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🔷TEC Peltier Basic Performance Spec

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🔷Thermoelectric Cooler Module Performance Curve

🔷Thermoelectric Peltier Module Product Overview

The TEC1-25503 is an industrial-grade semiconductor cooling module designed for cooling applications requiring extremely large surface areas, high power, and high voltage density. With dimensions of 40 × 80 mm, it features an extra-large, rectangular, symmetrical package design that provides an exceptionally large heat exchange area. It is optimized for large industrial equipment, ultra-high-power laser modules, medical imaging equipment, communication base stations, and other devices that require temperature control over a very large area and handle high thermal loads.

This product is available in three crystal configurations—K12, K24, and K36—with thicknesses of 3.6 mm, 4.8 mm, and 6.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 30.6 V, a maximum current of 3.0 A, a maximum cooling power of 92 W, and an internal resistance of 7.96 Ω.

The extra-large 40×80 mm rectangular package allows it to be embedded within large industrial equipment, ultra-high-power laser modules, and similar applications. While ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 92W, the 40 mm width and 80 mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large loads. This product features a drive design rated at 30.6V and 3.0A, making it highly compatible with common industrial power supplies (30V) and telecommunications equipment power platforms, eliminating the need for complex power conversion. The 7.96Ω internal resistance provides excellent current control sensitivity, enabling the drive circuit to achieve precise constant-current regulation and thereby deliver stable temperature control. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 80 mm × 40 mm extra-large surface area, preventing localized hot spots. It comes standard with 22 AWG silicone rubber leads (200 mm in length), capable of safely carrying a 3.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 8.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and shocks in industrial environments.

This product is typically used in applications such as temperature control for large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, and heat dissipation for telecommunications base station equipment. It is the ideal choice for high-power, high-voltage-density cooling requirements in applications with extremely large surface areas.

🔷Cooling Module Product Applications

1. Temperature Control for Large Industrial Laser Modules

Large industrial semiconductor laser modules generate significant heat during operation, and temperature fluctuations directly affect the stability of output wavelength and power. The TEC1-25503’s 40×80 mm extra-large surface area is compatible with the packaging of large laser modules, providing uniform temperature control coverage along the 80 mm length. Its high power of 92 W enables rapid response to thermal shock during laser startup, ensuring the stability of output wavelength and power.

2. Temperature Control for Medical Imaging Equipment

Core sensors and detectors in large medical imaging equipment (such as CT scanners, MRI auxiliary temperature control systems, and PET detectors) require a strictly controlled, constant-temperature environment to ensure imaging quality. The TEC1-25503 provides a large-area, low-noise, vibration-free temperature control solution. Its 40×80 mm surface area can cover large detector arrays, its 92 W power effectively manages heat generated by the detectors themselves, and its 30.6 V voltage is compatible with power supply platforms commonly used in medical equipment.

3. Temperature Control for Large Analytical Instruments

Detectors in scientific instruments such as large spectrophotometers, chromatographs, and thermal analyzers must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-25503 provides a stable, constant-temperature environment. Its 92W power rating effectively manages the heat generated by the detectors themselves, while its extra-large coverage area ensures temperature consistency across all regions of the detector. Its vibration-free, noise-free solid-state operation is well-suited for noise-sensitive laboratory environments.

4. Temperature Control for Communication Base Station Equipment

Critical chips and power modules in large communication base stations and data center switching equipment generate concentrated heat during operation. The TEC1-25503 can be used for active cooling of critical components. Its 30.6V voltage is fully compatible with common power supply platforms in telecommunications equipment, its 40×80mm surface area covers large heat-generating areas, and its 92W power output meets the cooling demands of high-power base station equipment.

5. Temperature Control for Industrial Laser Processing Equipment

Optical components in large industrial laser processing equipment are subject to thermal deformation during operation, which affects processing accuracy. The TEC1-25503 provides active temperature control; its high power rating of 92W effectively manages the substantial heat generated during high-power laser processing, maintaining a constant temperature for optical components and ensuring processing accuracy. A high assembly pressure of 8.0 kg ensures a tight seal between the extra-large cooling plate and the heat sink, making it suitable for the vibrations and shocks typical of industrial environments.

6. Temperature Control for Large Medical Diagnostic Equipment

Reaction modules in large medical devices, such as in vitro diagnostic (IVD) equipment and chemiluminescence analyzers, require a strictly controlled, constant-temperature environment. With its large coverage area, maintenance-free operation, and stable performance, the TEC1-25503 is well-suited to meet the demands of medical equipment for long-term reliability and large-area temperature control.

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