🔷Peltier Module Product Drawing

🔷TEC Cooler Basic Performance Spec

🔷Thermoelectric Cooler Peltier Additional Performance Spec

🔷Peltier Cooling Module Performance Curve

🔷Peltier Effect CoolerPeltiers Product Overview

The TEC1-25506 is a top-of-the-line industrial semiconductor cooling module designed for extremely large areas and extreme high-power-density cooling. Measuring 40 × 80 mm, it features an extra-large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. Optimized for industrial laser modules operating at extreme power levels, large-scale high-power industrial equipment, high-performance medical devices, and other applications requiring extensive area temperature control and handling extremely high thermal loads, it is the most powerful flagship model in this series.

This product is available in three chip configurations—K10, K14, and K18—with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 30.6 V, a maximum current of 6.0 A, a maximum cooling power of 184 W, and an internal resistance of just 3.98 Ω.

The extra-large 40×80mm rectangular package allows it to be embedded inside extreme-power laser modules, large industrial equipment, and other applications—while ensuring a maximum cooling temperature difference of 70°C and extreme-power cooling of 184W, the 40mm width and 80mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling to the surface of very large loads. This product features a drive design rated for 30.6V high voltage and 6.0A current, making it highly compatible with common industrial power supplies (30V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 3.98Ω—one of the lowest in this series—Joule heat loss (I²R ≈ 143.3W) at 6.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 80 mm × 40 mm surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (200 mm in length), capable of safely handling the high current of 6.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 8.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for high-power industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density over very large surface areas.

🔷Cooler with Peltier Product Applications

1. Temperature Control for Extreme Ultra-High-Power Industrial Laser Modules

Extreme ultra-high-power industrial semiconductor laser modules generate a significant amount of heat during operation. The TEC1-25506’s 184W extreme ultra-high-power cooling capacity enables efficient temperature control across an extra-large 40×80mm area, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for extreme ultra-high-power laser processing, optical communications, and LIDAR systems.

2. Heat Dissipation for Large Industrial Equipment

High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-25506 can be mounted directly on the component surface; its 184W extreme ultra-high-power cooling capacity provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and service life.

3. Temperature Control for High-Performance Medical Equipment

High-end medical imaging equipment and large-scale in vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-25506 provides robust cooling capacity thanks to its large coverage area, maintenance-free operation, and stable performance.

4. Heat Dissipation for High-Power Communication Base Stations

High-power communication devices, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-25506 can be used for active cooling, and its 30.6V operating voltage is fully compatible with communication equipment power platforms.

🔷Peltier Device Cooler Operation Principle

The TEC1-25506 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal lead frames to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive ceramic substrates. With 255 pairs of crystals, this is an ultra-large-scale thermopile design featuring an extremely high number of thermocouple pairs, capable of generating a significant temperature difference and cooling capacity at moderate current levels.

When a forward DC voltage (up to 30.6 V) is applied, a high current of 6.0 A drives carriers to exchange energy at the PN junction interface—the cold end absorbs phonon energy and cools, while the hot end releases energy and heats up. Heat is continuously “pumped” from the cold end to the hot end.

The ultra-low internal resistance of 3.98 Ω is a core advantage of this product, effectively controlling Joule heating loss (I²R ≈ 143.3 W) at a high current of 6.0 A. The 0.4 mm thick copper layer helps evenly dissipate the high heat load of 184 W across the ultra-large 80 mm × 40 mm surface area. This product achieves a maximum temperature difference of 70°C at a hot end temperature of 40°C (K18 model), while the cold end can reach as low as approximately -30°C.