English
Refrigerated dehumidifying thermoelectric cooling modules, with their compact size, high-efficiency cooling and dehumidification capabilities, and stable performance, have become the core components for humidity and temperature control in small refrigeration equipment. They are widely used in various small-scale refrigeration and dehumidification applications—including household, medical, and outdoor settings—providing reliable environmental protection for item storage. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The structure and functions of each part of the semiconductor cooling sheet
I. Core functional unit: PN semiconductor p-n junction pair
This is the core component for achieving the cooling effect, consisting of pairs of P-type semiconductor and N-type semiconductor, usually with bismuth telluride (Bi₂Te₃) as the base material:
P-type bismuth telluride semiconductor: Formed by doping tellurium sulfide (Sb₂Te₃), with "holes" as the main carrier, and current moves directionally through holes to absorb heat;
N-type bismuth telluride semiconductor: Made by doping bismuth selenide (Bi₂Se₃), with free electrons as the carrier, and having a higher electron mobility, responsible for heat transfer;
Structural design: Each single cooling sheet contains tens to hundreds of pairs of PN junctions, arranged in a matrix, designed with "electrical series connection and thermal parallel connection", ensuring continuous current conduction and enhancing heat transfer efficiency.
II. Structural support and insulation layer:
Ceramic substrate As the "framework" of the cooling sheet, it adopts a double-layer symmetrical design, sandwiched at the outermost layer of the entire structure, with the following core characteristics and functions:
Main materials: Al₂O₃ ceramic (with a temperature resistance of >160℃), for high-end scenarios, AlN ceramic is used, with better thermal conductivity;
Three main functions: ① Mechanical support: Fixing the internal PN junctions and the metal connection structure to ensure the stability of the overall structure;
② Electrical insulation: Isolating the external circuit from the internal conductive components to avoid short-circuit risks;
③ Heat conduction channel: Quickly conducting heat between the cold and hot surfaces, reducing thermal resistance.
III. Current Distribution and Heat Conduction Layer: Metal Conductors
1. Located between the ceramic substrate and the PN junction pair, it serves as the key carrier for transmitting both electrical and thermal signals:
2. Metal Current Distributor: Primarily made of copper or copper alloys, it boasts high electrical conductivity and thermal conductivity. Its functions include:
① Connecting adjacent PN semiconductors in series to form a closed circuit;
② Distributing the input current evenly to each pair of junctions to prevent local current concentration;
③ Transferring the heat generated by the PN junction pair to the ceramic substrate;
3. Auxiliary Connection: Some high-end products use gold-tin or indium-tin solder paste for welding, enhancing connection stability and thermal efficiency, and reducing contact thermal resistance.
IV. Auxiliary Components and Integrated Design Apart from the core components, the practical application of the cooling chip also relies on the following auxiliary structures:
1. Electrode Terminal: Located at the edge of the ceramic substrate, it is connected to the external DC power supply through metal pins or pads, providing current input for the entire junction array;
2. Packaging Protection: Some products use silicone grease at the edge to prevent moisture intrusion and mechanical damage, extending the service life;
3. Multi-layer Composite Optimization: Large-power cooling chips adopt a multi-layer junction array stacking design to further increase cooling capacity, while optimizing the thickness of the ceramic substrate (typically 0.5-1mm) to balance thermal conductivity and mechanical strength.
40×16×3.0mm semiconductor cooling plate, a long, narrow micro-TEC designed for narrow spaces and elongated mounting locations 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
This size of cooling plate is a large-area, ultra-thin industrial-grade thermoelectric module capable of rapidly achieving deep cooling. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The design and operating principle of thermoelectric coolers make them an ideal solution for compact, precise, and vibration-free temperature control (cooling/heating). 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
When the Paltier refrigerator dimensions are 15×60×3.45mm (length×width×height), its characteristics retain the core properties of semiconductor thermal pads while exhibiting the following differentiated features due to dimensional changes (narrower, longer, and extremely thin) 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
12*20*3.1mm Refrigeration Dehumidification Peltier Module, a miniature semiconductor cooling device specifically engineered for dehumidification applications in compact refrigeration equipment. Its compact and space-saving design ensures compatibility with various small-scale refrigeration and fresh-keeping appliances. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
35*76*4.2mm Laser Communication Semiconductor Heat Sink is a dedicated air-cooled thermal management component engineered specifically for semiconductor core devices in laser communication equipment (such as laser diodes, semiconductor optical amplifiers, photodetectors, etc.). Its core function is to rapidly absorb and dissipate heat generated during the operation of laser communication devices, ensuring stable device performance and communication accuracy. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
55*55*4.15mm semiconductor air-cooled heat sink achieves core advantages of “rapid heat absorption, high thermal conductivity, and efficient heat dissipation” through its high-thermal-conductivity material, optimized bonding design, and fin structure. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
Get A Free Quote
