × 20 mm elongated design allows it to fit snugly along the length of high-power laser tube housings or bar-shaped heating elements. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load, ensuring that the high-power cooling capacity is fully utilized.