🔷Peltier Module Product Drawing

🔷TEC Cooler Basic Performance Spec

🔷Thermoelectric Cooler Peltier Additional Performance Spec

🔷Peltier Cooling Module Performance Curve

🔷Peltier Effect CoolerPeltiers Product Overview

The TEC1-03502 is a semiconductor cooling module designed for long, narrow spaces and low-power precision temperature control. With dimensions of 10 × 20 mm and a long, narrow asymmetric package design, it is optimized for compact devices that require a layout extending in a single direction—such as laser tube housings, beauty devices, and bar-shaped sensors—enabling active temperature management within irregular, confined spaces.

This product is available in three crystal configurations—K12, K16, and K20—with thicknesses of 3.2 mm, 3.6 mm, and 4.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 4.2 V, a maximum current of 2.2 A, a maximum cooling power of 9 W, and an internal resistance of 1.49 Ω.

The 10×20 mm elongated package allows it to be easily embedded into narrow, elongated spaces such as the side of a laser tube housing, the interior of a beauty device handle, or a bar-shaped sensor module—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 9 W, it provides a 20 mm coverage range in the longitudinal direction and is only 10 mm wide, offering an ideal contact area for elongated heat sources. This product utilizes a sintering process combining 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper; the thicker copper layer provides superior thermal diffusion, helping to evenly distribute heat at the hot end and rapidly dissipate it. It comes standard with 26 AWG silicone leads (100 mm in length); the flexible leads facilitate wiring in narrow, elongated spaces. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, making it suitable for a variety of complex operating environments. The all-solid-state structure ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for semiconductor laser casings, cold/hot therapy probes for beauty devices, temperature maintenance for strip-shaped sensors, temperature control modules for portable PCR instruments, and micro-laser modules. It is an ideal choice for low-power temperature control requirements in long, narrow, and compact spaces.

🔷Cooler with Peltier Work Principle

TEC1-03502 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 35 pairs of semiconductor grains (the “035” in the model number denotes 35 pairs), representing a medium-scale thermoelectric stack design that achieves a good balance between cooling capacity and power consumption. The oxygen-free copper layer is 0.4 mm thick—thicker than the 0.2 mm copper layer found in other models of the same series—providing superior thermal diffusion capabilities.

When a forward DC voltage (up to 4.2 V) is applied, a 2.2 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As the charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

This product achieves a maximum temperature difference of 70°C (K20 model) when the hot end temperature is 40°C, meaning the cold end can reach as low as approximately -30°C. Achieving such deep cooling with a low input power of 9W demonstrates excellent energy efficiency. The low power consumption of 9W results in minimal heat generation from the cooling module itself, reducing the demands on the heat dissipation system—a small extruded aluminum heat sink is sufficient to meet heat dissipation requirements. The 10×20 mm elongated design allows it to fit snugly along the length of a laser tube or bar-shaped sensor. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load, thereby enhancing actual cooling efficiency.

🔷Peltier Device Cooler Product Packaging

I. Basic Performance Verification

1. Visual Inspection

Check whether the product’s outer packaging is intact, whether the ceramic substrate of the cooling plate has any cracks or chipped corners, and whether the leads are damaged. Impact or drops during transportation may cause hidden cracks, leading to a decline in performance.

2. AC Resistance (ACR) Measurement

Use a milliohm meter or DC bridge to measure the product’s internal resistance using the four-wire measurement method. The nominal internal resistance of the TEC1-03502 is 1.49 Ω (see parameter table); the measured value should fall within ±5% of the nominal value. Resistance is the most direct indicator of whether internal grains are fractured or damaged—if the measured resistance is significantly higher (e.g., more than 30% above the nominal value), it can generally be determined that an internal open circuit exists, and the supplier should be contacted promptly for resolution.

II. Key Process Control

Improper installation is a common cause of TEC performance degradation. After installation is complete, it is recommended to measure the ACR value again in a constant-temperature environment of 25°C and compare it with the value measured upon receipt:

Change ≤ 5%: This is generally considered to indicate damage-free installation, and the unit can proceed to full-system testing without concern;

Change > 5%: Internal micro-cracks may be present. It is recommended to check whether the installation pressure was excessive, whether the contact surfaces are flat, and whether the screws were overtightened during installation.

III. Full-System Functional Validation

After passing the resistance measurement, cooling performance must also be verified under actual operating conditions. The industry-standard test method is the temperature difference performance test (ΔTmax), with the specific procedure as follows:

Test Environment: Maintain an ambient temperature of 24–26°C and relative humidity of 42%–48% to ensure stable test conditions;

Installation Conditions: Install the TEC on a standard test fixture; the hot side should be paired with a standard heat sink, and a copper thermal load may be attached to the cold side;

Power-On Test: Apply the rated current (2.2 A) at a voltage of approximately 4.2 V; once the temperature stabilizes, record the temperature difference between the hot and cold ends;

Acceptance Criteria: The measured maximum temperature difference should deviate by no more than ±10% from the nominal value (70°C for K20 crystals); a common acceptance criterion is that the measured value must be no less than 95% of the nominal value.

IV. Reliability Testing (Optional)

For applications with high long-term reliability requirements, such as medical and telecommunications, it is recommended to conduct reliability assessments in accordance with industry standards. In China, reference can be made to SJ/T 10135-2010 “General Specifications for TEC1 Series Thermoelectric Cooling Modules” or the group standard T/UNP 733-2025 “Test Methods for Semiconductor Thermoelectric Cooling Devices (TEC).” The optical communications industry typically follows the GR-468 standard, with key test items including:

Temperature Cycling: Alternating cycles between -40°C and +85°C to evaluate the device’s resistance to thermal fatigue;

High-temperature storage: 2,000 hours at 85°C to evaluate the material’s heat resistance;

Mechanical vibration/shock: Simulates mechanical stress during transportation and use;

Power cycling: Simulates the impact of frequent power on/off cycles on the device’s durability.

The ACR value must be measured both before and after reliability testing; if the change exceeds 5%, the test is typically deemed a failure.