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TEC1-24103 80*80mm Peltier Module for thermoelectric cooling assembly applications. Designed for high-efficiency temperature control, electronics cooling, industrial cooling and OEM thermoelectric cooling solutions. 🟧 Price List Contact Customer Service 🟦 Product PDF Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
| Type Mode | Chip | ▲Tmax(°C) | ACR ohm(Ω) | Umax(V) | Imax(A) | Pmax(W) | Size(mm) |
|---|---|---|---|---|---|---|---|
| TEC1-24103 | K32 | 60 | 80x80x5.2 | ||||
| K38 | 65 | 7.54 | 29 | 3 | 87 | 80x80x6.2 | |
| K44 | 70 | 80x80x6.8 |
| Specification Item | Description |
|---|---|
| Substrate | 96% Alumina 0.76mm + Oxygen-Free Copper 0.4mm, sintered process |
| Lead Wire | Extra-soft silicone wire, 20 AWG, L = 300mm |
| Terminal | Standard product without terminals; can be installed upon request |
| Assembly Pressure | 16 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealing Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
The TEC1-24103 Peltier Module 80*80mm is a large-size thermoelectric cooling module designed for applications that require reliable solid-state cooling and temperature control.
Unlike traditional compressor-based refrigeration systems, a Peltier module has no compressor or refrigerant. It produces a temperature difference through the thermoelectric effect when DC power is applied.
The 80*80mm module format provides a relatively large thermal contact area, making it suitable for integration into larger cooling structures and thermoelectric cooling assembly solutions.
The module can be combined with heat sinks, fans, cold plates and temperature controllers to build a complete thermoelectric cooler assembly for different applications.
The 80*80mm structure provides a large thermal contact area and can be used for applications requiring a larger cooling surface.
The Peltier module has no mechanical compressor and uses the thermoelectric effect to achieve cooling, making it suitable for compact and solid-state cooling systems.
The module can be integrated with heat sinks, cold plates, fans and other thermal components to create a complete thermoelectric cooling assembly module.
By controlling the electrical input, the module can be integrated into temperature control systems for localized cooling applications.
The TEC module can be used as a core cooling component in customized OEM thermoelectric cooling assembly solutions.
The module can be used in industrial cooling, electronics cooling, optical equipment, laboratory equipment and other temperature-control applications.
The TEC1-24103 80*80mm Peltier Module can be integrated into various thermoelectric cooling assembly systems.
Used in industrial equipment requiring localized cooling and temperature stabilization.
Suitable for cooling electronic components and assemblies where localized temperature control is required.
A Peltier cooling assembly can be used to help control the operating temperature of laser and optical components.
Thermoelectric cooling modules can be integrated into semiconductor equipment for precise temperature management.
The module can be incorporated into optical equipment where temperature stability is important.
Suitable for laboratory instruments and test equipment requiring controlled cooling.
The module can be combined with sensors and controllers to form a thermoelectric cooling system for precision temperature control.
The TEC1-24103 can also serve as a cooling component in customized thermoelectric cooling assembly solutions developed for OEM equipment.
The TEC1-24103 Peltier Module works based on the Peltier effect.
When direct current passes through the thermoelectric semiconductor elements inside the module, heat is transferred from one ceramic surface to the opposite surface.
As a result:
One side becomes cold → absorbs heat from the target object
The other side becomes hot → releases absorbed heat + electrical input heat
Therefore, a Peltier module cannot achieve good cooling performance by itself. The heat generated on the hot side must be efficiently removed.
A typical thermoelectric cooling assembly can therefore be understood as:
DC Power → Peltier Module → Cold-Side Cooling → Thermal Load Transfer → Hot-Side Heat Dissipation
The quality of the complete assembly depends not only on the TEC module but also on the heat sink, thermal interface, airflow, temperature control and system design.
The TEC1-24103 is an 80*80mm Peltier thermoelectric cooling module designed for integration into thermoelectric cooling and temperature-control systems.
80*80mm refers to the main external dimensions of the Peltier module. The detailed thickness and other dimensional specifications should be confirmed according to the product drawing.
Yes. The module can be integrated with heat sinks, cold plates, fans, controllers and other components to create a complete thermoelectric cooling assembly.
Yes. The hot side needs an effective heat dissipation system. A suitable heat sink, fan or liquid cooling system may be required depending on the application.
It can be considered for industrial cooling, electronics cooling, laser cooling, semiconductor temperature control, optical equipment, laboratory equipment and other thermoelectric cooling applications.
Customized thermoelectric cooling assembly solutions can be developed according to application requirements such as cooling capacity, operating temperature, installation dimensions, heat dissipation method and control requirements.
Yes. The TEC1-24103 can be used as a core component in OEM thermoelectric cooling assembly projects. Customers can provide their application requirements for product selection and system design.
The selection should consider the required cooling capacity, target temperature, hot-side temperature, electrical operating conditions, heat dissipation capacity and installation space. Choosing a TEC module only by size is generally not enough.
The suitability depends on the actual thermal load and system heat dissipation design. For higher cooling loads, the complete high power thermoelectric cooling assembly should be evaluated as a system rather than looking at the TEC module alone.
As a professional thermoelectric cooling product supplier, we can provide thermoelectric cooling assembly, Peltier module and customized cooling solutions for OEM, wholesale and industrial applications.
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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