The TEC1-03503 is a semiconductor cooling module designed for precision temperature control in elongated spaces with moderate power requirements. Measuring 10 × 20 mm, it features a long, asymmetrical package design optimized for compact devices—such as laser tube housings, beauty devices, and bar-shaped sensors—that require a layout extending in a single direction, enabling active temperature management within irregular, confined spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Peltier Module Cooler Product Drawing

🔷Peltiers Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-03503 | K10 | 60 | 1.09 | 4.2 | 3.0 | 13 | 10×20×3.0 |
| TEC1-03503 | K14 | 65 | 1.09 | 4.2 | 3.0 | 13 | 10×20×3.4 |
| TEC1-03503 | K18 | 70 | 1.09 | 4.2 | 3.0 | 13 | 10×20×3.8 |
🔷Thermoelectric Peltier Device Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 24 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 0.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Device Performance Curve

🔷Thermoelectric Module Product Overview
The TEC1-03503 is a semiconductor cooling module designed for precision temperature control in elongated spaces with moderate power requirements. Measuring 10 × 20 mm, it features a long, asymmetrical package design optimized for compact devices—such as laser tube housings, beauty devices, and bar-shaped sensors—that require a layout extending in a single direction, enabling active temperature management within irregular, confined spaces.
This product is available in three crystal configurations—K10, K14, and K18—with thicknesses of 3.0 mm, 3.4 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 4.2 V, a maximum current of 3.0 A, a maximum cooling power of 13 W, and an internal resistance of 1.09 Ω.
The 10×20 mm elongated package allows it to be easily embedded into narrow, elongated spaces such as the side of a laser housing, the interior of a beauty device handle, or a bar-shaped sensor module—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 13 W, it provides a 20 mm coverage range along the length and is only 10 mm wide, offering an ideal contact area for elongated heat sources. This product utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The thicker copper layer provides superior thermal diffusion, helping to evenly distribute heat at the hot end and rapidly dissipate it. It comes standard with 24 AWG silicone rubber leads (100 mm in length) that can safely carry a 3.0 A operating current; the flexible leads facilitate wiring in narrow, elongated spaces. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, making it suitable for a variety of complex operating environments. The all-solid-state structure ensures precise operation with zero noise and zero vibration.
This product is typically used in applications such as temperature control for semiconductor laser casings, cold/hot therapy probes for beauty devices, temperature maintenance for strip-shaped sensors, temperature control modules for portable PCR instruments, and micro-laser modules. It is an ideal choice for medium-power temperature control requirements in long, narrow, and compact spaces.
🔷Thermoelectric Peltier Product Applications
1. Temperature Control for Semiconductor Laser Casing
Semiconductor laser (LD) casings are typically elongated. Heat generation is concentrated inside the casing, and the casing is highly temperature-sensitive—a temperature fluctuation of just 1°C can cause a wavelength drift of approximately 0.3 nm, severely affecting communication quality. The 10×20 mm elongated dimensions of the TEC1-03503 allow it to fit perfectly against the side of a standard laser housing, providing uniform temperature control coverage along the length of the housing. Its 13 W power rating enables rapid response to thermal shock during laser startup, stabilizing the laser temperature within ±0.05°C of the setpoint and ensuring stable output wavelength and power.
2. Cold/Hot Therapy Probes for Beauty Devices
Cold and hot therapy probes for home-use and professional beauty devices (such as photorejuvenation devices and radiofrequency beauty devices) typically feature a long, strip-shaped contact surface that must be in close contact with the skin during operation. The TEC1-03503 can be embedded inside the probe and switches between two modes—cold therapy (to shrink pores and soothe the skin) and heat therapy (to promote absorption and accelerate circulation)—by reversing the current direction. Its 13W power ensures rapid attainment of the set temperature (5–10°C for the cold end and 40–45°C for the heat end), enhancing the user experience.
3. Temperature Control for Rectangular Sensors
For elongated detection elements such as spectrometer sensor arrays and rectangular CCD/CMOS image sensors, the temperature consistency across individual pixels directly affects detection accuracy. The TEC1-03503 uniformly covers the back of the sensor along its length, eliminating temperature gradients and controlling the temperature difference between pixels to within ±0.1°C, thereby improving measurement accuracy.
4. Temperature Control Module for Portable PCR Instruments
The reaction chamber of portable PCR instruments is typically designed as a long, narrow microfluidic chip channel (standard 10 × 20 mm dimensions). The TEC1-03503 is perfectly sized to match microfluidic chips. With a current of 3.0 A, it enables rapid temperature cycling within the 60–95°C range (heating and cooling rates of up to 4–5°C/s). Paired with a 4.2 V lithium battery, it meets the demands of rapid on-site testing.
5. Micro-Laser Modules and LIDAR Systems
Devices such as laser emitter modules and micro-laser projectors in vehicle-mounted LIDAR systems have narrow, elongated internal spaces, and the laser chips generate significant heat during operation. The TEC1-03503 can be embedded inside the module to provide active temperature control for the laser chips, ensuring detection accuracy under extreme environmental conditions (-40°C to 85°C).
6. Thermal Management for Prismatic Battery Packs
Prismatic battery packs (such as 18650 cell arrays) in devices like drones and robots experience uneven heat distribution during charging and discharging, with localized high temperatures accelerating aging. The TEC1-03503 can be mounted on the side of the battery pack; its 13W power output effectively balances the temperature of each cell, extending cycle life.
🔷TEG Module Product Show



The TEC1-03504 is a semiconductor cooling module designed for long, narrow spaces and high-power, high-density cooling. With dimensions of 10 × 20 mm and a long, narrow, asymmetrical package design, it is optimized for compact devices that require a layout extending in a single direction—such as laser tube housings, beauty devices, and bar-shaped sensors—enabling high-density active cooling within limited, elongated spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03502 is a semiconductor cooling module designed for long, narrow spaces and low-power precision temperature control. With dimensions of 10 × 20 mm and a long, narrow asymmetric package design, it is optimized for compact devices that require a layout extending in a single direction—such as laser tube housings, beauty devices, and bar-shaped sensors—enabling active temperature management within irregular, confined spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-03501 is a semiconductor cooling module designed for precision temperature control in elongated spaces with moderate power requirements. With dimensions of 10 × 20 mm and a long, asymmetrical package design, it is optimized for compact devices that require a layout extending in a single direction—such as laser tube housings, beauty devices, and bar-shaped sensors—enabling active temperature management within irregular, confined spaces. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw